Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Number of Elements | Number of Bits per Element | Input Type | Output Type | Current - Output High, Low | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ON Semiconductor |
IC INVERTER DUAL 4-INPUT 20TSSOP
|
pacote: 20-TSSOP (0.173", 4.40mm Width) |
Estoque2.800 |
|
2 | 4 | - | Push-Pull | 24mA, 24mA | 2 V ~ 6 V | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
ON Semiconductor |
IC BUFFER TRI-ST QD N-INV 14DIP
|
pacote: 14-DIP (0.300", 7.62mm) |
Estoque7.872 |
|
4 | 1 | - | Push-Pull | 24mA, 24mA | 2 V ~ 6 V | -40°C ~ 85°C (TA) | Through Hole | 14-DIP (0.300", 7.62mm) | 14-PDIP |
||
ON Semiconductor |
IC BUFFER TRI-ST QD N-INV 14DIP
|
pacote: 14-DIP (0.300", 7.62mm) |
Estoque15.480 |
|
4 | 1 | - | Push-Pull | 24mA, 24mA | 2 V ~ 6 V | -40°C ~ 85°C (TA) | Through Hole | 14-DIP (0.300", 7.62mm) | 14-PDIP |
||
ON Semiconductor |
IC BUFF TRI-ST QD N-INV 14SOEIAJ
|
pacote: 14-SOIC (0.209", 5.30mm Width) |
Estoque6.736 |
|
4 | 1 | - | Push-Pull | 24mA, 24mA | 2 V ~ 6 V | -40°C ~ 85°C (TA) | Surface Mount | 14-SOIC (0.209", 5.30mm Width) | SOEIAJ-14 |
||
ON Semiconductor |
IC BUFF TRI-ST QD N-INV 14SOEIAJ
|
pacote: 14-SOIC (0.209", 5.30mm Width) |
Estoque7.120 |
|
4 | 1 | - | Push-Pull | 24mA, 24mA | 2 V ~ 6 V | -40°C ~ 85°C (TA) | Surface Mount | 14-SOIC (0.209", 5.30mm Width) | SOEIAJ-14 |
||
ON Semiconductor |
IC BUFF TRI-ST QD N-INV 14TSSOP
|
pacote: 14-TSSOP (0.173", 4.40mm Width) |
Estoque243.000 |
|
4 | 1 | - | Push-Pull | 24mA, 24mA | 2 V ~ 6 V | -40°C ~ 85°C (TA) | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
||
ON Semiconductor |
IC BUFF TRI-ST QD N-INV 14SOIC
|
pacote: 14-SOIC (0.154", 3.90mm Width) |
Estoque14.688 |
|
4 | 1 | - | Push-Pull | 24mA, 24mA | 2 V ~ 6 V | -40°C ~ 85°C (TA) | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
ON Semiconductor |
IC HEX BUS BUFFER 16-SOEIAJ
|
pacote: 16-SOIC (0.209", 5.30mm Width) |
Estoque6.672 |
|
2 | 2, 4 (Hex) | - | Push-Pull | 14.1mA, 25mA | 3 V ~ 18 V | -55°C ~ 125°C (TA) | Surface Mount | 16-SOIC (0.209", 5.30mm Width) | 16-SOEIAJ |
||
ON Semiconductor |
IC BUFF TRI-ST HEX N-INV 16SOIC
|
pacote: 16-SOIC (0.154", 3.90mm Width) |
Estoque4.320 |
|
2 | 2, 4 (Hex) | - | Push-Pull | 14.1mA, 25mA | 3 V ~ 18 V | -55°C ~ 125°C (TA) | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
ON Semiconductor |
IC BUFF HEX NON-INVERT 16SOEIAJ
|
pacote: 16-SOIC (0.209", 5.30mm Width) |
Estoque250.620 |
|
6 | 1 | - | Push-Pull | 10mA, 40mA | 3 V ~ 18 V | -55°C ~ 125°C (TA) | Surface Mount | 16-SOIC (0.209", 5.30mm Width) | 16-SOEIAJ |
||
ON Semiconductor |
IC BUFF HEX NON-INVERT 16SOEIAJ
|
pacote: 16-SOIC (0.209", 5.30mm Width) |
Estoque41.256 |
|
6 | 1 | - | Push-Pull | 10mA, 40mA | 3 V ~ 18 V | -55°C ~ 125°C (TA) | Surface Mount | 16-SOIC (0.209", 5.30mm Width) | 16-SOEIAJ |
||
ON Semiconductor |
IC BUFFER HEX NON-INVERT 16TSSOP
|
pacote: 16-TSSOP (0.173", 4.40mm Width) |
Estoque6.288 |
|
6 | 1 | - | Push-Pull | 10mA, 40mA | 3 V ~ 18 V | -55°C ~ 125°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
ON Semiconductor |
IC BUFFER HEX NON-INVERT 16TSSOP
|
pacote: 16-TSSOP (0.173", 4.40mm Width) |
Estoque2.640 |
|
6 | 1 | - | Push-Pull | 10mA, 40mA | 3 V ~ 18 V | -55°C ~ 125°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
ON Semiconductor |
IC INVERTER HEX ENABLE 16-DIP
|
pacote: 16-DIP (0.300", 7.62mm) |
Estoque6.592 |
|
1 | 6 | - | Push-Pull | - | -4.94 V ~ -5.46 V | 0°C ~ 75°C (TA) | Through Hole | 16-DIP (0.300", 7.62mm) | 16-DIP |
||
ON Semiconductor |
IC INVERTER HEX ENABLE 16-DIP
|
pacote: 16-DIP (0.300", 7.62mm) |
Estoque32.040 |
|
1 | 6 | - | Push-Pull | - | -4.94 V ~ -5.46 V | 0°C ~ 75°C (TA) | Through Hole | 16-DIP (0.300", 7.62mm) | 16-DIP |
||
ON Semiconductor |
IC INVERTER HEX ENABLE 16SOEIAJ
|
pacote: 16-SOIC (0.209", 5.30mm Width) |
Estoque6.656 |
|
1 | 6 | - | Push-Pull | - | -4.94 V ~ -5.46 V | 0°C ~ 75°C (TA) | Surface Mount | 16-SOIC (0.209", 5.30mm Width) | 16-SOEIAJ |
||
ON Semiconductor |
IC INVERTER HEX ENABLE 16SOEIAJ
|
pacote: 16-SOIC (0.209", 5.30mm Width) |
Estoque2.816 |
|
1 | 6 | - | Push-Pull | - | -4.94 V ~ -5.46 V | 0°C ~ 75°C (TA) | Surface Mount | 16-SOIC (0.209", 5.30mm Width) | 16-SOEIAJ |
||
ON Semiconductor |
IC INVERTER HEX ENABLE 16SOEIAJ
|
pacote: 16-SOIC (0.209", 5.30mm Width) |
Estoque10.212 |
|
1 | 6 | - | Push-Pull | - | -4.94 V ~ -5.46 V | 0°C ~ 75°C (TA) | Surface Mount | 16-SOIC (0.209", 5.30mm Width) | 16-SOEIAJ |
||
ON Semiconductor |
IC INVERTER HEX ENABLE 16SOEIAJ
|
pacote: 16-SOIC (0.209", 5.30mm Width) |
Estoque6.512 |
|
1 | 6 | - | Push-Pull | - | -4.94 V ~ -5.46 V | 0°C ~ 75°C (TA) | Surface Mount | 16-SOIC (0.209", 5.30mm Width) | 16-SOEIAJ |
||
ON Semiconductor |
IC INVERTER HEX ENABLE 16-CDIP
|
pacote: 16-CDIP (0.300", 7.62mm) |
Estoque2.688 |
|
1 | 6 | - | Push-Pull | - | -4.94 V ~ -5.46 V | 0°C ~ 75°C (TA) | Through Hole | 16-CDIP (0.300", 7.62mm) | 16-CDIP |
||
ON Semiconductor |
IC INVERTER HEX ENABLE 20PLCC
|
pacote: 20-LCC (J-Lead) |
Estoque5.520 |
|
1 | 6 | - | Push-Pull | - | -4.94 V ~ -5.46 V | 0°C ~ 75°C (TA) | Surface Mount | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
ON Semiconductor |
IC INVERTER HEX ENABLE 20PLCC
|
pacote: 20-LCC (J-Lead) |
Estoque4.848 |
|
1 | 6 | - | Push-Pull | - | -4.94 V ~ -5.46 V | 0°C ~ 75°C (TA) | Surface Mount | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
ON Semiconductor |
IC INVERTER HEX ENABLE 20PLCC
|
pacote: 20-LCC (J-Lead) |
Estoque4.560 |
|
1 | 6 | - | Push-Pull | - | -4.94 V ~ -5.46 V | 0°C ~ 75°C (TA) | Surface Mount | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
ON Semiconductor |
IC INVERTER HEX ENABLE 20PLCC
|
pacote: 20-LCC (J-Lead) |
Estoque14.352 |
|
1 | 6 | - | Push-Pull | - | -4.94 V ~ -5.46 V | 0°C ~ 75°C (TA) | Surface Mount | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
ON Semiconductor |
IC BUFFER HEX ENBL N-INV 16DIP
|
pacote: 16-DIP (0.300", 7.62mm) |
Estoque7.744 |
|
1 | 6 | - | Push-Pull | - | -4.94 V ~ -5.46 V | 0°C ~ 75°C (TA) | Through Hole | 16-DIP (0.300", 7.62mm) | 16-DIP |
||
ON Semiconductor |
IC BUFFER HEX ENBL N-INV 16DIP
|
pacote: 16-DIP (0.300", 7.62mm) |
Estoque7.136 |
|
1 | 6 | - | Push-Pull | - | -4.94 V ~ -5.46 V | 0°C ~ 75°C (TA) | Through Hole | 16-DIP (0.300", 7.62mm) | 16-DIP |
||
ON Semiconductor |
IC BUFF HEX ENBL N-INV 16SOEIAJ
|
pacote: 16-SOIC (0.209", 5.30mm Width) |
Estoque7.280 |
|
1 | 6 | - | Push-Pull | - | -4.94 V ~ -5.46 V | 0°C ~ 75°C (TA) | Surface Mount | 16-SOIC (0.209", 5.30mm Width) | 16-SOEIAJ |
||
ON Semiconductor |
IC BUFF HEX ENBL N-INV 16SOEIAJ
|
pacote: 16-SOIC (0.209", 5.30mm Width) |
Estoque3.616 |
|
1 | 6 | - | Push-Pull | - | -4.94 V ~ -5.46 V | 0°C ~ 75°C (TA) | Surface Mount | 16-SOIC (0.209", 5.30mm Width) | 16-SOEIAJ |