Página 16 - Integrado - microcontrolador, microprocessador, módulos FPGA | Circuitos integrados | Heisener Electronics
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Integrado - microcontrolador, microprocessador, módulos FPGA

Registros 1.650
Página  16/59
Imagem
Nº de peças
Fabricante
Descrição
pacote
Estoque
Quantidade
Core Processor
Co-Processor
Speed
Flash Size
RAM Size
Connector Type
Size / Dimension
Operating Temperature
SOMMCF5485-INV01-0703R-A
Logic

MODULE FIRE ENGINE

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
pacote: -
Estoque2.304
-
-
-
-
-
-
-
-
TE0600-02BM
Trenz Electronic GmbH

SOM GIGABEE XC6SLX100 2X512MB 2I

  • Module/Board Type: FPGA
  • Core Processor: Spartan-6 LX-100
  • Co-Processor: -
  • Speed: 125MHz
  • Flash Size: 16MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: 0°C ~ 70°C
pacote: -
Estoque7.504
Spartan-6 LX-100
-
125MHz
16MB
1GB
Samtec LSHM
1.97" x 1.57" (50mm x 40mm)
0°C ~ 70°C
SOMDM3730-32-1780AKIR
Logic

SOM TORPEDO WIRELESS 800MHZ IND

  • Module/Board Type: MPU, DSP Core
  • Core Processor: ARM? Cortex?-A8, DM3730
  • Co-Processor: TMS320C64x (DSP)
  • Speed: 800MHz
  • Flash Size: 512MB
  • RAM Size: 256MB
  • Connector Type: Board-to-Board (BTB) Socket - 200
  • Size / Dimension: 0.59" x 1.3" (15mm x 33mm)
  • Operating Temperature: -40°C ~ 85°C
pacote: -
Estoque5.792
ARM? Cortex?-A8, DM3730
TMS320C64x (DSP)
800MHz
512MB
256MB
Board-to-Board (BTB) Socket - 200
0.59" x 1.3" (15mm x 33mm)
-40°C ~ 85°C
CC-9P-V527UJ-S
Digi International

MOD 9P 32MB SDRAM 8MB FLASH

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
pacote: -
Estoque2.496
-
-
-
-
-
-
-
-
SOMXOMAPL138-10-1602AHCR
Logic

SYSTEM ON MODULE LV OMAPL138

  • Module/Board Type: MPU, DSP Core
  • Core Processor: ARM926EJ-S, OMAP-L138
  • Co-Processor: TMS320C6748
  • Speed: 375MHz
  • Flash Size: 8MB
  • RAM Size: 128MB
  • Connector Type: Board-to-Board (BTB) Socket - 300
  • Size / Dimension: 1.18" x 1.57" (30mm x 40mm)
  • Operating Temperature: 0°C ~ 70°C
pacote: -
Estoque5.776
ARM926EJ-S, OMAP-L138
TMS320C6748
375MHz
8MB
128MB
Board-to-Board (BTB) Socket - 300
1.18" x 1.57" (30mm x 40mm)
0°C ~ 70°C
101-1051
Digi International

MODULE MEMORY CORE RCM3365

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 3000
  • Co-Processor: -
  • Speed: 44.2MHz
  • Flash Size: 512KB (Internal), 32MB (External)
  • RAM Size: 1MB
  • Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card
  • Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
  • Operating Temperature: 0°C ~ 70°C
pacote: -
Estoque5.536
Rabbit 3000
-
44.2MHz
512KB (Internal), 32MB (External)
1MB
2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card
1.85" x 2.73" (47mm x 69mm)
0°C ~ 70°C
101-0691
Digi International

MODULE RABBITCORE RCM3300

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 3000
  • Co-Processor: -
  • Speed: 44.2MHz
  • Flash Size: 512KB (Internal), 8MB (External)
  • RAM Size: 1MB
  • Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5
  • Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
  • Operating Temperature: -40°C ~ 70°C
pacote: -
Estoque6.944
Rabbit 3000
-
44.2MHz
512KB (Internal), 8MB (External)
1MB
2 IDC Headers 2x17, 1 IDC Header 2x5
1.85" x 2.73" (47mm x 69mm)
-40°C ~ 70°C
CC-MX-LB58-ZM
Digi International

