Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC TDM/TSI SWITCH 256X256 48SSOP
|
pacote: 48-BSSOP (0.295", 7.50mm Width) |
Estoque5.088 |
|
- | 1 | 3 V ~ 3.6 V | 4mA | - | -40°C ~ 85°C | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
Microsemi Corporation |
IC LINE CARD LCAS 1CHIPLE 28SOIC
|
pacote: 28-SOIC (0.295", 7.50mm Width) |
Estoque7.232 |
|
- | 1 | 4.5 V ~ 5.5 V | - | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
pacote: 144-BGA, CSPBGA |
Estoque4.480 |
|
LIU | 2 | 3.3V | 150mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 3CH 128LQFP
|
pacote: 128-LQFP |
Estoque7.584 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 410mA | - | -40°C ~ 85°C | Surface Mount | 128-LQFP | 128-LQFP (14x20) |
||
Exar Corporation |
IC FRAMER DS3 ATM UNI 160QFP
|
pacote: 272-BBGA |
Estoque7.632 |
|
- | - | 3.3V | 190mA | - | -40°C ~ 85°C | Surface Mount | 272-BBGA | 272-PBGA (27x27) |
||
Maxim Integrated |
IC LIU T1/E1/J1 QUAD 3.3V 144BGA
|
pacote: 144-BBGA |
Estoque6.096 |
|
LIU | - | 3.135 V ~ 3.465 V | 66mA | - | -40°C ~ 85°C | Surface Mount | 144-BBGA | 144-PBGA (17x17) |
||
Maxim Integrated |
IC LIU T1/E1/J1 3.3V 49-BGA
|
pacote: 49-LFBGA, CSPBGA |
Estoque30.000 |
|
Serial | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 49-LFBGA, CSPBGA | 49-CSBGA (7x7) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 2CH 100TQFP
|
pacote: 100-LQFP |
Estoque5.440 |
|
LIU | 2 | 3.135 V ~ 3.465 V | 260mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Microsemi Corporation |
IC TDM SWITCH 4K-CH ENH 256LQFP
|
pacote: 256-LQFP |
Estoque5.680 |
|
- | 1 | 1.71 V ~ 1.89 V | 130mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |
||
Microsemi Corporation |
IC TDM SWITCH 2K-CH ENH 256BGA
|
pacote: 256-BGA |
Estoque3.440 |
|
- | 1 | 1.71 V ~ 1.89 V | 165mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/E1 8CH SHORT 144-TQFP
|
pacote: 144-LQFP |
Estoque7.120 |
|
LIU | - | 3.13 V ~ 3.47 V | 55mA | - | -40°C ~ 85°C | Surface Mount | 144-LQFP | 144-TQFP (20x20) |
||
Silicon Labs |
IC PROSLIC FXS DUAL -140V 50QFN
|
pacote: - |
Estoque7.824 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
Silicon Labs |
IC PROSLIC FXS PCM -106V 56QFN
|
pacote: - |
Estoque7.936 |
|
3-Wire, PCM | 2 | 3.3V | - | - | 0°C ~ 70°C | - | - | - |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 20-SOIC
|
pacote: 20-SOIC (0.295", 7.50mm Width) |
Estoque2.208 |
|
- | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Silicon Labs |
IC PROSLIC FXS ISI -106V 36QFN
|
pacote: - |
Estoque3.472 |
|
3-Wire | 1 | 3.3V | - | - | 0°C ~ 70°C | - | - | - |
||
IXYS Integrated Circuits Division |
IC OPT-ISOLATED MULTIFUNC 16SOIC
|
pacote: 16-SOIC (0.295", 7.50mm Width) |
Estoque10.992 |
|
- | 1 | - | - | 1W | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
IXYS Integrated Circuits Division |
IC OPT-ISOLATED MULTIFUNC 16SOIC
|
pacote: 16-SOIC (0.295", 7.50mm Width) |
Estoque2.000 |
|
- | 2 | 1.2V | 50mA | 1W | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Silicon Labs |
IC LINE-SIDE DAA 16TSSOP
|
pacote: 16-TSSOP (0.173", 4.40mm Width) |
Estoque249.084 |
|
GCI, PCM, SPI | 1 | 3 V ~ 3.6 V | 8.5mA | - | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microsemi Corporation |
EIGHT CHANNEL COMBINED T1/E1/J1
|
pacote: 256-BGA |
Estoque5.408 |
|
E1, J1, SPI, T1 | 8 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-CABGA (17x17) |
||
Microchip Technology |
IC ETHERNET 1-PORT 135QFN
|
pacote: - |
Estoque4.160 |
|
Ethernet | 1 | 3.3V | - | - | - | Surface Mount | - | 135-QFN (12x12) |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
pacote: 256-BGA |
Estoque7.024 |
|
- | - | - | - | - | - | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microchip Technology |
IC SLIC 2CH UNIV 150V 64TQFP
|
pacote: - |
Estoque7.984 |
|
Parallel | 2 | 3.3V | 40mA | - | - | Surface Mount | - | 64-eTQFP |
||
Microchip Technology |
IC SLIC 1CH 52DB LGBAL 32PLCC
|
pacote: 32-LCC (J-Lead) |
Estoque6.592 |
|
2-Wire | 1 | 4.75V ~ 5.25V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Renesas Electronics Corporation |
TQFP 14.00X14.00X1.40 MM, 0.50MM
|
pacote: - |
Request a Quote |
|
JTAG, WAN | 1 | 3.135V ~ 3.465V | 305mA | 1.1 W | -40°C ~ 85°C | Surface Mount | 100-LQFP Exposed Pad | 100-TQFP (14x14) |
||
Broadcom Limited |
212, BONDED 106, V/ADSL, 2.5G GW
|
pacote: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
160G ENTERPRISE ETHERNET SWITCH
|
pacote: - |
Estoque120 |
|
SPI | - | - | - | - | 0°C ~ 105°C | Surface Mount | 888-BGA, FCBGA | 888-FCBGA (25x25) |
||
Renesas Electronics Corporation |
OCTAL E1 SHORT HAUL LIU
|
pacote: - |
Request a Quote |
|
E1 | 8 | 3.13V ~ 3.47V | 60mA | - | -40°C ~ 85°C | Surface Mount | 144-LQFP Exposed Pad | 144-TQFP (20x20) |
||
CML Microcircuits |
IC TELECOM INTERFACE 64VQFN
|
pacote: - |
Estoque60 |
|
C-Bus | 1 | 3V ~ 3.6V | 670µA | 3.5 W | -40°C ~ 85°C | Surface Mount | 64-VFQFN Exposed Pad | 64-VQFN (9x9) |