Página 14 - Integrado - microcontrolador, microprocessador, módulos FPGA | Circuitos integrados | Heisener Electronics
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Integrado - microcontrolador, microprocessador, módulos FPGA

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Imagem
Nº de peças
Fabricante
Descrição
pacote
Estoque
Quantidade
Core Processor
Co-Processor
Speed
Flash Size
RAM Size
Connector Type
Size / Dimension
Operating Temperature
CC-9P-V524-CC
Digi International

CONNECTCORE 9P

  • Module/Board Type: MPU Core
  • Core Processor: ARM926EJ-S, NS9215
  • Co-Processor: -
  • Speed: 150MHz
  • Flash Size: 16MB
  • RAM Size: 32MB
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -40°C ~ 85°C
pacote: -
Estoque6.608
ARM926EJ-S, NS9215
-
150MHz
16MB
32MB
-
-
-40°C ~ 85°C
TE0741-02-160-2CF
Trenz Electronic GmbH

SOM KINTEX-7 160T 32MB FLASH AES

  • Module/Board Type: FPGA
  • Core Processor: Kintex-7 160T
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 32MB
  • RAM Size: -
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: 0°C ~ 70°C
pacote: -
Estoque5.040
Kintex-7 160T
-
200MHz
32MB
-
Samtec LSHM
1.97" x 1.57" (50mm x 40mm)
0°C ~ 70°C
TE0725-02-100-2C
Trenz Electronic GmbH

SOM ARTIX-7 100T FLASH 2C

  • Module/Board Type: FPGA
  • Core Processor: Artix-7 A100T
  • Co-Processor: -
  • Speed: 100MHz
  • Flash Size: 32MB
  • RAM Size: -
  • Connector Type: 50 Pin
  • Size / Dimension: 2.87" x 1.38" (73mm x 35mm)
  • Operating Temperature: 0°C ~ 70°C
pacote: -
Estoque5.424
Artix-7 A100T
-
100MHz
32MB
-
50 Pin
2.87" x 1.38" (73mm x 35mm)
0°C ~ 70°C
DLP-2232H-PSOC5
DLP Design Inc.

MODULE PSOC5 USB ADAPTER FT2232H

  • Module/Board Type: MCU, USB Core
  • Core Processor: CY8C5588
  • Co-Processor: FT2232H
  • Speed: 67MHz
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Connector Type: USB - B, Pin Header
  • Size / Dimension: 3" x 1.2" (76.2mm x 30.5mm)
  • Operating Temperature: 0°C ~ 70°C
pacote: -
Estoque6.272
CY8C5588
FT2232H
67MHz
256KB
64KB
USB - B, Pin Header
3" x 1.2" (76.2mm x 30.5mm)
0°C ~ 70°C
20-101-0698
Digi International

MODULE RABBITCORE RCM3310

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 3000
  • Co-Processor: -
  • Speed: 44.2MHz
  • Flash Size: 512KB (Internal), 4MB (External)
  • RAM Size: 1MB
  • Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5
  • Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
  • Operating Temperature: -40°C ~ 70°C
pacote: -
Estoque7.712
Rabbit 3000
-
44.2MHz
512KB (Internal), 4MB (External)
1MB
2 IDC Headers 2x17, 1 IDC Header 2x5
1.85" x 2.73" (47mm x 69mm)
-40°C ~ 70°C
CENGLH7A404-11-504HCR-A
Logic

CARD ENGINE 64MB SDRAM

  • Module/Board Type: MPU Core
  • Core Processor: ARM922T, LH7A404
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 32MB
  • RAM Size: 64MB
  • Connector Type: SO-DIMM-144
  • Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
  • Operating Temperature: 0°C ~ 70°C
pacote: -
Estoque2.176
ARM922T, LH7A404
-
200MHz
32MB
64MB
SO-DIMM-144
2.37" x 2.67" (60.2mm x 67.8mm)
0°C ~ 70°C
101-0561
Digi International

MODULE RABBITCORE RCM3400 W/AD

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 3000
  • Co-Processor: -
  • Speed: 29.4MHz
  • Flash Size: 512KB
  • RAM Size: 512KB
  • Connector Type: 2 IDC Headers 2x17
  • Size / Dimension: 1.16" x 1.38" (29.5mm x 34.9mm)
  • Operating Temperature: -40°C ~ 85°C
pacote: -
Estoque5.760
Rabbit 3000
-
29.4MHz
512KB
512KB
2 IDC Headers 2x17
1.16" x 1.38" (29.5mm x 34.9mm)
-40°C ~ 85°C
BS2E-IC
Parallax Inc.