MODULE I.MX51 800MHZ 256MB FLASH

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
pacote: -
Estoque7.248
-
-
-
-
-
-
-
-
DC-ME-Y402-JT
Digi International

MOD ME 9210 8MB SDRAM 4MB FLASH

  • Module/Board Type: MPU Core
  • Core Processor: ARM926EJ-S, NS9210
  • Co-Processor: -
  • Speed: 75MHz
  • Flash Size: 4MB
  • RAM Size: 8MB
  • Connector Type: RJ45
  • Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
  • Operating Temperature: -40°C ~ 80°C
pacote: -
Estoque4.480
ARM926EJ-S, NS9210
-
75MHz
4MB
8MB
RJ45
1.45" x 0.75" (36.7mm x 19.1mm)
-40°C ~ 80°C
TE0715-04-12S-1C
Trenz Electronic GmbH

SOM ZYNQ Z-7012S 1GB DDR3L SDRAM

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7012S)
  • Speed: 766MHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: 0°C ~ 70°C
pacote: -
Estoque4.976
ARM Cortex-A9
Zynq-7000 (Z-7012S)
766MHz
32MB
1GB
Samtec LSHM
1.97" x 1.57" (50mm x 40mm)
0°C ~ 70°C
TE0725-03-35-2C
Trenz Electronic GmbH

SOM FPGA ARTIX-7 35T FLASH 2C

  • Module/Board Type: FPGA
  • Core Processor: Artix-7 A35T
  • Co-Processor: -
  • Speed: 100MHz
  • Flash Size: 32MB
  • RAM Size: -
  • Connector Type: 50 Pin
  • Size / Dimension: 2.87" x 1.38" (73mm x 35mm)
  • Operating Temperature: 0°C ~ 70°C
pacote: -
Estoque6.544
Artix-7 A35T
-
100MHz
32MB
-
50 Pin
2.87" x 1.38" (73mm x 35mm)
0°C ~ 70°C
DC-ME-01T-C
Digi International

ME 8MB SDRAM 2MB FLASH SINGLE

  • Module/Board Type: MPU Core
  • Core Processor: ARM7TDMI, NS7520
  • Co-Processor: -
  • Speed: 55MHz
  • Flash Size: 2MB
  • RAM Size: 8MB
  • Connector Type: RJ45
  • Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
  • Operating Temperature: -40°C ~ 85°C
pacote: -
Estoque8.256
ARM7TDMI, NS7520
-
55MHz
2MB
8MB
RJ45
1.45" x 0.75" (36.7mm x 19.1mm)
-40°C ~ 85°C
L138-DG-225-RI
Critical Link LLC

MITYDSP-L138F SOM OMAP-L138

  • Module/Board Type: MPU, DSP, FPGA Core
  • Core Processor: ARM926EJ-S, OMAP-L138
  • Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA)
  • Speed: 375MHz
  • Flash Size: 256MB (NAND), 8MB (NOR)
  • RAM Size: 8KB (Internal MPU), 256KB (Internal DSP), 128MB (External)
  • Connector Type: SO-DIMM-200
  • Size / Dimension: 2.66" x 2" (67.6mm x 50.8mm)
  • Operating Temperature: -40°C ~ 85°C
pacote: -
Estoque6.744
ARM926EJ-S, OMAP-L138
TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA)
375MHz
256MB (NAND), 8MB (NOR)
8KB (Internal MPU), 256KB (Internal DSP), 128MB (External)
SO-DIMM-200
2.66" x 2" (67.6mm x 50.8mm)
-40°C ~ 85°C
20-101-0673
Digi International

MODULE RABBITCORE RCM3610

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 3000
  • Co-Processor: -
  • Speed: 22.1MHz
  • Flash Size: 256KB
  • RAM Size: 128KB
  • Connector Type: IDC Header 2x20
  • Size / Dimension: 1.23" x 2.11" (31mm x 54mm)
  • Operating Temperature: -40°C ~ 85°C
pacote: -
Estoque8.628
Rabbit 3000
-
22.1MHz
256KB
128KB
IDC Header 2x20
1.23" x 2.11" (31mm x 54mm)
-40°C ~ 85°C
TE0722-02I
Trenz Electronic GmbH

SOM ZYNQ SOFT PROPELLER 40DIP

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7010)
  • Speed: 33MHz
  • Flash Size: 16MB
  • RAM Size: -
  • Connector Type: 40 Pin
  • Size / Dimension: 0.71" x 2.01" (18mm x 51mm)
  • Operating Temperature: -40°C ~ 85°C
pacote: -
Estoque6.096
ARM Cortex-A9
Zynq-7000 (Z-7010)
33MHz
16MB
-
40 Pin
0.71" x 2.01" (18mm x 51mm)
-40°C ~ 85°C
20-101-1051
Digi International

MODULE RABBITCORE RCM3365

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 3000
  • Co-Processor: -
  • Speed: 44.2MHz
  • Flash Size: 512KB (Internal), 32MB (External)
  • RAM Size: 1MB
  • Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card
  • Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
  • Operating Temperature: 0°C ~ 70°C
pacote: -
Estoque6.016
Rabbit 3000
-
44.2MHz
512KB (Internal), 32MB (External)
1MB
2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card
1.85" x 2.73" (47mm x 69mm)
0°C ~ 70°C
DC-ME-01T-STL
Digi International

MODULE DIGI CONNECT ME

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
pacote: -
Estoque3.216
-
-
-
-
-
-
-
-
TE0820-05-3AE21MA
Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

  • Module/Board Type: MPU Core
  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
  • Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: Pin(s)
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 85°C
pacote: -
Request a Quote
ARM® Cortex®-A53, ARM® Cortex®-R5
Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E
-
128MB
2GB
Pin(s)
1.970" L x 1.570" W (50.00mm x 40.00mm)
0°C ~ 85°C
FORLINX-FET1028A-C-152GOE16M8GIA12
Forlinx Embedded

NXP LS1028ASOM,2GB DDR4,8GB eMMC

  • Module/Board Type: MPU
  • Core Processor: ARM® Cortex®-A72
  • Co-Processor: -
  • Speed: 1.5GHz
  • Flash Size: 8GB eMMC, 16Mb QSPI
  • RAM Size: 2GB
  • Connector Type: Board-to-Board (BTB) Socket - 160
  • Size / Dimension: 1.653" L x 2.559" W (42.00mm x 65.00mm)
  • Operating Temperature: -40°C ~ 85°C
pacote: -
Request a Quote
ARM® Cortex®-A72
-
1.5GHz
8GB eMMC, 16Mb QSPI
2GB
Board-to-Board (BTB) Socket - 160
1.653" L x 2.559" W (42.00mm x 65.00mm)
-40°C ~ 85°C
TE0745-02-92I11-AK
Trenz Electronic GmbH

MOD SOM DDR3L 1GB

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7045)
  • Speed: -
  • Flash Size: 64MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) Socket - 480
  • Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature: -40°C ~ 85°C
pacote: -
Request a Quote
ARM Cortex-A9
Zynq-7000 (Z-7045)
-
64MB
1GB
Board-to-Board (BTB) Socket - 480
2.050" L x 2.990" W (52.00mm x 76.00mm)
-40°C ~ 85°C
TE0741-04-D2C-1-A
Trenz Electronic GmbH

MODULE FPGA KINTEX

  • Module/Board Type: FPGA Core
  • Core Processor: Xilinx Kintex-7 FPGA XC7K325T-2FBG676C
  • Co-Processor: -
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: -
  • Connector Type: Board-to-Board (BTB) Socket
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 70°C
pacote: -
Request a Quote
Xilinx Kintex-7 FPGA XC7K325T-2FBG676C
-
-
32MB
-
Board-to-Board (BTB) Socket
1.970" L x 1.570" W (50.00mm x 40.00mm)
0°C ~ 70°C
TE0722-04-11C-4-A
Trenz Electronic GmbH

