Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 64KBIT 300NS 28DIP
|
pacote: 28-DIP (0.600", 15.24mm) |
Estoque4.272 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 300ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 64KBIT 300NS 28DIP
|
pacote: 28-DIP (0.600", 15.24mm) |
Estoque4.000 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 300ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 64KBIT 300NS 32PLCC
|
pacote: 32-LCC (J-Lead) |
Estoque5.952 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 300ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 64KBIT 300NS 32PLCC
|
pacote: 32-LCC (J-Lead) |
Estoque7.584 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 300ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 64KBIT 250NS 28TSOP
|
pacote: 28-TSSOP (0.465", 11.80mm Width) |
Estoque2.176 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 64KBIT 250NS 28TSOP
|
pacote: 28-TSSOP (0.465", 11.80mm Width) |
Estoque5.872 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 64KBIT 250NS 28SOIC
|
pacote: 28-SOIC (0.295", 7.50mm Width) |
Estoque7.040 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 250NS 28SOIC
|
pacote: 28-SOIC (0.295", 7.50mm Width) |
Estoque9.792 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 250NS 28DIP
|
pacote: 28-DIP (0.600", 15.24mm) |
Estoque5.232 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 64KBIT 250NS 28DIP
|
pacote: 28-DIP (0.600", 15.24mm) |
Estoque6.816 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 64KBIT 250NS 32PLCC
|
pacote: 32-LCC (J-Lead) |
Estoque2.080 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 64KBIT 250NS 32PLCC
|
pacote: 32-LCC (J-Lead) |
Estoque5.936 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 64KBIT 200NS 28TSOP
|
pacote: 28-TSSOP (0.465", 11.80mm Width) |
Estoque6.800 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 64KBIT 200NS 28SOIC
|
pacote: 28-SOIC (0.295", 7.50mm Width) |
Estoque5.440 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 200ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 300NS 28TSOP
|
pacote: 28-TSSOP (0.465", 11.80mm Width) |
Estoque5.808 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 300ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 16KBIT 300NS 28TSOP
|
pacote: 28-TSSOP (0.465", 11.80mm Width) |
Estoque2.128 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 300ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 16KBIT 300NS 24SOIC
|
pacote: 24-SOIC (0.295", 7.50mm Width) |
Estoque2.080 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 300ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 300NS 24SOIC
|
pacote: 24-SOIC (0.295", 7.50mm Width) |
Estoque3.472 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 300ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 300NS 24DIP
|
pacote: 24-DIP (0.600", 15.24mm) |
Estoque7.008 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 300ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Through Hole | 24-DIP (0.600", 15.24mm) | 24-PDIP |
||
Microchip Technology |
IC EEPROM 16KBIT 300NS 24DIP
|
pacote: 24-DIP (0.600", 15.24mm) |
Estoque2.448 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 300ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Through Hole | 24-DIP (0.600", 15.24mm) | 24-PDIP |
||
Microchip Technology |
IC EEPROM 16KBIT 300NS 32PLCC
|
pacote: 32-LCC (J-Lead) |
Estoque5.968 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 300ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 16KBIT 300NS 32PLCC
|
pacote: 32-LCC (J-Lead) |
Estoque7.136 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 300ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 16KBIT 250NS 28TSOP
|
pacote: 28-TSSOP (0.465", 11.80mm Width) |
Estoque2.624 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 16KBIT 250NS 28TSOP
|
pacote: 28-TSSOP (0.465", 11.80mm Width) |
Estoque5.616 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 16KBIT 250NS 24SOIC
|
pacote: 24-SOIC (0.295", 7.50mm Width) |
Estoque2.256 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 250NS 24SOIC
|
pacote: 24-SOIC (0.295", 7.50mm Width) |
Estoque2.848 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 250NS 24DIP
|
pacote: 24-DIP (0.600", 15.24mm) |
Estoque5.296 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Through Hole | 24-DIP (0.600", 15.24mm) | 24-PDIP |
||
Microchip Technology |
IC EEPROM 16KBIT 250NS 24DIP
|
pacote: 24-DIP (0.600", 15.24mm) |
Estoque3.920 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Through Hole | 24-DIP (0.600", 15.24mm) | 24-PDIP |