Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 1:3 2.5GHZ 16MLF
|
pacote: 16-VFQFN Exposed Pad, 16-MLF? |
Estoque6.368 |
|
1 | 1:3 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVPECL | 2.5GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 3.5GHZ 16MLF
|
pacote: 16-VFQFN Exposed Pad, 16-MLF? |
Estoque7.616 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, PECL | LVPECL | 3.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 3.5GHZ 16MLF
|
pacote: 16-VFQFN Exposed Pad, 16-MLF? |
Estoque5.360 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, PECL | LVPECL | 3.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 3.5GHZ 16MLF
|
pacote: 16-VFQFN Exposed Pad, 16-MLF? |
Estoque5.472 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, PECL | LVPECL | 3.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 3.5GHZ 16MLF
|
pacote: 16-VFQFN Exposed Pad, 16-MLF? |
Estoque6.064 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, PECL | LVPECL | 3.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:4 1GHZ 16MLF
|
pacote: 16-VFQFN Exposed Pad, 16-MLF? |
Estoque5.520 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 1GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:4 1GHZ 16MLF
|
pacote: 16-VFQFN Exposed Pad, 16-MLF? |
Estoque166.728 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 1GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 2GHZ 16MLF
|
pacote: 16-VFQFN Exposed Pad, 16-MLF? |
Estoque6.816 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 2GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 2.5GHZ 16MLF
|
pacote: 16-VFQFN Exposed Pad, 16-MLF? |
Estoque2.896 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 2.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 2GHZ 16MLF
|
pacote: 16-VFQFN Exposed Pad, 16-MLF? |
Estoque7.360 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:4 2.5GHZ 16TSSOP
|
pacote: 16-TSSOP (0.173", 4.40mm Width) |
Estoque3.248 |
|
1 | 2:4 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 2.5GHz | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 2:10 2GHZ 64TQFP
|
pacote: 64-TQFP Exposed Pad |
Estoque2.704 |
|
2 | 2:10 | Yes/Yes | LVDS, LVPECL | LVPECL | 2GHz | 2.37 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:10 1GHZ 64TQFP
|
pacote: 64-TQFP Exposed Pad |
Estoque5.184 |
|
2 | 2:10 | Yes/Yes | LVDS, PECL | LVDS | 1GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:10 1GHZ 64TQFP
|
pacote: 64-TQFP Exposed Pad |
Estoque2.608 |
|
2 | 2:10 | Yes/Yes | LVDS, PECL | LVDS | 1GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUF 4:20/2:10 64TQFP
|
pacote: 64-TQFP Exposed Pad |
Estoque16.188 |
|
1 or 2 | 4:20, 2:10 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3.3 V ~ 3.47 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:22 1GHZ 64TQFP
|
pacote: 64-TQFP Exposed Pad |
Estoque27.036 |
|
1 | 2:22 | Yes/Yes | LVDS, LVPECL | LVDS | 1GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:22 2GHZ 64TQFP
|
pacote: 64-TQFP Exposed Pad |
Estoque17.484 |
|
1 | 2:22 | Yes/Yes | LVDS, LVPECL | LVPECL | 2GHz | 2.37 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:22 2GHZ 64TQFP
|
pacote: 64-TQFP Exposed Pad |
Estoque2.320 |
|
1 | 2:22 | Yes/Yes | LVDS, LVPECL | LVPECL | 2GHz | 2.37 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:22 2GHZ 64TQFP
|
pacote: 64-TQFP Exposed Pad |
Estoque5.504 |
|
1 | 2:22 | Yes/Yes | LVDS, LVPECL | LVPECL | 2GHz | 2.37 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:22 64TQFP
|
pacote: 64-TQFP Exposed Pad |
Estoque7.200 |
|
1 | 2:22 | Yes/Yes | HSTL, LVPECL | HSTL | - | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:22 64TQFP
|
pacote: 64-TQFP Exposed Pad |
Estoque17.472 |
|
1 | 2:22 | Yes/Yes | HSTL, LVPECL | HSTL | - | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:22 500MHZ 64TQFP
|
pacote: 64-TQFP Exposed Pad |
Estoque7.088 |
|
1 | 2:22 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:9 500MHZ 32TQFP
|
pacote: 32-TQFP |
Estoque3.472 |
|
1 | 2:9 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:9 500MHZ 32TQFP
|
pacote: 32-TQFP |
Estoque18.864 |
|
1 | 2:9 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:9 500MHZ 32TQFP
|
pacote: 32-TQFP |
Estoque4.992 |
|
1 | 2:9 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:9 500MHZ 32TQFP
|
pacote: 32-TQFP |
Estoque2.224 |
|
1 | 2:9 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK MULTIPLXR 2:10 2GHZ 44MLF
|
pacote: 44-VFQFN Exposed Pad, 44-MLF? |
Estoque3.120 |
|
1 | 2:10 | Yes/Yes | CML, LVDS, PECL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad, 44-MLF? | 44-MLF? (7x7) |
||
Microchip Technology |
IC CLK MULTIPLXR 2:10 2GHZ 44MLF
|
pacote: 44-VFQFN Exposed Pad, 44-MLF? |
Estoque7.840 |
|
1 | 2:10 | Yes/Yes | CML, LVDS, PECL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad, 44-MLF? | 44-MLF? (7x7) |