GD25WDxxK6 SPI NOR Flash product series, using 1.2mm×1.2mm USON6 ultra-small plastic package, the maximum thickness is only 0.4mm, in such a compact, thin space, its power consumption, voltage range and other areas have been further improved. Ideal for consumer electronics, wearables, the Internet of Things, and portable health monitoring devices where battery life and compact design are critical.
Onsemi's NCL31010 now integrates two components into a single package, making a single luminaire part of a fully connected and managed lighting system and enabling many other functions.
AMS announced the launch of a 2.2 megapixel global shutter visible and near infrared (NIR) image sensor, the Mira220, which features the low power consumption and small size required by the latest 2D and 3D sensing systems for virtual reality (VR) headsets, smart glasses, drones and other consumer and industrial applications.
NSi66x1A and NSi6601M, two new single-channel isolated grid drivers, are both released. They are both suitable for driving SiC, IGBT and MOSFET power tubes. They have both car specification (meeting THE AEC-Q100 standard) and work specification, and are widely used in new energy vehicles, air conditioning, power supply, photovoltaic and other application scenarios.
Utilize the ADC EV10AQ190's crosspoint switching characteristics and state-of-the-art low-frequency noise performance for software-defined instrumentation Moku:Pro
Qualcomm launched the Snapdragon W5+ and Snapdragon W5 platforms for the next generation of wearable devices, achieving a comprehensive jump. The new platform is designed to bring ultra-low power consumption and breakthrough performance to the next generation of connected wearables by delivering long-lasting battery life, a premium user experience and innovative thin and light designs.
To support customers with a wider range of applications, Harwin has added another option to its popular Datamate family of High Reliability (Hi-rel) connectors. When used with the existing Datamate J-Tek connector series (complete with locking screws for safe installation), the board-to-board height is 7.3mm. The new female connector is capable of providing a significantly larger 17.15 mm connection height, which provides more space between PCBS, giving designers the flexibility to use larger onboard components or for wiring
The unique pumping unit design of the new multistage Roots pump ACP 90 can withstand frequent empties, enhancing pump durability
Ruzhuoli announced the release of advanced integrated thermal management system development board, the development board uses a distributed control architecture, easy to configure, can provide high efficiency and high flexibility of the solution, mainly for electric vehicles and other applications, can help customers to achieve the required integrated thermal management system.
Stmicroelectronics' FingerTip FTG2-SLP touchscreen controller supports synchronous and asynchronous display working modes, enabling Oems to maintain a seamless interactive experience even as refresh rates change dynamically. The controller is also ideal for smartphones with flexible AMOLED displays, where the touch pad is integrated directly into the OLED light-emitting layer, making the phone very thin.
Mouser now offers the AS7050 medical and health sensor from ams OSRAM. The sensor gives design engineers next-generation biosignal conversion for various applications, including smart devices; heart rate, ECG and PPG monitoring; optical sensor platforms; wearables and more.
HDP4 series products conform to CRPS standards and are suitable for 3kW server modules, which can meet different application scenarios such as parallel and vertical goldfinger and printed board, and are widely used for transmission of high-current-carrying power supply and low-frequency signal on server platforms.
Transphorm, Inc. (Nasdaq: TGAN), a pioneer and global provider of highly reliable, high-performance gallium nitride (GaN) power conversion products, today announced the addition of TP65H050G4BS devices that expand its surface-mount package product line. The new high power surface mount device (SMD) is a 650V SuperGaN® field effect transistor (FET) in a to-263 (D2PAK) package with a typical conduction impedance of 50mOhm. The TP65H050G4BS is Transphorm's seventh SMD and enriches current PQFN devices for low to medium power applications.
Siemens launched the Symphony Pro platform, which greatly expands the verification capabilities of mixed-signal ICs. The advanced mixed-signal simulation platform can accelerate mixed-signal verification and help increase production efficiency by up to 10 times. Symphony Pro supports Accellera and other advanced digital verification methodologies. for today's leading-edge mixed-signal design
"As smartphones become more feature-rich, the form factor has become a differentiating feature for consumers," said Honor CEO George Zhao. "NXP's FEM solution allows us to overcome the growing complexity and challenges of flagship mobile phone design, while still delivering longer range and improved Wi-Fi 6 signal quality."
Mouser now stocks the RZ/V2L AI microprocessors from Renesas Electronics. Ideal for engineers looking for a cost-efficient AI solution, the devices provide entry-level AI while offering several robust features found with its predecessor, the RZ/V2M, comprising best-in-class power efficiency and high-precision AI acceleration.
TDK Group has launched the new EPCOS B72314S2* series (AdvanceD S14 Compact) lead-type varistors. The new family of components covers an operating voltage range of 175 VRMS to 625 VRMS, with A single pulse current (8/20 µs) of up to 6000 A, and can withstand multiple surge currents up to 3000 A at 8/20 µs. UL 1449 Type 5 component certification.
Powell Electronics now offers Glenair’s MIL-DTL-38999 Series III Type fibre optic products, including qualified size 16 MIL-PRF-29504 precision ceramic termini, large core and jewel size 16 termini, and size 20 termini.