DIPFORTY1 "SOFT PROPELLER" MIT A

  • Module/Board Type: FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Xilinx Zynq 7: XC7Z007S-1CLG225C
  • Speed: -
  • Flash Size: 16MB
  • RAM Size: -
  • Connector Type: 2 x 20 Pin
  • Size / Dimension: 2.008" L x 0.709" W (51.00mm x 18.00mm)
  • Operating Temperature: 0°C ~ 70°C
pacote: -
Request a Quote
ARM Cortex-A9
Xilinx Zynq 7: XC7Z007S-1CLG225C
-
16MB
-
2 x 20 Pin
2.008" L x 0.709" W (51.00mm x 18.00mm)
0°C ~ 70°C
SOMDM3730-11-2782IFCR
Beacon EmbeddedWorks

SYSTEM ON MODULE DM3730

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
pacote: -
Request a Quote
-
-
-
-
-
-
-
-
TE0600-03IC2
Trenz Electronic GmbH

IC MODULE GIGABEE

  • Module/Board Type: FPGA Core
  • Core Processor: Spartan-6 LX-45
  • Co-Processor: -
  • Speed: 125MHz
  • Flash Size: 16MB
  • RAM Size: 256MB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
pacote: -
Request a Quote
Spartan-6 LX-45
-
125MHz
16MB
256MB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)
-40°C ~ 85°C
IW-G30M-C4CG-4E002G-E008G-BIA
iWave Systems

ZU4CG (-1 Speed) MPSoC SOM

  • Module/Board Type: MPU, FPG
  • Core Processor: ARM® Cortex®-A53(x40, ARM® Cortex®-R5(x2)
  • Co-Processor: ARM® Mali 400 MP2
  • Speed: 1.5GHz, 600MHz
  • Flash Size: 8GB eMMC
  • RAM Size: 4GB, 1GB
  • Connector Type: 2 x 240 Pin
  • Size / Dimension: 4.330" L x 2.950" W (110.00mm x 75.00mm)
  • Operating Temperature: -40°C ~ 85°C
pacote: -
Request a Quote
ARM® Cortex®-A53(x40, ARM® Cortex®-R5(x2)
ARM® Mali 400 MP2
1.5GHz, 600MHz
8GB eMMC
4GB, 1GB
2 x 240 Pin
4.330" L x 2.950" W (110.00mm x 75.00mm)
-40°C ~ 85°C
TE0712-02-81I36-AC
Trenz Electronic GmbH

FPGA MODULE ARTIX7

  • Module/Board Type: FPGA Core
  • Core Processor: Artix-7 A200T
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
pacote: -
Request a Quote
Artix-7 A200T
-
200MHz
32MB
1GB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)
-40°C ~ 85°C
TE0745-02-81C31-AK
Trenz Electronic GmbH

MOD SOM DDR3L 1GB

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7035)
  • Speed: -
  • Flash Size: 64MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) Socket - 480
  • Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature: -40°C ~ 85°C
pacote: -
Request a Quote
ARM Cortex-A9
Zynq-7000 (Z-7035)
-
64MB
1GB
Board-to-Board (BTB) Socket - 480
2.050" L x 2.990" W (52.00mm x 76.00mm)
-40°C ~ 85°C
TE0865-02-ABI21MA
Trenz Electronic GmbH

MPSOC MODULE WITH ZYNQ ULTRASCAL

  • Module/Board Type: MPU Core
  • Core Processor: Zynq™ UltraScale+™ XCZU11EG-1FFVC1760I
  • Co-Processor: -
  • Speed: -
  • Flash Size: 256MB
  • RAM Size: 4GB
  • Connector Type: Board-to-Board (BTB) Socket
  • Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm)
  • Operating Temperature: 0°C ~ 85°C
pacote: -
Request a Quote
Zynq™ UltraScale+™ XCZU11EG-1FFVC1760I
-
-
256MB
4GB
Board-to-Board (BTB) Socket
3.937" L x 2.953" W (100.00mm x 75.00mm)
0°C ~ 85°C