Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
IC EEPROM 1KBIT 1WIRE 2SFN
|
pacote: 2-SFN |
Estoque3.440 |
|
EEPROM | EEPROM | 1Kb (256 x 4) | 1-Wire? | - | - | 2µs | 2.85 V ~ 5.25 V | -40°C ~ 85°C (TA) | Surface Mount | 2-SFN | 2-SFN (6x6) |
||
Renesas Electronics America |
IC SRAM 8MBIT 55NS 48TSOP
|
pacote: 48-TFSOP (0.724", 18.40mm Width) |
Estoque4.736 |
|
SRAM | SRAM | 8Mb (1M x 8, 512K x 16) | Parallel | - | 55ns | 55ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
Cypress Semiconductor Corp |
IC SRAM 72MBIT 300MHZ 165FBGA
|
pacote: 165-LBGA |
Estoque7.744 |
|
SRAM | SRAM - Synchronous, QDR II | 72Mb (2M x 36) | Parallel | 300MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
ON Semiconductor |
IC FLASH 512KBIT 90NS 32PLCC
|
pacote: 32-LCC (J-Lead) |
Estoque4.496 |
|
FLASH | FLASH | 512Kb (64K x 8) | Parallel | - | 90ns | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4MBIT 15NS 44TSOP
|
pacote: 44-TSOP (0.400", 10.16mm Width) |
Estoque2.000 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 15ns | 15ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Micron Technology Inc. |
IC SDRAM 512MBIT 133MHZ 66TSOP
|
pacote: 66-TSSOP (0.400", 10.16mm Width) |
Estoque3.808 |
|
DRAM | SDRAM - DDR | 512Mb (128M x 4) | Parallel | 133MHz | 15ns | 750ps | 2.3 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP |
||
Microchip Technology |
IC FLASH 16MBIT 70NS 48TSOP
|
pacote: 48-TFSOP (0.724", 18.40mm Width) |
Estoque56.436 |
|
FLASH | FLASH | 16Mb (2M x 8, 1M x 16) | Parallel | - | 200µs | 70ns | 2.65 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Winbond Electronics |
IC SRAM 256KBIT 70NS 28SOP
|
pacote: 28-SOIC (0.330", 8.38mm Width) |
Estoque6.816 |
|
SRAM | SRAM | 256Kb (32K x 8) | Parallel | - | 70ns | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 28-SOIC (0.330", 8.38mm Width) | 28-SOP |
||
Microchip Technology |
IC EEPROM 8KBIT 2MHZ 8DIP
|
pacote: 8-DIP (0.300", 7.62mm) |
Estoque7.856 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 2MHz | 10ms | - | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FLASH 512KBIT 33MHZ 8WSON
|
pacote: 8-WDFN Exposed Pad |
Estoque3.936 |
|
FLASH | FLASH | 512Kb (64K x 8) | SPI | 33MHz | 20µs | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON |
||
ISSI, Integrated Silicon Solution Inc |
IC FLASH 1MBIT 104MHZ 8WSON
|
pacote: 8-WDFN Exposed Pad |
Estoque6.144 |
|
FLASH | FLASH - NOR | 1Mb (128K x 8) | SPI - Quad I/O | 104MHz | 800µs | - | 2.3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28SOIC
|
pacote: 28-SOIC (0.295", 7.50mm Width) |
Estoque4.176 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
STMicroelectronics |
IC EEPROM 64KBIT 2MHZ 8MLP
|
pacote: 8-UFDFN Exposed Pad |
Estoque48.000 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UFDFPN (2x3) |
||
Maxim Integrated |
IC NVSRAM 2MBIT 85NS 32EDIP
|
pacote: 32-DIP Module (0.600", 15.24mm) |
Estoque5.680 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 2Mb (256K x 8) | Parallel | - | 85ns | 85ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 32-DIP Module (0.600", 15.24mm) | 32-EDIP |
||
Microchip Technology |
IC EEPROM 128K I2C 400KHZ WAFER
|
pacote: Die |
Estoque3.408 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Rohm Semiconductor |
EEPROM SERIAL-I2C 4K-BIT 512 X 8
|
pacote: 8-SOIC (0.173", 4.40mm Width) |
Estoque30.000 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I²C | 400kHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.173", 4.40mm Width) | 8-SOP |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 2G PARALLEL 78TWBGA
|
pacote: 78-TFBGA |
Estoque4.256 |
|
DRAM | SDRAM - DDR3 | 2Gb (256M x 8) | Parallel | 800MHz | 15ns | 20ns | 1.425 V ~ 1.575 V | -40°C ~ 95°C (TC) | Surface Mount | 78-TFBGA | 78-TWBGA (8x10.5) |
||
Microchip Technology |
IC EPROM 2M PARALLEL 44PLCC
|
pacote: 44-LCC (J-Lead) |
Estoque2.688 |
|
EPROM | EPROM - OTP | 2Mb (128K x 16) | Parallel | - | - | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 64K PARALLEL 100TQFP
|
pacote: 100-LQFP |
Estoque7.120 |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kb (4K x 16) | Parallel | - | 35ns | 35ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 1M PARALLEL 100TQFP
|
pacote: 100-LQFP |
Estoque4.880 |
|
SRAM | SRAM - Dual Port, Synchronous | 1Mb (64K x 16) | Parallel | - | - | 7.5ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Cypress Semiconductor Corp |
IC SRAM 256KBIT PARALLEL 24DIP
|
pacote: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 256Kbit | Parallel | - | 25ns | 25 ns | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | Through Hole | 24-DIP (0.300", 7.62mm) | 24-PDIP |
||
GSI Technology Inc. |
IC SRAM 18MBIT PARALLEL 165FPBGA
|
pacote: - |
Request a Quote |
|
SRAM | SRAM - Quad Port, Synchronous | 18Mbit | Parallel | 400 MHz | - | - | 1.7V ~ 1.9V | -40°C ~ 85°C (TA) | Surface Mount | 165-LBGA | 165-FPBGA (15x13) |
||
Microchip Technology |
IC EEPROM 64KBIT PARALLEL 28TSOP
|
pacote: - |
Request a Quote |
|
EEPROM | EEPROM | 64Kbit | Parallel | - | 10ms | 70 ns | 4.5V ~ 5.5V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Winbond Electronics |
4GB LPDDR4X, DDP, X32, 2133MHZ,
|
pacote: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 4Gbit | LVSTL_11 | 2.133 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |
||
Cypress Semiconductor Corp |
IC SRAM 256KBIT PARALLEL 28SOJ
|
pacote: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 256Kbit | Parallel | - | 15ns | 15 ns | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | 28-BSOJ (0.300", 7.62mm Width) | 28-SOJ |
||
Renesas Electronics Corporation |
IC SRAM 16MBIT PARALLEL 48TSOP I
|
pacote: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 16Mbit | Parallel | - | 45ns | 45 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
Insignis Technology Corporation |
LPDDR4 4GB X16 2400MHZ CL16 10X1
|
pacote: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 4Gbit | LVSTL | 1.2 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | Surface Mount | 200-WFBGA | 200-FBGA (10x14.5) |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 8GBIT PARALLEL 200TFBGA
|
pacote: - |
Estoque1.533 |
|
DRAM | SDRAM - Mobile LPDDR4 | 8Gbit | Parallel | 1.6 GHz | - | - | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 95°C (TC) | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |