Winbond Electronics, a global leader in semiconductor storage solutions, announced that its new package 100BGA LPDDR4/4X complies with the JEDEC JED209-4 standard, which can achieve energy saving and carbon reduction. The product can significantly reduce PCB size for a more compact design for IoT applications that require higher data throughput in a small package.
Winbond Electronics has announced key improvements to the ultra-high speed performance of its DDR3 products. Its 1.35v DDR3 products support 2133Mbps data rates in both x8 and x16 configurations and are 100% compatible with 1.5v DDR3. The company will also add new wafer capacity from the fourth quarter of 2022, offering more advanced manufacturing technology.
