MEMS switch technology is a commercial reality

For the first time, ADI has made a breakthrough in the electronics industry to replace electromechanical relays designed 100 years ago. New RF MEMS ADI, so it can be faster, smaller, more work, the dawn of the development of the back line, usually caused by the relay to solve different performance constraints, switching the origin of the relay technology, the device is more reliable. To enable OEMs to bring this product to market and reduce the cost and power consumption of your test automation and test equipment (ATE) and other measurement tools for your customers, you can reduce the time to market for general-purpose products. Aerospace and defense MEMS relays, medical devices exchange a range of alternative products and future products for communications infrastructure equipment, The ADGM1304 ADGM1004 RF MEMS switch and traditional electromechanical relay have a reliability that is 95% smaller than the low power consumption of the first RF MEMS switch and the ADGM1004 ADGM1304, with 30 speeds and 10 times higher reliability. Unlike other switch options, such as solid-state relays, these switches have excellent accuracy in the RF intermediate frequency range from 0 Hz (DC) to 14 GHz. The electrostatically driven switch has a low-voltage, low-current driver IC in a silicone seal and lid that can drive a MEMS switch containing up to two chips for operational performance. The switching elements with metal contacts are electrostatic forces generated by the operation of a highly adjustable and highly reliable metal driver IC. The final packaging solution ensures best-in-class DC accuracy and RF performance, making the switch very easy to use. Mechanical relay, high reliability, long life 10 times longer than ADGM1004 cold switch ADGM1304 prolongs the life of ATE system and reduces the need for relay failure due to long downtime. In addition, the minimum height of the switch package allows designers to mount ATE test boards on both sides of the surface to increase channel density and reduce cost without increasing device area. The charge pump and sector structure, the size of the ATE system, and the reduced integration of multiplexer configuration and DPDT relays simplify the design, eliminating the need for external drivers.