Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Core Size | Speed | Connectivity | Peripherals | Number of I/O | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
DUAL CORE 4M FLASH 512K RAM F
|
pacote: 176-LQFP Exposed Pad |
Estoque6.048 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 176-LQFP |
Estoque2.704 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 3MB (3M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 176-LQFP |
Estoque2.016 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 3MB (3M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
DUAL CORE 4M FLASH 512K RAM F
|
pacote: 176-LQFP Exposed Pad |
Estoque7.200 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU TRIPLE CORE 3MB
|
pacote: 176-LQFP Exposed Pad |
Estoque2.528 |
|
32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 176-LQFP |
Estoque2.016 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 3MB (3M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
DUAL CORE 6M FLASH 768K RAM F
|
pacote: 256-LBGA |
Estoque5.280 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
||
NXP |
DUAL CORE, 6M FLASH, 768
|
pacote: 256-LBGA |
Estoque2.944 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 176-LQFP |
Estoque6.704 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 2MB (2M x 8) | FLASH | 64K x 8 | 160K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH 1.5M
|
pacote: 176-LQFP |
Estoque2.608 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 128K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH 1.5M
|
pacote: 176-LQFP |
Estoque4.736 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 128K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH 1.5M
|
pacote: 176-LQFP |
Estoque6.832 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 128K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
32 BITDUAL CORE4M FLAS
|
pacote: 324-LBGA |
Estoque4.640 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 246 | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | - | 324-LBGA | 324-MAPBGA (19x19) |
||
NXP |
DUAL CORE 6M FLASH 768K RAM F
|
pacote: 176-LQFP Exposed Pad |
Estoque4.784 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 176-LQFP |
Estoque3.088 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 2MB (2M x 8) | FLASH | 64K x 8 | 160K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 176-LQFP |
Estoque5.264 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 2MB (2M x 8) | FLASH | 64K x 8 | 160K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
DUAL CORE 6M FLASH 768K RAM F
|
pacote: 176-LQFP Exposed Pad |
Estoque6.096 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 85°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
DUAL CORE 4M FLASH 512
|
pacote: 176-LQFP Exposed Pad |
Estoque5.360 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI | DMA, LVD, POR, WDT | 129 | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 144-LQFP |
Estoque6.976 |
|
32-Bit Dual-Core | 66MHz | CANbus, EBI/EMI, I²C, SCI, SPI | DMA, POR, PWM, WDT | 111 | 1.5MB (1.5M x 8) | FLASH | - | 80K x 8 | 4.5 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 125°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
32BIT MCU2KRAMTPUQSM
|
pacote: - |
Estoque5.088 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
32 BIT DUAL CORE 3M FLASH 512
|
pacote: 256-LBGA |
Estoque6.720 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 176-LQFP |
Estoque5.616 |
|
32-Bit | 120MHz | CANbus, EBI/EMI, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 84 | 3MB (3M x 8) | FLASH | - | 192K x 8 | 1.14 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
pacote: 176-LQFP |
Estoque3.328 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
1.5M FLASH128K RAM
|
pacote: 176-LQFP |
Estoque4.432 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
DUAL CORE 4M FLASH 512K RAM F
|
pacote: 176-LQFP Exposed Pad |
Estoque5.104 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
DUAL CORE 6M FLASH 768K RAM F
|
pacote: 176-LQFP Exposed Pad |
Estoque2.176 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
32 BITDUAL CORE3M FLASH512K R
|
pacote: 176-LQFP Exposed Pad |
Estoque6.160 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
32 BIT, 4MB FLASH, 512K
|
pacote: 176-LQFP Exposed Pad |
Estoque5.760 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |