Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Core Size | Speed | Connectivity | Peripherals | Number of I/O | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MCU 32BIT 1MB FLASH 256LBGA
|
pacote: 256-LBGA |
Estoque6.960 |
|
32-Bit Dual-Core | 204MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | 164 | 1MB (1M x 8) | FLASH | 16K x 8 | 154K x 8 | 2.4 V ~ 3.6 V | A/D 16x10b; D/A 1x10b | Internal | -40°C ~ 105°C (TA) | - | 256-LBGA | 256-LBGA (17x17) |
||
NXP |
32-BIT ARM CORTEX-M4
|
pacote: 100-LQFP |
Estoque7.368 |
|
32-Bit | 180MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 64 | 512KB (512K x 8) | FLASH | 16K x 8 | 200K x 8 | 1.71 V ~ 3.6 V | A/D 12x12b | Internal | -40°C ~ 105°C (TA) | - | 100-LQFP | 100-LQFP (14x14) |
||
NXP |
32-BIT ARM CORTEX-M4
|
pacote: 100-LQFP |
Estoque9.036 |
|
32-Bit | 180MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 64 | 512KB (512K x 8) | FLASH | 16K x 8 | 200K x 8 | 1.71 V ~ 3.6 V | A/D 12x12b | Internal | -40°C ~ 105°C (TA) | - | 100-LQFP | 100-LQFP (14x14) |
||
NXP |
NXP 32-BIT MCU POWER ARCH 448
|
pacote: 272-BBGA |
Estoque4.976 |
|
32-Bit | 40MHz | CANbus, EBI/EMI, SCI, SPI, UART/USART | POR, PWM, WDT | 101 | 448KB (448K x 8) | FLASH | - | 26K x 8 | 2.5 V ~ 2.7 V | A/D 32x10b | External | -40°C ~ 125°C (TA) | - | 272-BBGA | 272-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 388-BBGA |
Estoque3.408 |
|
32-Bit | 56MHz | CANbus, EBI/EMI, SCI, SPI, UART/USART | POR, PWM, WDT | 56 | 1MB (1M x 8) | FLASH | - | 36K x 8 | 2.5 V ~ 2.7 V | A/D 40x10b | External | -40°C ~ 125°C (TA) | - | 388-BBGA | 388-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 388-BBGA |
Estoque6.784 |
|
32-Bit | 56MHz | CANbus, EBI/EMI, SCI, SPI, UART/USART | POR, PWM, WDT | 56 | 1MB (1M x 8) | FLASH | - | 36K x 8 | 2.5 V ~ 2.7 V | A/D 40x10b | External | -40°C ~ 125°C (TA) | - | 388-BBGA | 388-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 516-BBGA |
Estoque6.208 |
|
32-Bit | 264MHz | CANbus, EBI/EMI, SCI, SPI | DMA, POR, PWM | 32 | 4MB (4M x 8) | FLASH | - | 256K x 8 | 1.08 V ~ 5.25 V | A/D 64x12b | External | -40°C ~ 125°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 416-BBGA |
Estoque5.184 |
|
32-Bit | 132MHz | CANbus, EBI/EMI, Ethernet, SCI, SPI | DMA, POR, PWM, WDT | 238 | 2MB (2M x 8) | FLASH | - | 80K x 8 | 1.35 V ~ 1.65 V | A/D 40x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 416-BBGA |
Estoque5.696 |
|
32-Bit | 132MHz | CANbus, EBI/EMI, Ethernet, SCI, SPI | DMA, POR, PWM, WDT | 238 | 2MB (2M x 8) | FLASH | - | 80K x 8 | 1.35 V ~ 1.65 V | A/D 40x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 516-BBGA |
Estoque6.544 |
|
32-Bit | 264MHz | CANbus, EBI/EMI, SCI, SPI | DMA, POR, PWM | 32 | 4MB (4M x 8) | FLASH | - | 256K x 8 | 1.08 V ~ 5.25 V | A/D 64x12b | External | -40°C ~ 125°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 516-BBGA |
Estoque4.880 |
|
32-Bit | 264MHz | CANbus, EBI/EMI, SCI, SPI | DMA, POR, PWM | 32 | 4MB (4M x 8) | FLASH | - | 256K x 8 | 1.08 V ~ 5.25 V | A/D 64x12b | External | -40°C ~ 125°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 516-BBGA |
Estoque4.208 |
|
32-Bit | 264MHz | CANbus, EBI/EMI, SCI, SPI | DMA, POR, PWM | 32 | 4MB (4M x 8) | FLASH | - | 256K x 8 | 1.08 V ~ 5.25 V | A/D 64x12b | External | -40°C ~ 125°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 516-BBGA |
Estoque3.328 |
|
32-Bit | 264MHz | CANbus, EBI/EMI, SCI, SPI | DMA, POR, PWM | 32 | 4MB (4M x 8) | FLASH | - | 256K x 8 | 1.08 V ~ 5.25 V | A/D 64x12b | External | -40°C ~ 125°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
4M FLASH 256K RAM Z7 264MHZ
|
pacote: 416-BBGA |
Estoque2.100 |
|
32-Bit | 264MHz | CANbus, SCI, SPI | DMA, POR, PWM | 32 | 4MB (4M x 8) | FLASH | - | 256K x 8 | 1.08 V ~ 5.25 V | A/D 64x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 416-BBGA |
Estoque2.176 |
|
32-Bit | 264MHz | CANbus, SCI, SPI | DMA, POR, PWM | 32 | 4MB (4M x 8) | FLASH | - | 256K x 8 | 1.08 V ~ 5.25 V | A/D 64x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 416-BBGA |
Estoque6.400 |
|
32-Bit | 264MHz | CANbus, SCI, SPI | DMA, POR, PWM | 32 | 4MB (4M x 8) | FLASH | - | 256K x 8 | 1.08 V ~ 5.25 V | A/D 64x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 416-BBGA |
Estoque5.776 |
|
32-Bit | 264MHz | CANbus, SCI, SPI | DMA, POR, PWM | 32 | 4MB (4M x 8) | FLASH | - | 256K x 8 | 1.08 V ~ 5.25 V | A/D 64x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 416-BBGA |
Estoque2.784 |
|
32-Bit | 144MHz | CANbus, EBI/EMI, Ethernet, SCI, SPI | DMA, POR, PWM, WDT | 256 | 3MB (3M x 8) | FLASH | - | 128K x 8 | 1.35 V ~ 1.65 V | A/D 40x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 516-BBGA |
Estoque3.712 |
|
32-Bit | 200MHz | CANbus, EBI/EMI, SCI, SPI | DMA, POR, PWM | 32 | 3MB (3M x 8) | FLASH | - | 192K x 8 | 1.08 V ~ 5.25 V | A/D 64x12b | External | -40°C ~ 125°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 416-BBGA |
Estoque3.024 |
|
32-Bit | 144MHz | CANbus, EBI/EMI, Ethernet, SCI, SPI | DMA, POR, PWM, WDT | 256 | 3MB (3M x 8) | FLASH | - | 128K x 8 | 1.35 V ~ 1.65 V | A/D 40x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 416-BBGA |
Estoque4.192 |
|
32-Bit | 132MHz | CANbus, EBI/EMI, Ethernet, SCI, SPI | DMA, POR, PWM, WDT | 256 | 3MB (3M x 8) | FLASH | - | 128K x 8 | 1.35 V ~ 1.65 V | A/D 40x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 416-BBGA |
Estoque4.720 |
|
32-Bit | 132MHz | CANbus, EBI/EMI, Ethernet, SCI, SPI | DMA, POR, PWM, WDT | 256 | 3MB (3M x 8) | FLASH | - | 128K x 8 | 1.35 V ~ 1.65 V | A/D 40x12b | External | -40°C ~ 105°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 416-BBGA |
Estoque5.664 |
|
32-Bit | 132MHz | CANbus, EBI/EMI, Ethernet, SCI, SPI | DMA, POR, PWM, WDT | 256 | 3MB (3M x 8) | FLASH | - | 128K x 8 | 1.35 V ~ 1.65 V | A/D 40x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 416-BBGA |
Estoque3.328 |
|
32-Bit | 132MHz | CANbus, EBI/EMI, Ethernet, SCI, SPI | DMA, POR, PWM, WDT | 256 | 3MB (3M x 8) | FLASH | - | 128K x 8 | 1.35 V ~ 1.65 V | A/D 40x12b | External | -40°C ~ 105°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 416-BBGA |
Estoque4.144 |
|
32-Bit Dual-Core | 180MHz | CANbus, EBI/EMI, SCI, SPI | DMA, POR, PWM | - | 6MB (6M x 8) | FLASH | - | 384K x 8 | 1.14 V ~ 1.32 V | A/D 64x12b | Internal | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
TELEMATICS PROCESSOR W/O MBX GRA
|
pacote: 516-BBGA Exposed Pad |
Estoque6.416 |
|
32-Bit | 400MHz | CANbus, EBI/EMI, Ethernet, I²C, USB OTG | DMA, WDT | 147 | - | ROMless | - | 128K x 8 | 1.08 V ~ 3.6 V | - | External | -40°C ~ 85°C (TA) | - | 516-BBGA Exposed Pad | 516-FPBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 516-BBGA |
Estoque4.560 |
|
32-Bit | 200MHz | CANbus, EBI/EMI, SCI, SPI | DMA, POR, PWM | 32 | 3MB (3M x 8) | FLASH | - | 192K x 8 | 1.08 V ~ 5.25 V | A/D 64x12b | External | -40°C ~ 125°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
pacote: 416-BBGA |
Estoque4.016 |
|
32-Bit | 112MHz | CANbus, EBI/EMI, Ethernet, SCI, SPI | DMA, POR, PWM, WDT | 256 | 3MB (3M x 8) | FLASH | - | 128K x 8 | 1.35 V ~ 1.65 V | A/D 40x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |