Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 16KBIT 150NS 24SOIC
|
pacote: 24-SOIC (0.295", 7.50mm Width) |
Estoque5.584 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 200µs | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 150NS 24SOIC
|
pacote: 24-SOIC (0.295", 7.50mm Width) |
Estoque6.256 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 200µs | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 150NS 24DIP
|
pacote: 24-DIP (0.600", 15.24mm) |
Estoque3.424 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 200µs | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 24-DIP (0.600", 15.24mm) | 24-PDIP |
||
Microchip Technology |
IC EEPROM 16KBIT 150NS 24DIP
|
pacote: 24-DIP (0.600", 15.24mm) |
Estoque3.584 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 200µs | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 24-DIP (0.600", 15.24mm) | 24-PDIP |
||
Microchip Technology |
IC EEPROM 16KBIT 150NS 32PLCC
|
pacote: 32-LCC (J-Lead) |
Estoque2.752 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 200µs | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 16KBIT 150NS 32PLCC
|
pacote: 32-LCC (J-Lead) |
Estoque5.264 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 200µs | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 16KBIT 200NS 28TSOP
|
pacote: 28-TSSOP (0.465", 11.80mm Width) |
Estoque6.288 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 1ms | 200ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 16KBIT 200NS 28TSOP
|
pacote: 28-TSSOP (0.465", 11.80mm Width) |
Estoque2.256 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 1ms | 200ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 16KBIT 200NS 24SOIC
|
pacote: 24-SOIC (0.295", 7.50mm Width) |
Estoque2.560 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 1ms | 200ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 200NS 24SOIC
|
pacote: 24-SOIC (0.295", 7.50mm Width) |
Estoque46.872 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 1ms | 200ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 200NS 24DIP
|
pacote: 24-DIP (0.600", 15.24mm) |
Estoque2.656 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 1ms | 200ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 24-DIP (0.600", 15.24mm) | 24-PDIP |
||
Microchip Technology |
IC EEPROM 16KBIT 200NS 24DIP
|
pacote: 24-DIP (0.600", 15.24mm) |
Estoque8.964 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 1ms | 200ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 24-DIP (0.600", 15.24mm) | 24-PDIP |
||
Microchip Technology |
IC EEPROM 16KBIT 200NS 32PLCC
|
pacote: 32-LCC (J-Lead) |
Estoque5.680 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 1ms | 200ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 16KBIT 200NS 32PLCC
|
pacote: 32-LCC (J-Lead) |
Estoque59.232 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 1ms | 200ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 4MBIT 250NS 44CLCC
|
pacote: 44-CLCC |
Estoque3.632 |
|
EEPROM | EEPROM | 4Mb (512K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 44-CLCC | 44-CLCC (16.54x16.54) |
||
Microchip Technology |
IC EEPROM 4MBIT 250NS 44CLCC
|
pacote: 44-CLCC |
Estoque4.352 |
|
EEPROM | EEPROM | 4Mb (512K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 44-CLCC | 44-CLCC (16.54x16.54) |
||
Microchip Technology |
IC EEPROM 4MBIT 250NS 32FLATPACK
|
pacote: 32-CFlatpack |
Estoque3.856 |
|
EEPROM | EEPROM | 4Mb (512K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 4MBIT 250NS 32FLATPACK
|
pacote: 32-CFlatpack |
Estoque6.752 |
|
EEPROM | EEPROM | 4Mb (512K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 4MBIT 250NS 32CDIP
|
pacote: 32-CDIP (0.600", 15.24mm) |
Estoque4.064 |
|
EEPROM | EEPROM | 4Mb (512K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-CDIP (0.600", 15.24mm) | 32-CDIP |
||
Microchip Technology |
IC EEPROM 4MBIT 250NS 32CDIP
|
pacote: 32-CDIP (0.600", 15.24mm) |
Estoque5.712 |
|
EEPROM | EEPROM | 4Mb (512K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-CDIP (0.600", 15.24mm) | 32-CDIP |
||
Microchip Technology |
IC EEPROM 4MBIT 200NS 44CLCC
|
pacote: 44-CLCC |
Estoque2.464 |
|
EEPROM | EEPROM | 4Mb (512K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 44-CLCC | 44-CLCC (16.54x16.54) |
||
Microchip Technology |
IC EEPROM 4MBIT 200NS 44LCC
|
pacote: 44-CLCC |
Estoque4.816 |
|
EEPROM | EEPROM | 4Mb (512K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 44-CLCC | 44-CLCC (16.54x16.54) |
||
Microchip Technology |
IC EEPROM 4MBIT 200NS 32FP
|
pacote: 32-CFlatpack |
Estoque4.704 |
|
EEPROM | EEPROM | 4Mb (512K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 4MBIT 200NS 32FLATPACK
|
pacote: 32-CFlatpack |
Estoque2.064 |
|
EEPROM | EEPROM | 4Mb (512K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 4MBIT 200NS 32CDIP
|
pacote: 32-CDIP (0.600", 15.24mm) |
Estoque3.920 |
|
EEPROM | EEPROM | 4Mb (512K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-CDIP (0.600", 15.24mm) | 32-CDIP |
||
Microchip Technology |
IC EEPROM 4MBIT 200NS 32CDIP
|
pacote: 32-CDIP (0.600", 15.24mm) |
Estoque13.668 |
|
EEPROM | EEPROM | 4Mb (512K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-CDIP (0.600", 15.24mm) | 32-CDIP |
||
Microchip Technology |
IC EEPROM 1MBIT 200NS 32TSOP
|
pacote: 32-TFSOP (0.724", 18.40mm Width) |
Estoque5.840 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC EEPROM 1MBIT 200NS 32DIP
|
pacote: 32-DIP (0.600", 15.24mm) |
Estoque3.216 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |