Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC FLASH 2MBIT 80MHZ 8WSON
|
pacote: 8-WDFN Exposed Pad |
Estoque76.680 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 80MHz | 10µs | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON |
||
Microchip Technology |
IC FLASH 2MBIT 80MHZ 8WSON
|
pacote: 8-WDFN Exposed Pad |
Estoque3.440 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 80MHz | 10µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON |
||
Microchip Technology |
IC EEPROM 8KBIT 5MHZ M2J
|
pacote: M2 J, Smart Card Module (ISO) |
Estoque4.928 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | M2 J, Smart Card Module (ISO) | M2 - J Module (ISO) |
||
Microchip Technology |
IC EEPROM 2KBIT 5MHZ M2P
|
pacote: M2 P, Smart Card Module (ISO) |
Estoque3.888 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | M2 P, Smart Card Module (ISO) | M2 - P Module (ISO) |
||
Microchip Technology |
IC EEPROM 128KBIT 10MHZ 8SOIJ
|
pacote: 8-SOIC (0.209", 5.30mm Width) |
Estoque6.560 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC EEPROM 128KBIT 10MHZ 8SOIJ
|
pacote: 8-SOIC (0.209", 5.30mm Width) |
Estoque6.480 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC EEPROM 16KBIT 2MHZ 8DIP
|
pacote: 8-DIP (0.300", 7.62mm) |
Estoque5.760 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 8KBIT 2MHZ 8DIP
|
pacote: 8-DIP (0.300", 7.62mm) |
Estoque7.856 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 2MHz | 10ms | - | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EERAM 16KBIT 1MHZ 8TSSOP
|
pacote: 8-TSSOP (0.173", 4.40mm Width) |
Estoque4.528 |
|
EERAM | EEPROM, SRAM | 16Kb (2K x 8) | I2C | 1MHz | 1ms | 400ns | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EERAM 16KBIT 1MHZ 8TSSOP
|
pacote: 8-TSSOP (0.173", 4.40mm Width) |
Estoque4.000 |
|
EERAM | EEPROM, SRAM | 16Kb (2K x 8) | I2C | 1MHz | 1ms | 400ns | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC FLASH 1MBIT 70NS 32PLCC
|
pacote: 32-LCC (J-Lead) |
Estoque11.244 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC FLASH 1MBIT 70NS 32PLCC
|
pacote: 32-LCC (J-Lead) |
Estoque5.088 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 4KBIT 5MHZ M2J
|
pacote: M2 J, Smart Card Module (ISO) |
Estoque7.360 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | M2 J, Smart Card Module (ISO) | M2 - J Module (ISO) |
||
Microchip Technology |
IC EEPROM 1KBIT 5MHZ M2P
|
pacote: M2 P, Smart Card Module (ISO) |
Estoque3.072 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | M2 P, Smart Card Module (ISO) | M2 - P Module (ISO) |
||
Microchip Technology |
IC FLASH 4MBIT 104MHZ 8SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque2.112 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 128KBIT 10MHZ 8SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque49.620 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 128KBIT 10MHZ 8SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque37.272 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 3MHZ 8DIP
|
pacote: 8-DIP (0.300", 7.62mm) |
Estoque5.216 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FLASH 4MBIT 55NS 48TFBGA
|
pacote: 48-TFBGA |
Estoque3.808 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 10µs | 55ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Microchip Technology |
IC FLASH 4MBIT 55NS 48TFBGA
|
pacote: 48-TFBGA |
Estoque7.632 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 10µs | 55ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Microchip Technology |
IC FLASH 4MBIT 55NS 48TFBGA
|
pacote: 48-TFBGA |
Estoque7.248 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 10µs | 55ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Microchip Technology |
IC FLASH 4MBIT 55NS 48TFBGA
|
pacote: 48-TFBGA |
Estoque5.968 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 10µs | 55ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Microchip Technology |
IC EEPROM 2KBIT 5MHZ M2J
|
pacote: M2 J, Smart Card Module (ISO) |
Estoque2.032 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | M2 J, Smart Card Module (ISO) | M2 - J Module (ISO) |
||
Microchip Technology |
IC FLASH 1MBIT 33MHZ 8WSON
|
pacote: 8-WDFN Exposed Pad |
Estoque5.408 |
|
FLASH | FLASH | 1Mb (128K x 8) | SPI | 33MHz | 20µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON |
||
Microchip Technology |
IC FLASH 1MBIT 33MHZ 8WSON
|
pacote: 8-WDFN Exposed Pad |
Estoque6.880 |
|
FLASH | FLASH | 1Mb (128K x 8) | SPI | 33MHz | 20µs | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON |
||
Microchip Technology |
IC FLASH 4MBIT 104MHZ 8SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque6.320 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 1MBIT 55NS 32PLCC
|
pacote: 32-LCC (J-Lead) |
Estoque4.064 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 20µs | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microchip Technology |
IC FLASH 4MBIT 55NS 48TSOP
|
pacote: 48-TFSOP (0.724", 18.40mm Width) |
Estoque4.352 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 10µs | 55ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |