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NXP Produtos

Registros 26.590
Página  689/950
Imagem
Nº de peças
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pacote
Estoque
Quantidade
MRF6S21060MR1
NXP

FET RF 68V 2.12GHZ TO270-4

  • Transistor Type: LDMOS
  • Frequency: 2.12GHz
  • Gain: 15.5dB
  • Voltage - Test: 28V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 610mA
  • Power - Output: 14W
  • Voltage - Rated: 68V
  • Package / Case: TO-270-4
  • Supplier Device Package: TO-270 WB-4
pacote: TO-270-4
Estoque2.096
BC635-16,126
NXP

TRANS NPN 45V 1A TO-92

  • Transistor Type: NPN
  • Current - Collector (Ic) (Max): 1A
  • Voltage - Collector Emitter Breakdown (Max): 45V
  • Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
  • Current - Collector Cutoff (Max): 100nA (ICBO)
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 2V
  • Power - Max: 830mW
  • Frequency - Transition: 180MHz
  • Operating Temperature: 150°C (TJ)
  • Mounting Type: Through Hole
  • Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
  • Supplier Device Package: TO-92-3
pacote: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
Estoque6.832
DC6M602X6/1518A,13
NXP

IC REG BUCK PROG 0.65A 6WLCSP

  • Function: Step-Down
  • Output Configuration: Positive
  • Topology: Buck
  • Output Type: Programmable
  • Number of Outputs: 1
  • Voltage - Input (Min): 2.3V
  • Voltage - Input (Max): 5.5V
  • Voltage - Output (Min/Fixed): 1.5V, 1.8V
  • Voltage - Output (Max): -
  • Current - Output: 650mA
  • Frequency - Switching: 6MHz
  • Synchronous Rectifier: Yes
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 6-XFBGA, WLCSP
  • Supplier Device Package: 6-WLCSP (1.36x0.96)
pacote: 6-XFBGA, WLCSP
Estoque6.544
74HCT161DB,118
NXP

IC SYNC 4BIT BINARY COUNT 16SSOP

  • Logic Type: Binary Counter
  • Direction: Up
  • Number of Elements: 1
  • Number of Bits per Element: 4
  • Reset: Asynchronous
  • Timing: Synchronous
  • Count Rate: 41MHz
  • Trigger Type: Positive Edge
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 16-SSOP (0.209", 5.30mm Width)
  • Supplier Device Package: 16-SSOP
pacote: 16-SSOP (0.209", 5.30mm Width)
Estoque6.656
PCA9541D/02,118
NXP

IC I2C 2:1 SELECTOR 16-SOIC

  • Applications: 2-Channel I2C Multiplexer
  • Interface: I2C, SMBus
  • Voltage - Supply: 2.3 V ~ 5.5 V
  • Package / Case: 16-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SO
  • Mounting Type: Surface Mount
pacote: 16-SOIC (0.154", 3.90mm Width)
Estoque4.624
TJA1021T/10/CM,118
NXP

IC TRANSCEIVER LIN 8SOIC

  • Type: Transceiver
  • Protocol: LIN
  • Number of Drivers/Receivers: 1/1
  • Duplex: -
  • Receiver Hysteresis: -
  • Data Rate: -
  • Voltage - Supply: 5.5 V ~ 27 V
  • Operating Temperature: -
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SO
pacote: 8-SOIC (0.154", 3.90mm Width)
Estoque19.236
T2080NSE7MQB
NXP

IC SOC 64BIT 8X1.2GHZ 896FCBGA

  • Core Processor: PowerPC e6500
  • Number of Cores/Bus Width: 4 Core, 64-Bit
  • Speed: 1.8GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 1 Gbps (8), 2.5 Gbps (4), 10 Gbps (4)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
  • Package / Case: 896-FBGA, FCBGA
  • Supplier Device Package: 896-FCPBGA (25x25)
pacote: 896-FBGA, FCBGA
Estoque6.848
MPC8535ECVTATHA
NXP

IC MPU MPC85XX 1.25GHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.25GHz
  • Co-Processors/DSP: Security; SEC
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: SATA 3Gbps (1)
  • USB: USB 2.0 (2)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: Cryptography
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
pacote: 783-BBGA, FCBGA
Estoque4.672
PPC8572EPXATLC
NXP

IC MPU MPC85XX 1.2GHZ 1023FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.2GHz
  • Co-Processors/DSP: Signal Processing; SPE, Security; SEC
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 1023-BFBGA, FCBGA
  • Supplier Device Package: 1023-FCPBGA (33x33)
pacote: 1023-BFBGA, FCBGA
Estoque5.248
P2010NSE2MFC
NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.2GHz
  • Co-Processors/DSP: Security; SEC 3.3
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 125°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 689-BBGA Exposed Pad
  • Supplier Device Package: 689-TEPBGA II (31x31)
pacote: 689-BBGA Exposed Pad
Estoque6.640
P1014NXN5FFB
NXP

IC MPU Q OR IQ 800MHZ 425TEBGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (1)
  • Voltage - I/O: -
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 425-FBGA
  • Supplier Device Package: 425-TEPBGA I (19x19)
pacote: 425-FBGA
Estoque5.952
MC9S12XDT256CAAR
NXP

IC MCU 16BIT 256KB FLASH 80QFP

  • Core Processor: HCS12X
  • Core Size: 16-Bit
  • Speed: 80MHz
  • Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 59
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 16K x 8
  • Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 80-QFP
  • Supplier Device Package: 80-QFP (14x14)
pacote: 80-QFP
Estoque5.232
MC9S08DV96CLH
NXP

IC MCU 8BIT 96KB FLASH 64LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: CAN, I2C, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 53
  • Program Memory Size: 96KB (96K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 24x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
pacote: 64-LQFP
Estoque7.280
hot MC9S12XEQ384CAL
NXP

IC MCU 16BIT 384KB FLASH 112LQFP

  • Core Processor: HCS12X
  • Core Size: 16-Bit
  • Speed: 50MHz
  • Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 91
  • Program Memory Size: 384KB (384K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 24K x 8
  • Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
  • Data Converters: A/D 16x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 112-LQFP
  • Supplier Device Package: 112-LQFP (20x20)
pacote: 112-LQFP
Estoque13.632
MC9S08PA8AVWJ
NXP

IC MCU 8BIT 8KB FLASH 20SOIC

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: I2C, LIN, SPI, UART/USART
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 18
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 256 x 8
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 12x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SOIC
pacote: 20-SOIC (0.295", 7.50mm Width)
Estoque4.512
MKL25Z64VLK4
NXP

IC MCU 32BIT 64KB FLASH 80LQFP

  • Core Processor: ARM? Cortex?-M0+
  • Core Size: 32-Bit
  • Speed: 48MHz
  • Connectivity: I2C, LIN, SPI, UART/USART, USB, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
  • Number of I/O: 66
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 14x16b, D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 80-LQFP
  • Supplier Device Package: 80-LQFP (12x12)
pacote: 80-LQFP
Estoque6.684
hot DSP56F803BU80E
NXP

IC MCU 16BIT 64KB FLASH 100LQFP

  • Core Processor: 56800
  • Core Size: 16-Bit
  • Speed: 80MHz
  • Connectivity: CAN, EBI/EMI, SCI, SPI
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 16
  • Program Memory Size: 64KB (32K x 16)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 16
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
  • Data Converters: A/D 8x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
pacote: 100-LQFP
Estoque30.996
ADC1207S080HW/C1:5
NXP

IC ADC 12BIT PAR 80MHZ 48-HTQFP

  • Number of Bits: 12
  • Sampling Rate (Per Second): 80M
  • Number of Inputs: 1
  • Input Type: Differential
  • Data Interface: Parallel
  • Configuration: S/H-ADC
  • Ratio - S/H:ADC: 1:1
  • Number of A/D Converters: 1
  • Architecture: -
  • Reference Type: Internal
  • Voltage - Supply, Analog: 5V
  • Voltage - Supply, Digital: 5V
  • Features: -
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 48-TQFP Exposed Pad
  • Supplier Device Package: 48-HTQFP (7x7)
  • Mounting Type: -
pacote: 48-TQFP Exposed Pad
Estoque4.656
TDA8787AHL/C3,118
NXP

CCD CAMERA INTERFACE 48-LQFP

  • Type: CCD (Charged Coupled Device)
  • Number of Channels: -
  • Resolution (Bits): 10 b
  • Sampling Rate (Per Second): 18M
  • Data Interface: Parallel
  • Voltage Supply Source: Analog and Digital
  • Voltage - Supply: 2.7 V ~ 3.6 V
  • Operating Temperature: -20°C ~ 75°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
pacote: 48-LQFP
Estoque5.744
PCKEP14D,118
NXP

IC CLK BUFFER 2:5 2GHZ 20SO

  • Type: Fanout Buffer (Distribution), Multiplexer
  • Number of Circuits: 1
  • Ratio - Input:Output: 2:5
  • Differential - Input:Output: Yes/Yes
  • Input: ECL, HSTL, PECL
  • Output: PECL
  • Frequency - Max: 2GHz
  • Voltage - Supply: 2.375 V ~ 3.8 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SO
pacote: 20-SOIC (0.295", 7.50mm Width)
Estoque3.120
MPXV4115V6T1
NXP

SENSOR PRESSURE SMD 8-SOP

  • Pressure Type: Vacuum
  • Operating Pressure: -16.68 PSI (-115 kPa)
  • Output Type: Analog Voltage
  • Output: 0.2 V ~ 4.6 V
  • Accuracy: ±1.5%
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Port Size: -
  • Port Style: No Port
  • Features: Temperature Compensated
  • Termination Style: PCB
  • Maximum Pressure: -58.02 PSI (-400 kPa)
  • Operating Temperature: -40°C ~ 125°C
  • Package / Case: 8-SMD Module
  • Supplier Device Package: -
pacote: 8-SMD Module
Estoque7.182
SPC5745CBK1AMMJ6
NXP

DUAL CORE 2M FLASH 256

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz, 160MHz
  • Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
  • Peripherals: DMA, I²S, POR, WDT
  • Number of I/O: 178
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
  • Data Converters: A/D 36x10b, 16x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPPBGA (17x17)
pacote: 256-LBGA
Estoque5.232
SPC5606BK0MLL6R
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z0h
  • Core Size: 32-Bit
  • Speed: 64MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 77
  • Program Memory Size: 1MB (1M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 80K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 7x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
pacote: 100-LQFP
Estoque3.472
MKV56F512VLQ24
NXP

KINETIS KV56: 220MHZ CORTEX-M7F

  • Core Processor: ARM® Cortex®-M7
  • Core Size: 32-Bit
  • Speed: 240MHz
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART
  • Peripherals: DMA, LVD, POR, PWM, WDT
  • Number of I/O: 111
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 4x12b, 1x16b, D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
pacote: 144-LQFP
Estoque7.216
MFS2320BMMA0EP
NXP

IC

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
pacote: -
Request a Quote
MC56F83766MLK
NXP

IC MCU 32BIT 128MB FLASH 80LQFP

  • Core Processor: 56800EX
  • Core Size: 32-Bit
  • Speed: 100MHz
  • Connectivity: CANbus, I2C, SPI
  • Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
  • Number of I/O: 68
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 48K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
  • Data Converters: A/D 20x12b; D/A 2x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 80-LQFP
  • Supplier Device Package: 80-FQFP (12x12)
pacote: -
Request a Quote
MC35FS6515CAE
NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
pacote: -
Request a Quote
MPF5023CVNA0ESR2
NXP

POWER MANAGEMENT IC, PRE-PROG, 3

  • Applications: High Performance i.MX 8, S32x Processor Based
  • Current - Supply: 200µA
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 40-VFQFN Exposed Pad
  • Supplier Device Package: 40-HVQFN (6x6)
pacote: -
Request a Quote