OmniVision Group, the world's leading developer of semiconductor solutions for advanced digital imaging, analog, touch screen and display technologies, today released the industry's first and only three-layer stacked BSI global shutter (GS) image sensor OG0TB. This ultra-small size image sensor is used for eye and face tracking in AR/VR/MR and Metaverse consumer devices in a package size of only 1.64mm x 1.64mm with a 2.2 micron pixel size and a 1/14.46 inch optical format (OF ). With 400x400 resolution and ultra-low power consumption, this CMOS image sensor is ideal for small, lightweight wearables powered by batteries such as eye masks and glasses.
David Shin, Senior Product Marketing Manager, IoT/Emerging, OmniVision, said: "The OmniVision has developed the world's first three-layer stacked global shutter pixel technology and applied it without sacrificing performance. Leading the industry further in the ultra-small form factor GS image sensor. We have incorporated all features and functions into an ultra-small form factor 'ready-to-use' sensor, which gives designers the flexibility to mount cameras in some small form factor lightweight Ideal location for wearables.” He added: “Ultra-low power consumption is critical for battery-operated devices with 10 or more cameras per system, and the OG0TB BSI GS image sensor consumes power at 30 frames per second. Just under 7.2 milliwatts."
According to the latest data from the AR/VR Headset Market Quarterly Tracker1 released by the International Data Corporation (IDC), the global AR/VR headset market will grow by 92.1% year-on-year in 2021, with shipments reaching 11.2 million units. Emerging markets as well as broader demand for headsets from the commercial sector will further drive the market, with headset shipments expected to grow by 46.9% year-on-year in 2022. In fact, IDC expects global AR/VR headset shipments to exceed 50 million units in 2026, when the market will experience double-digit growth, with an expected compound annual growth rate (CAGR) of 35.1%.
