Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Omron Electronics Inc-EMC Div |
CONN SOCKET SIP 32POS GOLD
|
pacote: - |
Estoque4.032 |
|
32 (1 x 32) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
||
Omron Electronics Inc-EMC Div |
CONN IC DIP SOCKET 40POS GOLD
|
pacote: - |
Estoque8.568 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
||
Omron Electronics Inc-EMC Div |
CONN IC DIP SOCKET 24POS GOLD
|
pacote: - |
Estoque5.436 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
||
Omron Electronics Inc-EMC Div |
CONN SOCKET SIP 32POS GOLD
|
pacote: - |
Estoque7.956 |
|
32 (1 x 32) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | - | - | Solder | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
||
Omron Electronics Inc-EMC Div |
CONN SOCKET SIP 32POS GOLD
|
pacote: - |
Estoque7.092 |
|
32 (1 x 32) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
||
Omron Electronics Inc-EMC Div |
CONN IC SOCKET 64POS
|
pacote: - |
Estoque5.274 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Omron Electronics Inc-EMC Div |
CONN IC DIP SOCKET 28POS GOLD
|
pacote: - |
Estoque4.770 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
||
Omron Electronics Inc-EMC Div |
CONN IC DIP SOCKET 40POS GOLD
|
pacote: - |
Estoque5.706 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
||
Omron Electronics Inc-EMC Div |
CONN IC DIP SOCKET 24POS GOLD
|
pacote: - |
Estoque8.028 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Threaded | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
||
Omron Electronics Inc-EMC Div |
CONN IC DIP SOCKET 24POS GOLD
|
pacote: - |
Estoque4.878 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Threaded | Open Frame | Solder | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
||
Omron Electronics Inc-EMC Div |
CONN IC DIP SOCKET 24POS GOLD
|
pacote: - |
Estoque3.508 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Threaded | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
||
Omron Electronics Inc-EMC Div |
CONN IC DIP SOCKET 40POS GOLD
|
pacote: - |
Estoque4.590 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
||
Omron Electronics Inc-EMC Div |
CONN IC DIP SOCKET 32POS GOLD
|
pacote: - |
Estoque5.346 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Threaded | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
||
Omron Electronics Inc-EMC Div |
CONN SOCKET SIP 20POS GOLD
|
pacote: - |
Estoque5.076 |
|
20 (1 x 20) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Threaded | - | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
||
Omron Electronics Inc-EMC Div |
CONN IC DIP SOCKET 32POS GOLD
|
pacote: - |
Estoque2.340 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
||
Omron Electronics Inc-EMC Div |
CONN SOCKET SIP 32POS GOLD
|
pacote: - |
Estoque7.560 |
|
32 (1 x 32) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
||
Omron Electronics Inc-EMC Div |
CONN SOCKET SIP 20POS GOLD
|
pacote: - |
Estoque6.516 |
|
20 (1 x 20) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
||
Omron Electronics Inc-EMC Div |
CONN SOCKET SIP 32POS GOLD
|
pacote: - |
Estoque8.010 |
|
32 (1 x 32) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Threaded | - | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
||
Omron Electronics Inc-EMC Div |
CONN IC DIP SOCKET 28POS GOLD
|
pacote: - |
Estoque2.682 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
||
Omron Electronics Inc-EMC Div |
CONN IC DIP SOCKET 32POS GOLD
|
pacote: - |
Estoque2.430 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
||
Omron Electronics Inc-EMC Div |
CONN IC DIP SOCKET 20POS GOLD
|
pacote: - |
Estoque3.816 |
|
20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, Seal Tape | Solder | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
||
Omron Electronics Inc-EMC Div |
CONN IC DIP SOCKET 22POS GOLD
|
pacote: - |
Estoque7.074 |
|
22 (2 x 11) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Threaded | Open Frame | Solder | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
||
Omron Electronics Inc-EMC Div |
CONN IC DIP SOCKET 20POS GOLD
|
pacote: - |
Estoque2.538 |
|
20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
||
Omron Electronics Inc-EMC Div |
CONN IC DIP SOCKET 20POS GOLD
|
pacote: - |
Estoque5.886 |
|
20 (2 x 10) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |