Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 650MHZ 20TSSOP
|
pacote: 20-TSSOP (0.173", 4.40mm Width) |
Estoque5.040 |
|
1 | 2:4 | Yes/Yes | Clock, Crystal | LVPECL | 650MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 2:9 500MHZ 32TQFP
|
pacote: 32-TQFP |
Estoque3.472 |
|
1 | 2:9 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:8 1.5GHZ 32MLF
|
pacote: 32-VFQFN Exposed Pad, 32-MLF? |
Estoque18.000 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, PECL | LVPECL | 1.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque2.400 |
|
1 | 1:2 | Yes/Yes | LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 1:4 8GHZ 16QFN
|
pacote: 16-VFQFN Exposed Pad |
Estoque3.232 |
|
1 | 1:4 | Yes/Yes | CML, LVCMOS, LVDS, LVPECL, LVTTL | LVPECL | 8GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
ON Semiconductor |
IC CLK BUFFER 1:8 400MHZ 32QFN
|
pacote: 32-VFQFN Exposed Pad |
Estoque3.920 |
|
1 | 1:8 | Yes/Yes | HCSL, LVCMOS, LVDS, LVPECL, LVTTL | HCSL, LVDS | 400MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Texas Instruments |
IC CLK BUFFER 3:9 3.1GHZ 40WQFN
|
pacote: 40-WFQFN Exposed Pad |
Estoque3.264 |
|
1 | 3:9 | Yes/Yes | CML, HCSL, HSTL, LVDS, LVPECL, SSTL, Crystal | HCSL, LVCMOS, LVDS, LVPECL | 3.1GHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 40-WFQFN Exposed Pad | 40-WQFN (6x6) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 166MHZ 20SSOP
|
pacote: 20-SSOP (0.209", 5.30mm Width) |
Estoque32.340 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | 166MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Diodes Incorporated |
IC CLK BUFFER 2:4 266MHZ 20TSSOP
|
pacote: 20-TSSOP (0.173", 4.40mm Width) |
Estoque35.748 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 266MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Diodes Incorporated |
CLOCK BUFFER SO-16
|
pacote: - |
Estoque6.800 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20SSOP
|
pacote: 20-SSOP (0.209", 5.30mm Width) |
Estoque81.600 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 100MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:8 1.2GHZ 28VQFN
|
pacote: 28-WFQFN Exposed Pad |
Estoque10.812 |
|
1 | 2:8 | Yes/Yes | CML, LVDS | LVDS | 1.2GHz | 1.71 V ~ 1.89 V | -40°C ~ 85°C | Surface Mount | 28-WFQFN Exposed Pad | 28-VFQFPN (5x5) |
||
Microchip Technology |
10 OUTPUT PROGRAMMABLE FANOUT BU
|
pacote: 56-VFQFN Exposed Pad |
Estoque5.408 |
|
1 | 4:10 | Yes/Yes | CMOS, Crystal | CML, CMOS, HCSL, HSTL, LVDS, LVPECL, SSTL | 1.035GHz | 1.71V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
Microchip Technology |
IC CLK BUFFER 1:6 750MHZ 32QFN
|
pacote: 32-VFQFN Exposed Pad |
Estoque6.304 |
|
1 | 1:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:2 750MHZ 16QFN
|
pacote: 16-VFQFN Exposed Pad |
Estoque4.960 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Renesas Electronics Corporation |
IC CLK TRANSLTR 1:1 350MHZ 8SOIC
|
pacote: - |
Request a Quote |
|
1 | 1:1 | Yes/Yes | LVDS, LVHSTL, SSTL, HCSL, LVPECL | LVCMOS, LVTTL | 350 MHz | 2.375V ~ 2.625V, 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Diodes Incorporated |
IC CLK BUFFER 1:20 400MHZ 80AQFN
|
pacote: - |
Estoque9.000 |
|
1 | 1:20 | Yes/Yes | CMOS, HCSL | HCSL | 400 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 80-VFQFN Dual Rows, Exposed Pad | 80-aQFN (6x6) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:4 2GHZ 28VFQFPN
|
pacote: - |
Estoque7.500 |
|
2 | 1:4 | Yes/Yes | CML, LVCMOS, LVDS, LVPECL | LVPECL | 2 GHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 28-WFQFN Exposed Pad | 28-VFQFPN (5x5) |