Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 1:4 40MHZ 16QFN
|
pacote: 16-WFQFN Exposed Pad |
Estoque6.576 |
|
1 | 1:4 | No/No | Crystal | LVCMOS | 40MHz | 1.62 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
ON Semiconductor |
IC CLK BUF 140MHZ 3.3V
|
pacote: 8-TSSOP (0.173", 4.40mm Width) |
Estoque4.848 |
|
1 | 1:4 | No/No | Clock | Clock | 140MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Diodes Incorporated |
IC CLK BUFFER 1:18 100MHZ 48SSOP
|
pacote: 48-BSSOP (0.295", 7.50mm Width) |
Estoque4.704 |
|
1 | 1:18 | No/No | TTL | TTL | 100MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
Silicon Labs |
IC CLK BUFFER 1:8 200MHZ 24QFN
|
pacote: 24-VFQFN Exposed Pad |
Estoque4.352 |
|
1 | 1:8 | Yes/No | CML, HCSL, LVDS, LVPECL | CMOS | 200MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:10 650MHZ 40VFQFPN
|
pacote: 40-VFQFN Exposed Pad |
Estoque5.904 |
|
1 | 2:10 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVPECL, LVTTL | LVDS | 650MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-VFQFPN (6x6) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:9 500MHZ 32TQFP
|
pacote: 32-LQFP |
Estoque5.792 |
|
1 | 2:9 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVHSTL | 500MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 200MHZ 8SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque4.416 |
|
1 | 1:4 | No/No | Clock | Clock | 200MHz | 1.425 V ~ 2.625 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 200MHZ 8SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque3.232 |
|
1 | 1:4 | No/No | Clock | Clock | 200MHz | 1.425 V ~ 2.625 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:9 28PLCC
|
pacote: 28-LCC (J-Lead) |
Estoque4.928 |
|
1 | 2:9 | Yes/Yes | PECL, TTL | PECL | - | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque5.040 |
|
1 | 1:2 | Yes/Yes | LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Texas Instruments |
IC CLK BUFFER 2:10 1.1GHZ 32LQFP
|
pacote: 32-LQFP |
Estoque6.336 |
|
1 | 2:10 | Yes/Yes | LVDS | LVDS | 1.1GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:2 266MHZ 14TSSOP
|
pacote: 14-TSSOP (0.173", 4.40mm Width) |
Estoque5.136 |
|
1 | 2:2 | No/Yes | LVCMOS, LVTTL | LVPECL | 266MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFF/DIVIDER/MUX 32VFQFN
|
pacote: 32-VFQFN Exposed Pad |
Estoque7.328 |
|
1 | 1:8 | Yes/Yes | LVDS, LVPECL | LVDS, LVPECL | 1.5GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:8 6GHZ 32MLF
|
pacote: 32-VFQFN Exposed Pad, 32-MLF? |
Estoque5.056 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, LVPECL | CML | 6GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
ON Semiconductor |
IC CLK BUFFER 1:2 6GHZ 8TSSOP
|
pacote: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Estoque5.536 |
|
1 | 1:2 | Yes/Yes | CML, LVCMOS, LVDS, LVNECL, LVPECL, LVTTL | ECL | 6GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:4 266MHZ 20VFQFPN
|
pacote: 20-VFQFN Exposed Pad |
Estoque4.976 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 266MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-VFQFN Exposed Pad | 20-VFQFPN (4x4) |
||
Microchip Technology |
IC CLK BUFFER 1:4 3.2GHZ 16MLF
|
pacote: 16-VFQFN Exposed Pad, 16-MLF? |
Estoque2.064 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | CML | 3.2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
ON Semiconductor |
IC CLK BUFFER 1:2 200MHZ LVCMOS
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque3.056 |
|
1 | 1:2 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 200MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 140MHZ 8TSSOP
|
pacote: 8-TSSOP (0.173", 4.40mm Width) |
Estoque7.168 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 140MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Diodes Incorporated |
CLOCK BUFFER TSSOP-16
|
pacote: - |
Estoque7.072 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
pacote: 12-TSSOP (0.118", 3.00mm Width) |
Estoque15.552 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Dialog Semiconductor GmbH |
A 1:3 CLOCK BUFFER. 26 MHZ. 1.8V
|
pacote: 10-UFDFN Exposed Pad |
Estoque3.088 |
|
1 | 1:3 | No/No | - | CMOS | 50MHz | 1.7 V ~ 1.9 V | -40°C ~ 85°C | Surface Mount | 10-UFDFN Exposed Pad | 10-STDFN (2x1) |
||
IDT, Integrated Device Technology Inc |
IC TIMING CLOCK
|
pacote: - |
Estoque6.160 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC TIMING CLOCK
|
pacote: - |
Estoque5.696 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
IC CLOCK BUFFER TSSOP
|
pacote: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
OS81082AHR-C2A-010500
|
pacote: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:20 250MHZ 80GQFN
|
pacote: - |
Estoque4.410 |
|
1 | 1:20 | Yes/Yes | Differential or Single-Ended | HCSL | 250 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 80-WFQFN Dual Rows, Exposed Pad | 80-GQFN (6x6) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:6 2GHZ 40VFQFPN
|
pacote: - |
Estoque15.000 |
|
2 | 1:6 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVDS | 2 GHz | 1.71V ~ 2.7V | -40°C ~ 85°C (TA) | Surface Mount | 40-VFQFN Exposed Pad | 40-VFQFPN (6x6) |