Fairchild Semiconductor - Shielded gate trench MOSFETs in TO-leadless packaging target autos (FDBL9406_F085) | Heisener Electronics
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Fairchild Semiconductor - Shielded gate trench MOSFETs in TO-leadless packaging target autos (FDBL9406_F085)

Technology Cover
Data de postagem: 2015-09-24, Fairchild/ON Semiconductor
Fairchild's innovative TO-LL devices have extremely low package resistance, a particularly small footprint, and have exceptionally good EMI behavior. The technology now offers a range of voltage levels specifically designed and certified for automotive applications. Fairchild's latest PowerTrench shielded trench technology combined with TO-LL packages provides lead-free MOSFETs with extremely low RDS (on) ranges. Advanced silicon technology and package design have excellent switching and EMI performance, which is particularly beneficial for switching and PWM control applications, and has been verified by early customers of the device. At the same time, the technology simplifies design, avoids additional passive components, and generally enables electronics manufacturers to better serve the high-current application market. Compared with other discrete packages, the number of parallel MOSFETs required for high current applications can be greatly reduced or even eliminated, thereby reducing overall system cost.