Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 2:8 160MHZ 28PLCC
|
pacote: 28-LCC (J-Lead) |
Estoque18.828 |
|
1 | 2:8 | Yes/Yes | PECL, TTL | TTL | 160MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 135MHZ 28PLCC
|
pacote: 28-LCC (J-Lead) |
Estoque7.920 |
|
1 | 1:9 | Yes/Yes | PECL | TTL | 135MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 135MHZ 28PLCC
|
pacote: 28-LCC (J-Lead) |
Estoque16.320 |
|
1 | 1:9 | Yes/Yes | PECL | TTL | 135MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 135MHZ 28PLCC
|
pacote: 28-LCC (J-Lead) |
Estoque4.192 |
|
1 | 1:9 | Yes/Yes | PECL | TTL | 135MHz | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 135MHZ 28PLCC
|
pacote: 28-LCC (J-Lead) |
Estoque7.236 |
|
1 | 1:9 | Yes/Yes | PECL | TTL | 135MHz | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 80MHZ 28PLCC
|
pacote: 28-LCC (J-Lead) |
Estoque7.280 |
|
1 | 1:9 | Yes/Yes | PECL | TTL | 80MHz | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:5 3GHZ 32TQFP
|
pacote: 32-TQFP |
Estoque2.528 |
|
2 | 1:5 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:5 3GHZ 32TQFP
|
pacote: 32-TQFP |
Estoque14.796 |
|
2 | 1:5 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 4:4 2.5GHZ 16TSSOP
|
pacote: 16-TSSOP (0.173", 4.40mm Width) |
Estoque6.324 |
|
1 | 4:4 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 2.5GHz | 2.97 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 2:5 2GHZ 20TSSOP
|
pacote: 20-TSSOP (0.173", 4.40mm Width) |
Estoque6.640 |
|
1 | 2:5 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 2GHz | 2.37 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 2:5 2GHZ 20TSSOP
|
pacote: 20-TSSOP (0.173", 4.40mm Width) |
Estoque109.560 |
|
1 | 2:5 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 2GHz | 2.37 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque3.760 |
|
1 | 1:2 | Yes/Yes | ECL, LVECL, LVPECL. PECL | ECL, LVECL, LVPECL. PECL | 3GHz | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque45.156 |
|
1 | 1:2 | Yes/Yes | ECL, LVECL, LVPECL. PECL | ECL, LVECL, LVPECL. PECL | 3GHz | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8MSOP
|
pacote: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Estoque6.048 |
|
1 | 1:2 | Yes/Yes | ECL, LVECL, LVPECL. PECL | ECL, LVECL, LVPECL. PECL | 3GHz | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
IC CLK BUFFER 2:10 3GHZ 32TQFP
|
pacote: 32-TQFP |
Estoque7.280 |
|
1 | 2:10 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:4 16SOIC
|
pacote: 16-SOIC (0.154", 3.90mm Width) |
Estoque4.640 |
|
1 | 2:4 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:4 16SOIC
|
pacote: 16-SOIC (0.154", 3.90mm Width) |
Estoque4.992 |
|
1 | 2:4 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:4 16SOIC
|
pacote: 16-SOIC (0.154", 3.90mm Width) |
Estoque4.224 |
|
1 | 2:4 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:4 16SOIC
|
pacote: 16-SOIC (0.154", 3.90mm Width) |
Estoque6.208 |
|
1 | 2:4 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 3.8 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:4 16SOIC
|
pacote: 16-SOIC (0.154", 3.90mm Width) |
Estoque5.808 |
|
1 | 2:4 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:4 16SOIC
|
pacote: 16-SOIC (0.154", 3.90mm Width) |
Estoque15.972 |
|
1 | 2:4 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:4 16SOIC
|
pacote: 16-SOIC (0.154", 3.90mm Width) |
Estoque7.104 |
|
1 | 2:4 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 3.8 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:4 16SOIC
|
pacote: 16-SOIC (0.154", 3.90mm Width) |
Estoque5.984 |
|
1 | 2:4 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 3.8 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:5 20SOIC
|
pacote: 20-SOIC (0.295", 7.50mm Width) |
Estoque4.912 |
|
1 | 2:5 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:5 20SOIC
|
pacote: 20-SOIC (0.295", 7.50mm Width) |
Estoque40.740 |
|
1 | 2:5 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:5 20SOIC
|
pacote: 20-SOIC (0.295", 7.50mm Width) |
Estoque5.936 |
|
1 | 2:5 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:5 20SOIC
|
pacote: 20-SOIC (0.295", 7.50mm Width) |
Estoque135.840 |
|
1 | 2:5 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:2 8SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque6.896 |
|
1 | 1:2 | Yes/Yes | Clock | Clock | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |