Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
IC CLK BUFFER 1:9 500MHZ 28PLCC
|
pacote: 28-LCC (J-Lead) |
Estoque3.376 |
|
1 | 1:9 | Yes/Yes | LVPECL | LVPECL | 500MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:4 160MHZ 16SOIC
|
pacote: 16-SOIC (0.295", 7.50mm Width) |
Estoque2.448 |
|
1 | 1:4 | Yes/Yes | PECL | TTL | 160MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:9 28SOIC
|
pacote: 28-SOIC (0.295", 7.50mm Width) |
Estoque10.728 |
|
1 | 2:9 | Yes/Yes | PECL, TTL | PECL | - | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 2:12 200MHZ 32TQFP
|
pacote: 32-TQFP |
Estoque7.504 |
|
1 | 2:12 | Yes/No | LVCMOS, LVPECL, LVTTL | LVCMOS, LVTTL | 200MHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:22 500MHZ 64TQFP
|
pacote: 64-TQFP Exposed Pad |
Estoque7.088 |
|
1 | 2:22 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
NXP |
IC CLK BUFFER 1:9 3GHZ 32LQFP
|
pacote: 32-LQFP |
Estoque5.168 |
|
1 | 1:9 | Yes/Yes | LVPECL | LVCMOS, LVPECL | 3GHz | 2.375 V ~ 3.465 V | 0°C ~ 110°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Analog Devices Inc. |
IC CLOCK BUFFER 1:4 24SMT
|
pacote: 24-TFCQFN Exposed Pad |
Estoque5.840 |
|
1 | 1:4 | Yes/Yes | CML | CML | 13GHz | -3 V ~ -3.6 V | -40°C ~ 85°C | Surface Mount | 24-TFCQFN Exposed Pad | 24-CSMT (4x4) |
||
ON Semiconductor |
IC CLK BUFFER 1:4 8GHZ 16QFN
|
pacote: 16-VFQFN Exposed Pad |
Estoque2.112 |
|
1 | 1:4 | Yes/Yes | CML, LVCMOS, LVDS, LVPECL, LVTTL | CML | 8GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Texas Instruments |
IC CLK BUFFER 2:10 1.1GHZ 32LQFP
|
pacote: 32-LQFP |
Estoque2.816 |
|
1 | 2:10 | Yes/Yes | LVDS | LVDS | 1.1GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLX 4:1 2GHZ 20TSSOP
|
pacote: 20-TSSOP (0.173", 4.40mm Width) |
Estoque5.136 |
|
1 | 4:1 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPX 2:2 250MHZ 16TSSOP
|
pacote: 16-TSSOP (0.173", 4.40mm Width) |
Estoque2.592 |
|
1 | 2:2 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SOIC
|
pacote: 20-SOIC (0.295", 7.50mm Width) |
Estoque5.760 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 1:2 1.5GHZ 8SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque261.720 |
|
1 | 1:2 | Yes/Yes | ECL, PECL | ECL, PECL | 1.5GHz | 4.2 V ~ 5.7 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Diodes Incorporated |
CLOCK SAW OSCILLATOR SEAM7050
|
pacote: - |
Estoque5.392 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
ON Semiconductor |
IC CLK BUFFER 1:1 200MHZ 8SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque3.696 |
|
1 | 1:1 | Yes/Yes | LVCMOS, LVDS | LVCMOS, LVDS | 200MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Diodes Incorporated |
IC CLK BUFFER 1:10 100MHZ 20SOIC
|
pacote: 20-SOIC (0.295", 7.50mm Width) |
Estoque7.568 |
|
1 | 1:10 | No/No | CMOS, TTL | CMOS, TTL | 100MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 250MHZ 8SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque6.288 |
|
1 | 1:2 | No/Yes | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20SOIC
|
pacote: 20-SOIC (0.295", 7.50mm Width) |
Estoque7.548 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 100MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Diodes Incorporated |
IC CLK BUFFER 2:4 800MHZ 20TSSOP
|
pacote: 20-TSSOP (0.173", 4.40mm Width) |
Estoque15.084 |
|
1 | 2:4 | Yes/Yes | CML, HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 800MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Silicon Labs |
IC CLK BUFFER 1:8 CMOS 24QFN
|
pacote: 24-VFQFN Exposed Pad |
Estoque13.932 |
|
1 | 1:8 | No/No | CMOS, HSTL, LVTTL, SSTL | CMOS | 200MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 250MHZ 16TSSOP
|
pacote: 16-TSSOP (0.173", 4.40mm Width) |
Estoque19.704 |
|
1 | 2:4 | Yes/No | CMOS, PECL | 3-State, CMOS | 250MHz | 2.375 V ~ 5.5 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Texas Instruments |
IC CLK BUFFER 1:2 800MHZ 16QFN
|
pacote: 16-VFQFN Exposed Pad |
Estoque9.612 |
|
1 | 1:2 | Yes/Yes | LVCMOS, LVPECL, LVTTL | LVCMOS, LVPECL | 800MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC NETWORK TIMING VFQFPN
|
pacote: 32-VFQFN Exposed Pad |
Estoque7.152 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 1GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK MANANGEMENT
|
pacote: - |
Estoque6.096 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
ON Semiconductor |
IC CLK BUFFER 1:2 8SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque6.732 |
|
1 | 1:2 | Yes/Yes | ECL | ECL | - | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacote: 32-VFQFN Exposed Pad |
Estoque3.264 |
|
1 | 1:8 | Yes/Yes | LVCMOS | LVCMOS, LVDS, LVPECL | 1.5GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC TIMING
|
pacote: 16-TSSOP (0.173", 4.40mm Width) |
Estoque5.968 |
|
1 | 2:1 | Yes/Yes | HCSL, LVDS, LVPECL | HCSL | 500MHz | 2.375V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
LOW SKEW, LOW ADDITIVE JITTER 2
|
pacote: 32-VFQFN Exposed Pad |
Estoque9.396 |
|
1 | 2:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | LVPECL | 1.6GHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |