NXP Produtos

BUK956R1-100E,127

NXP

MOSFET N-CH 100V 120A TO220AB

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 100V
• Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
• Vgs(th) (Max) @ Id: 2.1V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 133nC @ 5V
• Input Capacitance (Ciss) (Max) @ Vds: 17460pF @ 25V
• Vgs (Max): ±10V
• FET Feature: -
• Power Dissipation (Max): 349W (Tc)
• Rds On (Max) @ Id, Vgs: 5.9 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: TO-220AB
• Package / Case: TO-220-3

pacote: TO-220-3

BUK952R8-60E,127

NXP

MOSFET N-CH 60V 120A TO220AB

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 60V
• Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
• Vgs(th) (Max) @ Id: 2.1V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 120nC @ 5V
• Input Capacitance (Ciss) (Max) @ Vds: 17450pF @ 25V
• Vgs (Max): ±10V
• FET Feature: -
• Power Dissipation (Max): 349W (Tc)
• Rds On (Max) @ Id, Vgs: 2.6 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: TO-220AB
• Package / Case: TO-220-3

pacote: TO-220-3

MRF9180R5

NXP

FET RF 65V 880MHZ NI-1230

• Transistor Type: LDMOS
• Frequency: 880MHz
• Gain: 17.5dB
• Voltage - Test: 26V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.4A
• Power - Output: 170W
• Voltage - Rated: 65V
• Package / Case: NI-1230
• Supplier Device Package: NI-1230

pacote: NI-1230

PCF8811U/2DA/1,026

NXP

IC MATRIX LCD DRIVER UNCASED

• Display Type: LCD
• Configuration: Display Matrix
• Interface: I2C, Parallel, Serial
• Digits or Characters: -
• Current - Supply: 25µA
• Voltage - Supply: 1.7 V ~ 3.3 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

pacote: Die

74ABT573AN,112

NXP

IC OCTAL D TRANSP LATCH 20DIP

• Logic Type: D-Type Transparent Latch
• Circuit: 8:8
• Output Type: Tri-State
• Voltage - Supply: 4.5 V ~ 5.5 V
• Independent Circuits: 1
• Delay Time - Propagation: 3.3ns
• Current - Output High, Low: 32mA, 64mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 20-DIP (0.300", 7.62mm)
• Supplier Device Package: 20-DIP

pacote: 20-DIP (0.300", 7.62mm)

I74F657D,118

NXP

IC TRANSCEIVER 8BIT N-INV 24SOIC

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 3mA, 24mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SO

pacote: 24-SOIC (0.295", 7.50mm Width)

TDA7056B/N1,112

NXP

IC AMP AUDIO 5.5W MONO AB 9SIL

• Type: Class AB
• Output Type: 1-Channel (Mono)
• Max Output Power x Channels @ Load: 5.5W x 1 @ 8 Ohm
• Voltage - Supply: 4.5 V ~ 18 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Volume Control
• Mounting Type: Through Hole
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 9-SIL MPF
• Package / Case: 9-SIP Exposed Tab

pacote: 9-SIP Exposed Tab

GTL2009PW,118

NXP

IC 3-BIT FREQ COMPARATOR 16TSSOP

• Applications: Compares FSB Frequency Inputs
• Interface: GTL, TTL
• Voltage - Supply: 3 V ~ 3.6 V
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP
• Mounting Type: Surface Mount

pacote: 16-TSSOP (0.173", 4.40mm Width)

MCZ33903CS3EKR2

NXP

IC SBC CAN HS 3.3V 32SOIC

• Applications: System Basis Chip
• Interface: CAN, LIN
• Voltage - Supply: 5.5 V ~ 28 V
• Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP
• Mounting Type: Surface Mount

pacote: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

MC145572APB

NXP

IC ISDN INTERFACE TXCVER 44-LQFP

• Type: Transceiver
• Protocol: RS232
• Number of Drivers/Receivers: -
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: 5V
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 44-LQFP
• Supplier Device Package: 44-LQFP (10x10)

pacote: 44-LQFP

MC8641DTHX1333JC

NXP

IC MPU MPC86XX 1.333GHZ 1023BGA

• Core Processor: PowerPC e600
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1023-BCBGA, FCCBGA
• Supplier Device Package: 1023-FCCBGA (33x33)

pacote: 1023-BCBGA, FCCBGA

KMPC852TCZT100A

NXP

IC MPU MPC8XX 100MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 100MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 100°C (TA)
• Security Features: -
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

pacote: 256-BBGA

MPC860SRZQ80D4

NXP

IC MPU MPC8XX 80MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 80MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

pacote: 357-BBGA

SPC5674KFF0MMS2R

NXP

IC MCU 32BIT 1.5MB FLASH 473BGA

• Core Processor: e200z7d
• Core Size: 32-Bit
• Speed: 180MHz
• Connectivity: CAN, EBI/EMI, Ethernet, FlexRay, I2C, LIN, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 1.5MB (1.5M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 384K x 8
• Voltage - Supply (Vcc/Vdd): 1.14 V ~ 1.32 V
• Data Converters: A/D 34x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 473-LFBGA
• Supplier Device Package: 473-MAPBGA (19x19)

