Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 1:4 160MHZ 16SOIC
|
pacote: 16-SOIC (0.295", 7.50mm Width) |
Estoque6.688 |
|
1 | 1:4 | Yes/Yes | PECL | TTL | 160MHz | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:4 160MHZ 16SOIC
|
pacote: 16-SOIC (0.295", 7.50mm Width) |
Estoque5.472 |
|
1 | 1:4 | Yes/Yes | PECL | TTL | 160MHz | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:4 160MHZ 16SOIC
|
pacote: 16-SOIC (0.295", 7.50mm Width) |
Estoque7.360 |
|
1 | 1:4 | Yes/Yes | PECL | TTL | 160MHz | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:4 160MHZ 16SOIC
|
pacote: 16-SOIC (0.295", 7.50mm Width) |
Estoque5.456 |
|
1 | 1:4 | Yes/Yes | PECL | TTL | 160MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:4 160MHZ 16SOIC
|
pacote: 16-SOIC (0.295", 7.50mm Width) |
Estoque5.200 |
|
1 | 1:4 | Yes/Yes | PECL | TTL | 160MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:9 135MHZ 28PLCC
|
pacote: 28-LCC (J-Lead) |
Estoque2.576 |
|
1 | 1:9 | Yes/Yes | PECL | TTL | 135MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 135MHZ 28PLCC
|
pacote: 28-LCC (J-Lead) |
Estoque7.280 |
|
1 | 1:9 | Yes/Yes | PECL | TTL | 135MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 135MHZ 28PLCC
|
pacote: 28-LCC (J-Lead) |
Estoque7.424 |
|
1 | 1:9 | Yes/Yes | PECL | TTL | 135MHz | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 135MHZ 28PLCC
|
pacote: 28-LCC (J-Lead) |
Estoque17.472 |
|
1 | 1:9 | Yes/Yes | PECL | TTL | 135MHz | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:5 3GHZ 32TQFP
|
pacote: 32-TQFP |
Estoque2.656 |
|
2 | 1:5 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:5 3GHZ 32TQFP
|
pacote: 32-TQFP |
Estoque7.760 |
|
2 | 1:5 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacote: 28-LCC (J-Lead) |
Estoque7.840 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacote: 28-LCC (J-Lead) |
Estoque14.376 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacote: 28-LCC (J-Lead) |
Estoque3.312 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 4.2 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacote: 28-LCC (J-Lead) |
Estoque5.104 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 4.2 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacote: 28-LCC (J-Lead) |
Estoque6.368 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 4.2 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacote: 28-LCC (J-Lead) |
Estoque4.160 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 4.2 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacote: 28-LCC (J-Lead) |
Estoque6.448 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacote: 28-LCC (J-Lead) |
Estoque6.848 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 2:15 2GHZ 64TQFP
|
pacote: 64-TQFP Exposed Pad |
Estoque16.896 |
|
1 | 2:15 | Yes/Yes | CML, LVDS, PECL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:15 2GHZ 64TQFP
|
pacote: 64-TQFP Exposed Pad |
Estoque19.356 |
|
1 | 2:15 | Yes/Yes | CML, LVDS, PECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 1:2 2GHZ 16MLF
|
pacote: 16-VFQFN Exposed Pad, 16-MLF? |
Estoque16.872 |
|
1 | 1:2 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVDS | 2GHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 2GHZ 16MLF
|
pacote: 16-VFQFN Exposed Pad, 16-MLF? |
Estoque6.448 |
|
1 | 1:2 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 2GHZ 16MLF
|
pacote: 16-VFQFN Exposed Pad, 16-MLF? |
Estoque5.072 |
|
1 | 1:2 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 2.5GHZ 16MLF
|
pacote: 16-VFQFN Exposed Pad, 16-MLF? |
Estoque3.648 |
|
1 | 1:2 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVPECL | 2.5GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:3 2GHZ 16MLF
|
pacote: 16-VFQFN Exposed Pad, 16-MLF? |
Estoque2.160 |
|
1 | 1:3 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVDS | 2GHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:3 2GHZ 16MLF
|
pacote: 16-VFQFN Exposed Pad, 16-MLF? |
Estoque6.560 |
|
1 | 1:3 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:3 2GHZ 16MLF
|
pacote: 16-VFQFN Exposed Pad, 16-MLF? |
Estoque9.480 |
|
1 | 1:3 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |