The chip industry’s big three—Intel, Samsung and Taiwan Semiconductor Manufacturing Co. (TSMC)—are “getting serious” about a new 3D device architecture that promises to solve scaling problems that persist with today’s state-of-the-art nanosheet technology, experts told EE Times.
In September of this year, Intel announced that it was the first to launch a glass substrate for the next generation of advanced packaging, and plans to bring a complete solution to market in the next few years, so that the number of transistors in a single package continues to increase, continuing to push Moore's Law to meet the computing needs of data-centric applications.
Intel held a forum with the theme of "AI edge Computing enables medical imaging to help grassroots medical innovation and upgrading". At the forum, professionals from Intel, industry associations and leading enterprises in the medical field had an in-depth discussion on how to help grassroots medical informatization construction through the integration of medical AI and cloud edge, and improve the efficiency of medical services and medical staff work experience and other important issues.
Boston Consulting Group (BCG) and Intel (Intel) announced a strategic partnership to leverage Intel's end-to-end AI hardware and software to enable Generative artificial Intelligence (GenAI) to bring fully customized and proprietary solutions to enterprise customers, It also isolates private data in its trusted environment.
Intel Research has announced significant progress in its integrated optoelectronics research, the next frontier in improving bandwidth for computing chip connectivity within and across data centers. This latest research represents an industry-leading advance in the field of multiwavelength integrated optics, demonstrating a fully integrated eight-wavelength distributed feedback (DFB) laser array on a silicon wafer with output power uniformity of +/ -0.25 dB (dB) and wavelength spacing uniformity of ±6.5%, both superior to industry specifications.
Hosted by Intel, OpenVINO™ DevCon China 2022 was successfully held in the form of an online summit, bringing together many leading companies from various industries. Event in the global OpenVINO ™ developers, OpenVINO ™ core technical experts to share the latest product information and technical demonstration, also conducted a number of large cafe industry insights, core technology, such as case show multidimensional sharing and communication, to help developers in promoting technical level at the same time, broaden the professional field of vision, understanding of industry trends.
GROMACS is accelerated with Intel's oneAPI open programming and multi-architecture tools, and runs on Intel Xe architecture-based GPUs for exceptional performance.
The new Intel Sharp A380 graphics card brings next-generation technology to mainstream gamers and content creators.
Intel reiterated that it is consolidating its roadmap for high-performance CPUs and GPUs as it moves to newer manufacturing processes and packaging technologies in the coming years. The company is combining the CPU and GPU lineups into a single chip (code-named Falcon Shores), which Intel calls the XPU.
Apple unveiled a new M2 chip with a second-generation 5nm process and 20 billion transistors. Apple compared its performance to that of the previous M1 model and the i5-8210Y MacBook from years ago.
Meteor Lake plans to be the basis for Intel's 14th generation Core processor in 2023, which is an important chip for Intel on many levels. In terms of design, it's the company's first mass-market client SoC based on Chiplet (or "decomposition," as Intel likes to call it)
Dell and Fujitsu will use Intel programmable accelerators and Arria 10 GX FPGAs, and Intel Accelerator stacks will use Intel Xeon processors with FPGAs.
