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NXP Produtos

Registros 26.590
Página  83/950
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pacote
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Quantidade
PMBFJ620,115
NXP

JFET 2N-CH 25V 0.19W 6TSSOP

  • FET Type: 2 N-Channel (Dual)
  • Voltage - Breakdown (V(BR)GSS): 25V
  • Drain to Source Voltage (Vdss): 25V
  • Current - Drain (Idss) @ Vds (Vgs=0): 24mA @ 10V
  • Current Drain (Id) - Max: -
  • Voltage - Cutoff (VGS off) @ Id: 2V @ 1µA
  • Input Capacitance (Ciss) (Max) @ Vds: 5pF @ 10V
  • Resistance - RDS(On): 50 Ohm
  • Power - Max: 190mW
  • Operating Temperature: 150°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 6-TSSOP, SC-88, SOT-363
  • Supplier Device Package: 6-TSSOP
pacote: 6-TSSOP, SC-88, SOT-363
Estoque6.048
MRF6S21050LSR5
NXP

FET RF 68V 2.16GHZ NI-400S

  • Transistor Type: LDMOS
  • Frequency: 2.16GHz
  • Gain: 16dB
  • Voltage - Test: 28V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 450mA
  • Power - Output: 11.5W
  • Voltage - Rated: 68V
  • Package / Case: NI-400S
  • Supplier Device Package: NI-400S
pacote: NI-400S
Estoque6.144
BZX84-C2V7/LF1R
NXP

DIODE ZENER TO-236AB SOT23

  • Voltage - Zener (Nom) (Vz): 2.7V
  • Tolerance: ±5%
  • Power - Max: 250mW
  • Impedance (Max) (Zzt): 100 Ohms
  • Current - Reverse Leakage @ Vr: 20µA @ 1V
  • Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
  • Operating Temperature: -65°C ~ 150°C
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: TO-236AB (SOT23)
pacote: TO-236-3, SC-59, SOT-23-3
Estoque3.264
MC10XS3412CPNA
NXP

IC SWITCH HIGH SIDE QUAD 24-QFN

  • Switch Type: General Purpose
  • Number of Outputs: 4
  • Ratio - Input:Output: 1:1
  • Output Configuration: High Side
  • Output Type: N-Channel
  • Interface: SPI
  • Voltage - Load: 6 V ~ 20 V
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Current - Output (Max): -
  • Rds On (Typ): 10 mOhm, 12 mOhm
  • Input Type: -
  • Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
  • Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
  • Operating Temperature: -40°C ~ 150°C (TJ)
  • Package / Case: 24-PowerQFN
  • Supplier Device Package: 24-PQFN (12x12)
pacote: 24-PowerQFN
Estoque7.472
74HC640N,652
NXP

IC TRANSCEIVER 3ST 8BIT 20DIP

  • Logic Type: Transceiver, Inverting
  • Number of Elements: 1
  • Number of Bits per Element: 8
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 7.8mA, 7.8mA
  • Voltage - Supply: 2 V ~ 6 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Through Hole
  • Package / Case: 20-DIP (0.300", 7.62mm)
  • Supplier Device Package: 20-DIP
pacote: 20-DIP (0.300", 7.62mm)
Estoque6.704
TDA9983BHW/15/C1:5
NXP

IC HDMI TX 150MHZ 80-HTQFP

  • Type: Transmitter
  • Applications: Recorders, Set-Top Boxes
  • Mounting Type: Surface Mount
  • Package / Case: 80-TQFP Exposed Pad
  • Supplier Device Package: 80-HTQFP (12x12)
pacote: 80-TQFP Exposed Pad
Estoque7.808
TDA19988BET/C1,157
NXP

IC HDMI TRANSMITTER 64-TFBGA

  • Type: HDMI Transmitter
  • Applications: Mobile Phones, Cellular, Video Displays
  • Mounting Type: Surface Mount
  • Package / Case: 64-TFBGA
  • Supplier Device Package: 64-TFBGA (4.5x4.5)
pacote: 64-TFBGA
Estoque5.792
74LVC1284DB,118
NXP

IC PRINTR INTFC TXRX/BUFF 20SSOP

  • Type: Transceiver
  • Protocol: IEEE 1284
  • Number of Drivers/Receivers: 4/4
  • Duplex: Full
  • Receiver Hysteresis: 400mV
  • Data Rate: -
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Surface Mount
  • Package / Case: 20-SSOP (0.209", 5.30mm Width)
  • Supplier Device Package: 20-SSOP
pacote: 20-SSOP (0.209", 5.30mm Width)
Estoque3.120
hot P1020PSE2HFB
NXP

IC MPU Q OR IQ 800MHZ 689TEBGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: Security; SEC 3.3
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 125°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 689-BBGA Exposed Pad
  • Supplier Device Package: 689-TEPBGA II (31x31)
pacote: 689-BBGA Exposed Pad
Estoque5.648
hot MPC860TVR66D4
NXP

IC MPU MPC8XX 66MHZ 357BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 66MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (4), 10/100 Mbps (1)
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 95°C (TA)
  • Security Features: -
  • Package / Case: 357-BBGA
  • Supplier Device Package: 357-PBGA (25x25)
pacote: 357-BBGA
Estoque5.840
hot PCF51JF128VLH
NXP

IC MCU 32BIT 128KB FLASH 64LQFP

  • Core Processor: Coldfire V1
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG
  • Peripherals: DMA, I2S, LVD, POR, PWM
  • Number of I/O: 48
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 17x12b, D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
pacote: 64-LQFP
Estoque9.108
MC68F375MZP33R2
NXP

IC MCU 32BIT 256KB FLASH 217BGA

  • Core Processor: CPU32
  • Core Size: 32-Bit
  • Speed: 33MHz
  • Connectivity: CAN, SPI, UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 48
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 10K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.25 V
  • Data Converters: A/D 16x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 217-BBGA
  • Supplier Device Package: 217-PBGA (23x23)
pacote: 217-BBGA
Estoque5.200
PXAG49KBA/00,512
NXP

IC MCU 16BIT 64KB FLASH 44PLCC

  • Core Processor: XA
  • Core Size: 16-Bit
  • Speed: 30MHz
  • Connectivity: UART/USART
  • Peripherals: PWM, WDT
  • Number of I/O: 32
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: -
  • Oscillator Type: External
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC (16.59x16.59)
pacote: 44-LCC (J-Lead)
Estoque3.872
SPC5668EK0VMG
NXP

IC MCU 32BIT 2MB FLASH 208MAPBGA

  • Core Processor: e200z650
  • Core Size: 32-Bit
  • Speed: 116MHz
  • Connectivity: CAN, I2C, LIN, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 155
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 3.3 V ~ 5 V
  • Data Converters: A/D 64x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 208-BGA
  • Supplier Device Package: 208-MAPBGA (17x17)
pacote: 208-BGA
Estoque3.776
MC9S12DT512CPVE
NXP

IC MCU 16BIT 512KB FLASH 112LQFP

  • Core Processor: HCS12
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: CAN, I2C, SCI, SPI
  • Peripherals: PWM, WDT
  • Number of I/O: 91
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 14K x 8
  • Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 112-LQFP
  • Supplier Device Package: 112-LQFP (20x20)
pacote: 112-LQFP
Estoque2.560
SPC5602BK0CLQ4R
NXP

IC MCU 32BIT 256KB FLASH 144LQFP

  • Core Processor: e200z0h
  • Core Size: 32-Bit
  • Speed: 48MHz
  • Connectivity: CAN, I2C, LIN, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 123
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 16
  • RAM Size: 24K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 36x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (15x15)
pacote: 144-LQFP
Estoque6.096
MC908QB8CDWER
NXP

IC MCU 8BIT 8KB FLASH 16SOIC

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: SCI, SPI
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 13
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 256 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 10x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 16-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 16-SOIC
pacote: 16-SOIC (0.295", 7.50mm Width)
Estoque20.526
hot MPXM2202D
NXP

SENS PRESSURE 29 PSI MAX MPAK

  • Pressure Type: Differential
  • Operating Pressure: 29.01 PSI (200 kPa)
  • Output Type: Wheatstone Bridge
  • Output: 0 mV ~ 40 mV (10V)
  • Accuracy: -
  • Voltage - Supply: 10 V ~ 16 V
  • Port Size: -
  • Port Style: No Port
  • Features: Temperature Compensated
  • Termination Style: PCB
  • Maximum Pressure: 58.02 PSI (400 kPa)
  • Operating Temperature: -40°C ~ 125°C
  • Package / Case: 5-SMD Module
  • Supplier Device Package: 5-MPAK
pacote: 5-SMD Module
Estoque3.816
MMA2201KEG
NXP

