Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Core Size | Speed | Connectivity | Peripherals | Number of I/O | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
32 BIT DUAL CORE 3M FLASH 512
|
pacote: 100-LBGA |
Estoque6.368 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | - | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 100-LBGA | 100-MAPBGA (11x11) |
||
NXP |
NXP 32-BIT MCU POWER ARCH 1.5M
|
pacote: 176-LQFP |
Estoque7.264 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 128K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH 1.5M
|
pacote: 176-LQFP |
Estoque3.056 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 128K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
32 BIT3M FLASH512K RAM
|
pacote: 256-LBGA |
Estoque4.928 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 85°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
||
NXP |
ARM 32-BIT MCU TRIPLE CORE 3MB
|
pacote: 208-LQFP Exposed Pad |
Estoque6.432 |
|
32-Bit Tri-Core | 80MHz, 160MHz, 320MHz | CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI | DMA, LCD, LVD/HVD, POR, PWM, WDT | - | 3MB (3M x 8) | FLASH | - | 2.3M x 8 | 3.15 V ~ 5.5 V | A/D 24x12b | Internal | -40°C ~ 105°C (TA) | - | 208-LQFP Exposed Pad | 208-LQFP (28x28) |
||
NXP |
32 BITDUAL CORE3M FLASH384 RA
|
pacote: 176-LQFP Exposed Pad |
Estoque5.280 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
S12A 16-BIT MCU HCS12 CORE 512
|
pacote: 112-LQFP |
Estoque5.488 |
|
16-Bit | 25MHz | CANbus, I²C, SCI, SPI | PWM, WDT | 91 | 512KB (512K x 8) | FLASH | 4K x 8 | 14K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | -40°C ~ 85°C (TA) | - | 112-LQFP | 112-LQFP (20x20) |
||
NXP |
DUAL CORE 3M FLASH 384K RAM F
|
pacote: 176-LQFP Exposed Pad |
Estoque4.208 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
DUAL CORE 4M FLASH 512
|
pacote: 256-LBGA |
Estoque2.976 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
||
NXP |
NXP 32-BIT MCU POWER ARCH 1.5M
|
pacote: 176-LQFP |
Estoque4.368 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 128K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH 1.5M
|
pacote: 176-LQFP |
Estoque5.728 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 128K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH 1.5M
|
pacote: 176-LQFP |
Estoque6.816 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 128K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
pacote: 176-LQFP |
Estoque7.296 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 85°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
DUAL CORE 3M FLASH 384K RAM F
|
pacote: 256-LBGA |
Estoque7.328 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 176-LQFP |
Estoque18.000 |
|
32-Bit | 150MHz | CANbus, EBI/EMI, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 84 | 2MB (2M x 8) | FLASH | - | 128K x 8 | 1.14 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
DUAL CORE 2M FLASH 256
|
pacote: 256-LBGA |
Estoque5.232 |
|
32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 178 | 2MB (2M x 8) | FLASH | 64K x 8 | 256K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
||
NXP |
DUAL CORE 3M FLASH 512K RAM F
|
pacote: 176-LQFP Exposed Pad |
Estoque4.912 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
ARM 32-BIT MCU TRIPLE CORE 3MB
|
pacote: 516-BGA |
Estoque3.104 |
|
32-Bit Tri-Core | 80MHz, 160MHz, 320MHz | CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI | DMA, LCD, LVD/HVD, POR, PWM, WDT | - | 3MB (3M x 8) | FLASH | - | 2.3M x 8 | 3.15 V ~ 5.5 V | A/D 24x12b | Internal | -40°C ~ 105°C (TA) | - | 516-BGA | 516-MAPBGA (27x27) |
||
NXP |
DUAL CORE 3M FLASH 384K RAM F
|
pacote: 176-LQFP Exposed Pad |
Estoque3.152 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
pacote: 176-LQFP |
Estoque4.848 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
pacote: 176-LQFP |
Estoque3.040 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 176-LQFP |
Estoque4.240 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 128K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
32BIT MCU2KRAMTPUQSM
|
pacote: - |
Estoque7.120 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
32 BIT3M FLASH384 RAM
|
pacote: 176-LQFP Exposed Pad |
Estoque7.632 |
|
32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
32 BITDUAL CORE3M FLASH384 RA
|
pacote: 256-LBGA |
Estoque5.936 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
||
NXP |
912XDT512J1 GENERAL
|
pacote: 80-QFP |
Estoque4.640 |
|
16-Bit | 80MHz | CANbus, I²C, SCI, SPI | LVD, POR, PWM, WDT | 59 | 512KB (512K x 8) | FLASH | 4K x 8 | 20K x 8 | 3.15 V ~ 5.5 V | A/D 8x12b | External | -40°C ~ 125°C (TA) | - | 80-QFP | 80-QFP (14x14) |
||
NXP |
DUAL CORE, 3M FLASH, 384
|
pacote: 176-LQFP Exposed Pad |
Estoque5.760 |
|
32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 85°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
ARM 32-BIT MCU TRIPLE CORE 2MB
|
pacote: 208-LQFP Exposed Pad |
Estoque7.968 |
|
32-Bit Tri-Core | 80MHz, 160MHz, 320MHz | CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI | DMA, LCD, LVD/HVD, POR, PWM, WDT | - | 2MB (2M x 8) | FLASH | - | 2.3M x 8 | 3.15 V ~ 5.5 V | A/D 24x12b | Internal | -40°C ~ 105°C (TA) | - | 208-LQFP Exposed Pad | 208-LQFP (28x28) |