BASIC STAMP 2E MODULE

  • Module/Board Type: MCU Core
  • Core Processor: SX28AC
  • Co-Processor: -
  • Speed: 20MHz
  • Flash Size: 16KB EEPROM
  • RAM Size: 32B
  • Connector Type: -
  • Size / Dimension: 1.2" x 0.6" (30mm x 15mm)
  • Operating Temperature: 0°C ~ 70°C
pacote: -
Estoque2.368
SX28AC
-
20MHz
16KB EEPROM
32B
-
1.2" x 0.6" (30mm x 15mm)
0°C ~ 70°C
TE0600-03IVFN
Trenz Electronic GmbH

FPGA MICROMOD SPARTAN-6 LX

  • Module/Board Type: FPGA
  • Core Processor: Spartan-6 LX-150
  • Co-Processor: -
  • Speed: 125MHz
  • Flash Size: 16MB
  • RAM Size: 256MB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: -40°C ~ 85°C
pacote: -
Estoque5.216
Spartan-6 LX-150
-
125MHz
16MB
256MB
Samtec LSHM
1.97" x 1.57" (50mm x 40mm)
-40°C ~ 85°C
L138-FI-225-RC
Critical Link LLC

MITYDSP-L138F SOM OMAP-L138

  • Module/Board Type: MPU, DSP, FPGA Core
  • Core Processor: ARM926EJ-S, OMAP-L138
  • Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)
  • Speed: 456MHz
  • Flash Size: 256MB (NAND), 8MB (NOR)
  • RAM Size: 8KB (Internal MPU), 256KB (Internal DSP), 128MB (External)
  • Connector Type: SO-DIMM-200
  • Size / Dimension: 2.66" x 2" (67.6mm x 50.8mm)
  • Operating Temperature: 0°C ~ 70°C
pacote: -
Estoque6.800
ARM926EJ-S, OMAP-L138
TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)
456MHz
256MB (NAND), 8MB (NOR)
8KB (Internal MPU), 256KB (Internal DSP), 128MB (External)
SO-DIMM-200
2.66" x 2" (67.6mm x 50.8mm)
0°C ~ 70°C
20-101-1246
Digi International

CORE MODULE RCM5400W

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 5000
  • Co-Processor: -
  • Speed: 73.73MHz
  • Flash Size: 1.5MB
  • RAM Size: 1MB
  • Connector Type: IDC Header 2x25, 2x5, 1xAntenna
  • Size / Dimension: 1.84" x 2.85" (47mm x 72mm)
  • Operating Temperature: -30°C ~ 75°C
pacote: -
Estoque4.368
Rabbit 5000
-
73.73MHz
1.5MB
1MB
IDC Header 2x25, 2x5, 1xAntenna
1.84" x 2.85" (47mm x 72mm)
-30°C ~ 75°C
DC-EM-02T-C
Digi International

EM 8MB SDRAM 4MB FLASH SINGLE

  • Module/Board Type: MPU Core
  • Core Processor: ARM7TDMI, NS7520
  • Co-Processor: -
  • Speed: 55MHz
  • Flash Size: 4MB
  • RAM Size: 8MB
  • Connector Type: RJ45
  • Size / Dimension: 1.94" x 1.58" (49.2mm x 40.0mm)
  • Operating Temperature: -40°C ~ 85°C
pacote: -
Estoque6.048
ARM7TDMI, NS7520
-
55MHz
4MB
8MB
RJ45
1.94" x 1.58" (49.2mm x 40.0mm)
-40°C ~ 85°C
MOD5282-100IR
NetBurner Inc.

PROCESSOR MODULE 512KB FLASH

  • Module/Board Type: MCU, Ethernet Core
  • Core Processor: ColdFire 5282
  • Co-Processor: -
  • Speed: 66MHz
  • Flash Size: 512KB
  • RAM Size: 8.064MB
  • Connector Type: RJ-45, 2x50 Header
  • Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm)
  • Operating Temperature: -40°C ~ 85°C
pacote: -
Estoque7.152
ColdFire 5282
-
66MHz
512KB
8.064MB
RJ-45, 2x50 Header
2.6" x 2" (66.04mm x 50.8mm)
-40°C ~ 85°C
20-101-0561
Digi International

MODULE RABBITCORE RCM3400

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 3000
  • Co-Processor: -
  • Speed: 29.4MHz
  • Flash Size: 512KB
  • RAM Size: 512KB
  • Connector Type: 2 IDC Headers 2x17
  • Size / Dimension: 1.16" x 1.38" (29.5mm x 34.9mm)
  • Operating Temperature: -40°C ~ 85°C
pacote: -
Estoque15.492
Rabbit 3000
-
29.4MHz
512KB
512KB
2 IDC Headers 2x17
1.16" x 1.38" (29.5mm x 34.9mm)
-40°C ~ 85°C
TE0720-03-1CFA
Trenz Electronic GmbH

SOC MODULE 1GB DDR3

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7020)
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: 0°C ~ 70°C
pacote: -
Estoque6.576
ARM Cortex-A9
Zynq-7000 (Z-7020)
-
32MB
1GB
Samtec LSHM
1.97" x 1.57" (50mm x 40mm)
0°C ~ 70°C
XP1001000M-05R
Lantronix, Inc.