ACCELEROMETER 40G ANALOG 16SOIC

  • Type: Analog
  • Axis: X
  • Acceleration Range: ±40g
  • Sensitivity (LSB/g): -
  • Sensitivity (mV/g): 50
  • Bandwidth: 400Hz
  • Output Type: Analog Voltage
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Features: -
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 16-SOIC
pacote: 16-SOIC (0.295", 7.50mm Width)
Estoque3.132
NT2H0301G0DUD,005
NXP

IC SMART TAG NFC TYPE 2 UNCASED

  • Type: RFID Transponder
  • Frequency: 13.56MHz
  • Standards: ISO 14443
  • Interface: -
  • Voltage - Supply: -
  • Operating Temperature: -25°C ~ 70°C
  • Package / Case: Die
  • Supplier Device Package: Wafer
pacote: Die
Estoque4.554
SA676DK/01,112
NXP

IC MIXER 100MHZ UP CONVRT 20SSOP

  • RF Type: Cordless Phones
  • Frequency: 100MHz
  • Number of Mixers: 2
  • Gain: 17dB
  • Noise Figure: 7dB
  • Secondary Attributes: Up Converter
  • Current - Supply: 5mA
  • Voltage - Supply: 2.7 V ~ 7 V
  • Package / Case: 20-LSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 20-SSOP
pacote: 20-LSSOP (0.173", 4.40mm Width)
Estoque4.050
SA616DK/01,118
NXP

IC MIXR 150MHZ RSSI EQUIP 20SSOP

  • RF Type: Cellular, ASK, FSK
  • Frequency: 150MHz
  • Number of Mixers: 2
  • Gain: 17dB
  • Noise Figure: 6.8dB
  • Secondary Attributes: RSSI Equipped
  • Current - Supply: 3.5mA
  • Voltage - Supply: 2.7 V ~ 7 V
  • Package / Case: 20-LSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 20-SSOP
pacote: 20-LSSOP (0.173", 4.40mm Width)
Estoque6.984
SPC5607BAVLU6
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z0h
  • Core Size: 32-Bit
  • Speed: 64MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 149
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 96K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 29x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
pacote: 176-LQFP
Estoque7.536
S9S12XS256J0VAA
NXP

16-BIT MCU S12X CORE 256KB FLA

  • Core Processor: HCS12X
  • Core Size: 16-Bit
  • Speed: 40MHz
  • Connectivity: CANbus, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 59
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 12K x 8
  • Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
  • Data Converters: A/D 8x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 80-QFP
  • Supplier Device Package: 80-QFP (14x14)
pacote: 80-QFP
Estoque2.784
S912ZVC19F0VKH
NXP

MAGNIV 16-BIT MCU S12Z CORE 19

  • Core Processor: S12Z
  • Core Size: 16-Bit
  • Speed: 32MHz
  • Connectivity: CANbus, I²C, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 42
  • Program Memory Size: 192KB (192K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 2K x 8
  • RAM Size: 12K x 8
  • Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
  • Data Converters: A/D 16x10b, D/A 1x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP Exposed Pad
  • Supplier Device Package: 64-LQFP (10x10)
pacote: 64-LQFP Exposed Pad
Estoque3.520
MCIMX7U3DVK07SC
NXP

IC I.MX 7ULP VFBGA 361

  • Core Processor: ARM® Cortex®-A7
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 720MHz
  • Co-Processors/DSP: ARM® Cortex®-M4
  • RAM Controllers: LPDDR2, LPDDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: MIPI-DSI
  • Ethernet: -
  • SATA: -
  • USB: USB 2.0 (2)
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 95°C
  • Security Features: Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot
  • Package / Case: -
  • Supplier Device Package: -
pacote: -
Estoque2.736
LPC54S018J4MET180E
NXP

IC MCU CORTEX M4 BGA183

  • Core Processor: ARM® Cortex®-M4
  • Core Size: 32-Bit
  • Speed: 180MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
  • Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
  • Number of I/O: 137
  • Program Memory Size: 4MB (4M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 360K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
  • Data Converters: A/D 12x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 180-TFBGA
  • Supplier Device Package: 180-TFBGA (12x12)
pacote: 180-TFBGA
Estoque6.416
MFS2613AMDA6AD
NXP

SAFETY SYSTEM BASIS CHIP WITH LO

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: 3.2V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP-EP (7x7)
pacote: -
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