Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
IC CODEC VOIP 100-TQFP
|
pacote: 100-LQFP |
Estoque3.312 |
|
Parallel, PCM, Serial | 1 | - | - | - | - | Surface Mount | 100-LQFP | PG-TQFP-100 |
|
|
Infineon Technologies |
IC SLIC VOICE ACCESS PDSO-20
|
pacote: 20-SOIC (0.433", 11.00mm Width) Exposed Pad |
Estoque5.728 |
|
IOM-2, PCM | 2 | 5V | 105mA | - | - | Surface Mount | 20-SOIC (0.433", 11.00mm Width) Exposed Pad | P-DSO-20 |
|
|
Infineon Technologies |
IC SLIC VOICE ACCESS VQFN-48
|
pacote: 48-VFQFN Exposed Pad |
Estoque7.712 |
|
IOM-2, PCM | 2 | 3.3 V ~ 5 V | 105mA | - | - | Surface Mount | 48-VFQFN Exposed Pad | PG-VQFN-48-4 |
|
|
Microsemi Corporation |
IC DGTL SWITCH F8KDX 196BGA
|
pacote: 196-BGA |
Estoque6.160 |
|
- | 1 | 3 V ~ 3.6 V | 160mA | - | -40°C ~ 85°C | Surface Mount | 196-BGA | 196-PBGA (15x15) |
|
|
|
Microsemi Corporation |
IC SYNCHRONIZER T1/E1 44PLCC
|
pacote: 44-LCC (J-Lead) |
Estoque5.200 |
|
- | 1 | 4.5 V ~ 5.5 V | 90mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC |
|
|
|
Maxim Integrated |
IC FRAMER QUAD DS3/E3 144TCBGA
|
pacote: 144-BGA, CSPBGA |
Estoque3.968 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 290mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-CSPBGA (13x13) |
|
|
Maxim Integrated |
IC CTRLR HDLC 256-CHANNEL 256BGA
|
pacote: 256-BGA |
Estoque5.360 |
|
Serial | - | 3 V ~ 3.6 V | 500mA | - | 0°C ~ 70°C | Surface Mount | 256-BGA | 256-BGA (27x27) |
|
|
|
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 28DFN
|
pacote: 28-VDFN Exposed Pad |
Estoque3.472 |
|
- | 1 | 4.5 V ~ 5.5 V | 700µA | 10.5W | -40°C ~ 110°C | Surface Mount | 28-VDFN Exposed Pad | 28-DFN |
|
|
Maxim Integrated |
IC LIU E1/T1/J1 QUAD 5V 144-BGA
|
pacote: 144-BBGA |
Estoque7.944 |
|
LIU | - | 4.75 V ~ 5.25 V | 95mA | - | 0°C ~ 70°C | Surface Mount | 144-BBGA | 144-PBGA (17x17) |
|
|
|
Microsemi Corporation |
IC CESOP PROCESSOR 128CH 552BGA
|
pacote: 552-BGA |
Estoque16.404 |
|
TDM | 1 | 1.65 V ~ 1.95 V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
|
|
Silicon Labs |
IC DAA ENH GLOB LINE-SIDE 16SOIC
|
pacote: 16-SOIC (0.154", 3.90mm Width) |
Estoque3.488 |
|
- | 1 | - | 9mA | - | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
|
|
|
Silicon Labs |
IC PROSLIC FXS DUAL -114V 60QFN
|
pacote: 60-WFQFN Exposed Pad |
Estoque5.520 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 60-WFQFN Exposed Pad | 60-QFN (8x8) |
|
|
|
Microsemi Corporation |
IC SLIC 2CH 53DB 44TQFP
|
pacote: 44-TQFP Exposed Pad |
Estoque501.816 |
|
2-Wire | 2 | 4.75 V ~ 5.25 V | - | - | -40°C ~ 85°C | Surface Mount | 44-TQFP Exposed Pad | 44-TQFP-EP (10x10) |
|
|
|
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 16-SOIC
|
pacote: 16-SOIC (0.295", 7.50mm Width) |
Estoque6.560 |
|
- | 1 | 4.5 V ~ 5.5 V | - | 10mW | -40°C ~ 110°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
|
|
|
Broadcom Limited |
INTEGRATED GBE CONTROLLER
|
pacote: 676-BGA |
Estoque6.784 |
|
PCI | 2 | - | - | - | - | Surface Mount | 676-BGA | 676-PBGA (27x27) |
|
|
Microchip Technology |
IC SWITCH ETHERNET 12-PORT
|
pacote: 672-BGA |
Estoque7.072 |
|
- | 1 | 1V | - | - | - | Surface Mount | 672-BGA | 672-HSBGA (27x27) |
|
|
Microchip Technology |
IC ETHERNET CLK OUTPUTS 256BGA
|
pacote: - |
Estoque7.536 |
|
- | 1 | - | - | - | - | Surface Mount | - | 256-BGA (17x17) |
|
|
|
Broadcom Limited |
DUAL CORE
|
pacote: - |
Estoque7.248 |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
IC SLIC 1CH UNIV 85V 28PLCC
|
pacote: - |
Estoque7.008 |
|
Parallel | 1 | 3.3V | 40mA | - | - | Surface Mount | - | 28-PLCC |
|
|
|
Microchip Technology |
IC SLIC 2CH 53DB 44TQFP
|
pacote: 44-TQFP Exposed Pad |
Estoque3.376 |
|
2-Wire | 2 | 4.75V ~ 5.25V | - | - | -40°C ~ 85°C | Surface Mount | 44-TQFP Exposed Pad | 44-TQFP-EP (10x10) |
|
|
|
Microchip Technology |
ARROW 2488, PB FREE
|
pacote: - |
Estoque6.800 |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Infineon Technologies |
IPAC-X ISDN PC ADAPTER CIRCUIT
|
pacote: - |
Request a Quote |
|
IOM-2 | 1 | 3.135V ~ 3.465V | - | - | 0°C ~ 70°C | Surface Mount | 64-LQFP | PG-TQFP-64-1 |
|
|
|
Analog Devices Inc./Maxim Integrated |
1 LINE INTERFACE UNIT
|
pacote: - |
Request a Quote |
|
- | 1 | 4.75V ~ 5.25V | 155mA | 930 mW | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
|
|
|
Infineon Technologies |
BIPOLAR SLIC, 2-4 CONVERSION
|
pacote: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Agere Systems |
MULTICHANNEL LAPD CONTROLLER
|
pacote: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Infineon Technologies |
NETWORK TERMINATION CONTROLLER
|
pacote: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Infineon Technologies |
ISDN D-CHANNEL EXCH. CONTROLLER
|
pacote: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Harris Corporation |
EIA/ITU PABX SLIC
|
pacote: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -42V ~ -58V, 10.8V ~ 13.2V | - | 580 mW | 0°C ~ 75°C | Through Hole | 24-CDIP (0.600", 15.24mm) | 24-CERDIP |
|
|
|
Analog Devices Inc./Maxim Integrated |
DS2153 E1 SINGLE-CHIP TRANSCVR
|
pacote: - |
Request a Quote |
|
E1 | 1 | 4.75V ~ 5.25V | 65mA | - | 0°C ~ 70°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
|
|
|
Harris Corporation |
EIA/ITU 24V PABX SLIC
|
pacote: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -20V ~ -28V, 4.75V ~ 5.25V | - | 60 mW | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