pacote: 473-LFBGA

MCF5275CVM166J

NXP

IC MCU 32BIT ROMLESS 256MAPBGA

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 166MHz
• Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
• Peripherals: DMA, WDT
• Number of I/O: 69
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-MAPBGA

pacote: 256-LBGA

SPC5748CK1MMJ6R

NXP

IC MCU 32BIT 6MB FLASH 256MAPBGA

• Core Processor: e200z2, e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 80MHz/160MHz
• Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: 178
• Program Memory Size: 6MB (6M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 768K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 80x10b, 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-MAPPBGA (17x17)

pacote: 256-LBGA

S9S12DG25F0VPVE

NXP

IC MCU 16BIT 256KB FLASH 112LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: PWM, WDT
• Number of I/O: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

pacote: 112-LQFP

MK24FN1M0CAJ12R

NXP

IC MCU 32BIT 1MB FLASH 142WLCSP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 100
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 41x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 142-UFBGA, WLCSP
• Supplier Device Package: 142-WLCSP (4.83x5.58)

pacote: 142-UFBGA, WLCSP

S912XDG128F2CAA

NXP

IC MCU 16BIT 128KB FLASH 80QFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 59
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b, 16x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

pacote: 80-QFP

S9S12P96J0MFT

NXP

IC MCU 16BIT 96KB FLASH 48QFN

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: CAN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 34
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 6K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN-EP (7x7)

pacote: 48-VFQFN Exposed Pad

MKL17Z128VFM4

NXP

IC MCU 32BIT 128KB FLASH 32QFN

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 11x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-QFN (5x5)

pacote: 32-VFQFN Exposed Pad

KMC8144VT1000B

NXP

IC DSP 783FCBGA

• Type: SC3400 Core
• Interface: EBI/EMI, Ethernet, I2C, PCI, Serial RapidIO, SPI, TDM, UART, UTOPIA
• Clock Rate: 1GHz
• Non-Volatile Memory: ROM (96 kB)
• On-Chip RAM: 10.5MB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.00V
• Operating Temperature: 0°C ~ 90°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

pacote: 783-BBGA, FCBGA

IP4342CX5/LF,135

NXP

TVS DIODE 5.5VWM 5WLCSP

• Type: Zener
• Unidirectional Channels: 4
• Bidirectional Channels: 3
• Voltage - Reverse Standoff (Typ): 5.5V
• Voltage - Breakdown (Min): -
• Voltage - Clamping (Max) @ Ipp: -
• Current - Peak Pulse (10/1000µs): -
• Power - Peak Pulse: -
• Power Line Protection: -
• Applications: -
• Capacitance @ Frequency: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 5-UFBGA, WLCSP
• Supplier Device Package: 5-WLCSP (0.76x1.05)

pacote: 5-UFBGA, WLCSP

SX5100P2T1

NXP

ACCELEROMETER

• Type: -
• Axis: -
• Acceleration Range: -
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: -
• Voltage - Supply: -
• Features: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacote: -

SA676DK/01,112

NXP

IC MIXER 100MHZ UP CONVRT 20SSOP

• RF Type: Cordless Phones
• Frequency: 100MHz
• Number of Mixers: 2
• Gain: 17dB
• Noise Figure: 7dB
• Secondary Attributes: Up Converter
• Current - Supply: 5mA
• Voltage - Supply: 2.7 V ~ 7 V
• Package / Case: 20-LSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-SSOP

pacote: 20-LSSOP (0.173", 4.40mm Width)

1321XCSK-BDM

NXP

KIT STARTER FOR MC1321X

• Type: Transceiver; 802.15.4 (ZigBee?)
• Frequency: 2.4GHz
• For Use With/Related Products: MC1321x
• Supplied Contents: 2 Boards, Cables, Power Supply

pacote: -

MWE6IC9080GNR1

NXP

RF AMP LDMOS TO-270 960MHZ

• Frequency: 865MHz ~ 960MHz
• P1dB: 90W
• Gain: 28.8dB
• Noise Figure: -
• RF Type: GSM, EDGE
• Voltage - Supply: 28V
• Current - Supply: -
• Test Frequency: -
• Package / Case: TO-270-14 Variant, Gull Wing
• Supplier Device Package: TO-270 WB-14 GULL

pacote: TO-270-14 Variant, Gull Wing

SPC5646CCF0VLU1

NXP

NXP 32-BIT MCU DUAL POWER ARCH

• Core Processor: e200z4d, e200z0h
• Core Size: 32-Bit Dual-Core
• Speed: 80MHz/120MHz
• Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 147
• Program Memory Size: 3MB (3M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 27x10b, 5x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 176-LQFP
• Supplier Device Package: 176-LQFP (24x24)

pacote: 176-LQFP

S912XET256J2VAA

NXP

16-BIT MCU S12X CORE 256KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 59
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

pacote: 80-QFP

MC56F84766VLKR

NXP

32-BIT DSC 56800EX CORE 128KB

• Core Processor: 56800EX
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
• Number of I/O: 68
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 24K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x12b, 10x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 80-LQFP
• Supplier Device Package: 80-FQFP (12x12)

pacote: 80-LQFP