XPORT XE ROHS EXTENDED TEMP MODB

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
pacote: -
Estoque9.168
-
-
-
-
-
-
-
-
TEC0850-03-15EG1EA
Trenz Electronic GmbH

IC MODULE

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
pacote: -
Estoque2.656
-
-
-
-
-
-
-
-
TE0712-03-81I36-L
Trenz Electronic GmbH

FPGA MODULE ARTIX7

  • Module/Board Type: FPGA Core
  • Core Processor: Artix-7 XC7A200T-1I
  • Co-Processor: -
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) Socket
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
pacote: -
Request a Quote
Artix-7 XC7A200T-1I
-
-
32MB
1GB
Board-to-Board (BTB) Socket
1.970" L x 1.570" W (50.00mm x 40.00mm)
-40°C ~ 85°C
TE0808-05-9GI81-A
Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
pacote: -
Request a Quote
-
-
-
-
-
-
-
-
ME-XU1-9EG-2I-D12E-G1-R4-2
Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU9EG

  • Module/Board Type: FPGA
  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
  • Co-Processor: -
  • Speed: 600MHz, 1.5GHz
  • Flash Size: 16GB
  • RAM Size: 4GB
  • Connector Type: 168 Pin
  • Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
  • Operating Temperature: -40°C ~ 85°C
pacote: -
Request a Quote
ARM® Cortex®-A53, ARM® Cortex®-R5
-
600MHz, 1.5GHz
16GB
4GB
168 Pin
2.910" L x 2.130" W (74.00mm x 54.00mm)
-40°C ~ 85°C
TE0808-05-9BE21-LZ
Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH AMD

  • Module/Board Type: MPU Core
  • Core Processor: Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: Board-to-Board (BTB) Socket - 4 x 160
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: 0°C ~ 85°C
pacote: -
Request a Quote
Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E
-
-
128MB
4GB
Board-to-Board (BTB) Socket - 4 x 160
2.990" L x 2.050" W (76.00mm x 52.00mm)
0°C ~ 85°C
TE0741-04-A2I-1-A
Trenz Electronic GmbH

MODULE FPGA KINTEX

  • Module/Board Type: FPGA Core
  • Core Processor: Xilinx Kintex-7 FPGA XC7K70T-2FBG676I
  • Co-Processor: -
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: -
  • Connector Type: Board-to-Board (BTB) Socket
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
pacote: -
Request a Quote
Xilinx Kintex-7 FPGA XC7K70T-2FBG676I
-
-
32MB
-
Board-to-Board (BTB) Socket
1.970" L x 1.570" W (50.00mm x 40.00mm)
-40°C ~ 85°C
TE0807-03-4BE21-AK
Trenz Electronic GmbH

MPSOC MODULE TE0807 WITH ZYNQ UL

  • Module/Board Type: MPU Core
  • Core Processor: Zynq™ UltraScale+™ XCZU4EG-1FBVB900E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: Board-to-Board (BTB) Socket - 160
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: 0°C ~ 85°C
pacote: -
Request a Quote
Zynq™ UltraScale+™ XCZU4EG-1FBVB900E
-
-
128MB
4GB
Board-to-Board (BTB) Socket - 160
2.990" L x 2.050" W (76.00mm x 52.00mm)
0°C ~ 85°C
DC-VA-MEPG2-8B-60-1080-OPVXC-0000
System-On-Chip (SOC) Technologies Inc.

DECODER MEPG2 HD VID/AUD 8BIT

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
pacote: -
Request a Quote
-
-
-
-
-
-
-
-
ME-XU7-15EG-2I-D12E-R4
Enclustra FPGA Solutions

SOM ZYNQ US+ ZU15EG 4GB+2GB PL

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
pacote: -
Request a Quote
-
-
-
-
-
-
-
-
TE0712-02-71I01-M
Trenz Electronic GmbH

IC MODULE ARTIX7

  • Module/Board Type: FPGA Core
  • Core Processor: -
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
pacote: -
Request a Quote
-
-
200MHz
32MB
1GB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)
-40°C ~ 85°C
TE0818-02-9GI81-A
Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

  • Module/Board Type: MPU Core
  • Core Processor: Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: Board-to-Board (BTB) Socket - 4 x 240
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: -40°C ~ 85°C
pacote: -
Request a Quote
Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I
-
-
128MB
4GB
Board-to-Board (BTB) Socket - 4 x 240
2.990" L x 2.050" W (76.00mm x 52.00mm)
-40°C ~ 85°C
MYC-C7Z015-4E1D-766-I
MYIR Tech Limited

System-On-Module, Zynq-7015

  • Module/Board Type: MPU, FPGA
  • Core Processor: ARM® Cortex®-A9
  • Co-Processor: Zynq-7000 (Z-7015)
  • Speed: 766MHz
  • Flash Size: 4GB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) Socket
  • Size / Dimension: 2.950" L x 2.170" W (75.00mm x 55.00mm)
  • Operating Temperature: -40°C ~ 85°C
pacote: -
Request a Quote
ARM® Cortex®-A9
Zynq-7000 (Z-7015)
766MHz
4GB
1GB
Board-to-Board (BTB) Socket
2.950" L x 2.170" W (75.00mm x 55.00mm)
-40°C ~ 85°C