Infineon's high-power modules help to drive energy saving electrified trains to decarburize | Heisener Electronics
Fale conosco
SalesDept@heisener.com +86-755-83210559 ext. 816
Language Translation

* Please refer to the English Version as our Official Version.

Infineon's high-power modules help to drive energy saving electrified trains to decarburize

Technology Cover
Data de postagem: 2023-05-16, Infineon Technologies

To meet global climate targets, transport must switch to greener vehicles, such as fuel-efficient electrified trains. However, trains operate under harsh operating conditions, requiring frequent acceleration and braking and reliable operation over a long service life. Therefore, they require energy efficient traction applications with high power density, high reliability and high quality. Infineon Technologies has responded to these needs by adding two new products to its CoolSiC™ power module portfolio: FF2000UXTR33T2M1 and FF2600UXTR33T2M1. These power modules feature the newly developed 3.3kV CoolSiC MosFEts and Infineon's.xt interconnect technology, packaged as XHP™ 2 and tailored specifically for traction applications.

    

These devices are designed for demanding applications such as traction and have been showcased at PCIM Europe 2023 in Nuremberg, Germany. "To enable environmentally friendly travel, rail technology requires the introduction of innovative semiconductor solutions specifically designed for these applications," said Dr. Peter Wawer, President of Infineon Technologies' Zero-Carbon Industrial Power Division. With low switching losses and higher switching frequencies, Infineon's new silicon carbide products help create greener, quieter trains. These characteristics are extremely important for the trains of the future."

     

In addition to the need for efficient and reliable silicon carbide (SiC) chips, traction driver power modules also require interconnect technology suitable for high-speed switch packaging and extended device life. Infineon's new power modules offer the following features: A CoolSiC MOSFET chip with an integrated diode in the Infineon XHP 2 package enables low switching losses while maintaining high reliability and power density.

The XHP 2 package also features low spurious inductance, a symmetrical and scalable design, and high current. The drain-source on resistance of FF2000UXTR33T2M1 is 2.0 mΩ, while the drain-source on resistance of FF2600UXTR33T2M1 is 2.6 mΩ. Despite the strict operational requirements of train operation, Infineon's.xt interconnect technology improves power cycle capability.

Compared to traditional solutions, Infineon's CoolSiC power module reduces the total energy consumption of the train motor and frequency converter by 10%. In addition, train drivers will benefit from more compact and lightweight frequency converters and simplified cooling systems. The new product will not only help Infineon Technologies, traction manufacturers and rail service operators to decarburize, but also reduce noise while the train is in motion, benefiting residents along the route. Infineon's SIC-based XHP 2 power module has been proven in a joint field test project between Siemens Transport and Munich Municipal Utility (SWM) trams in 2022. The test results show that the SiC - based power semiconductor significantly reduces engine operating noise.

      

Produtos relacionados