NXP Produtos

BUK9832-55A,115

NXP

MOSFET N-CH 55V 12A SOT223

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 55V
• Current - Continuous Drain (Id) @ 25°C: 12A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 2V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: -
• Input Capacitance (Ciss) (Max) @ Vds: 1594pF @ 25V
• Vgs (Max): ±10V
• FET Feature: -
• Power Dissipation (Max): 8W (Tc)
• Rds On (Max) @ Id, Vgs: 29 mOhm @ 8A, 10V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: SOT-223
• Package / Case: TO-261-4, TO-261AA

pacote: TO-261-4, TO-261AA

PVR100AZ-B3V3,115

NXP

TRANS NPN 45V 0.1A SOT223

• Transistor Type: NPN + Zener
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 45V
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): 100nA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
• Power - Max: 550mW
• Frequency - Transition: -
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: TO-261-4, TO-261AA
• Supplier Device Package: SOT-223

pacote: TO-261-4, TO-261AA

PDTA144ES,126

NXP

TRANS PREBIAS PNP 500MW TO92-3

• Transistor Type: PNP - Pre-Biased
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Resistor - Base (R1) (Ohms): 47k
• Resistor - Emitter Base (R2) (Ohms): 47k
• DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
• Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
• Current - Collector Cutoff (Max): 1µA
• Frequency - Transition: -
• Power - Max: 500mW
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
• Supplier Device Package: TO-92-3

pacote: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

BZX84-C30/LF1R

NXP

DIODE ZENER TO-236AB SOT23

• Voltage - Zener (Nom) (Vz): 30V
• Tolerance: ±5%
• Power - Max: 250mW
• Impedance (Max) (Zzt): 80 Ohms
• Current - Reverse Leakage @ Vr: 50nA @ 18.9V
• Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

pacote: TO-236-3, SC-59, SOT-23-3

BBY31,215

NXP

DIODE UHF VAR CAP 30V SOT-23

• Capacitance @ Vr, F: 2pF @ 28V, 1MHz
• Capacitance Ratio: 8.3
• Capacitance Ratio Condition: C1/C28
• Voltage - Peak Reverse (Max): 30V
• Diode Type: Single
• Q @ Vr, F: -
• Operating Temperature: -55°C ~ 125°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

pacote: TO-236-3, SC-59, SOT-23-3

MC3PHACVDW

NXP

IC MOTOR CONTROLLER SER 28SOIC

• Motor Type - Stepper: -
• Motor Type - AC, DC: AC, Synchronous
• Function: Controller - Commutation, Direction Management
• Output Configuration: Pre-Driver - Half Bridge (3)
• Interface: Serial
• Technology: IGBT
• Step Resolution: -
• Applications: General Purpose
• Current - Output: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Voltage - Load: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

pacote: 28-SOIC (0.295", 7.50mm Width)

CBT6832DGG,112

NXP

IC 16BIT 1OF2 MUX/DEMUX 56TSSOP

• Type: Multiplexer/Demultiplexer
• Circuit: 16 x 1:2
• Independent Circuits: 1
• Current - Output High, Low: 15mA, 64mA
• Voltage Supply Source: Single Supply
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 56-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 56-TSSOP

pacote: 56-TFSOP (0.240", 6.10mm Width)

TFA9842J/N1,112

NXP

IC AMP AUDIO PWR 15W STER 9SIL

• Type: Class AB
• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Max Output Power x Channels @ Load: 15W x 1 @ 8 Ohm; 7.5W x 2 @ 4 Ohm
• Voltage - Supply: 9 V ~ 26 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Through Hole
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 9-PDBS-EP
• Package / Case: 9-SIP Exposed Tab, Formed Leads

pacote: 9-SIP Exposed Tab, Formed Leads

PCA9549BS,118

NXP

IC 8-BIT BUS SW 24-HVQFN

• Applications: Translating Switch
• Interface: I2C, SMBus
• Voltage - Supply: 2.3 V ~ 3.6 V, 4.5 V ~ 5.5 V
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-HVQFN (4x4)
• Mounting Type: Surface Mount

pacote: 24-VFQFN Exposed Pad

PCA9675BS,118

NXP

IC I/O EXPANDER I2C 16B 24HVQFN

• Number of I/O: 16
• Interface: I2C
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 100µA, 25mA
• Clock Frequency: 1MHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-HVQFN (4x4)

pacote: 24-VFQFN Exposed Pad

LS102MASN7EHA

NXP

IC PROCESSOR DUAL CORE

• Core Processor: ARM1136JF-S
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 650MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: GbE (2)
• SATA: -
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 448-FBGA Exposed Pad
• Supplier Device Package: 448-PBGA w/Heat Spreader (23x23)

pacote: 448-FBGA Exposed Pad

MPC8547HXAUJ

NXP

IC MPU MPC85XX 1.333GHZ 783BGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

pacote: 783-BBGA, FCBGA

MPC862TVR50B

NXP

IC MPU MPC8XX 50MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 50MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (4), 10/100 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

pacote: 357-BBGA

MPC8545VJAQGD

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

pacote: 783-BBGA, FCBGA

MCIMX507CVM1B

NXP

IC MPU I.MX50 800MHZ 400MAPBGA

• Core Processor: ARM? Cortex?-A8
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR, LPDDR2, DDR2
• Graphics Acceleration: Yes
• Display & Interface Controllers: LCD
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: Boot Security, Cryptography, Secure JTAG
• Package / Case: 400-LFBGA
• Supplier Device Package: 400-MAPBGA (17x17)

pacote: 400-LFBGA

MC9S08RC60FJE

NXP

IC MCU 8BIT 60KB FLASH 32LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

pacote: 32-LQFP

SPC5517EBVLQ66R

NXP

IC MCU 32BIT 1.5MB FLASH 144LQFP

• Core Processor: e200z0, e200z1
• Core Size: 32-Bit Dual-Core
• Speed: 66MHz
• Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 111
• Program Memory Size: 1.5MB (1.5M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 80K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
• Data Converters: A/D 40x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

pacote: 144-LQFP

S9S12XS256J0VAE

NXP

IC MCU 16BIT 256KB FLASH 64LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: CAN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 44
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

pacote: 64-LQFP

S9S08SC4E0CTGR

NXP

IC MCU 8BIT 4KB FLASH 16TSSOP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: LIN, SCI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 12
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

pacote: 16-TSSOP (0.173", 4.40mm Width)

MK50DX128CLL7

NXP

IC MCU 32BIT 128KB FLASH 100LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 59
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 34x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

pacote: 100-LQFP

MC88915FN55

NXP

IC DRIVER CLK PLL 55MHZ 28-PLCC

• Type: Clock Driver, Fanout Distribution, Multiplexer
• PLL: Yes
• Input: TTL
• Output: CMOS, TTL
• Number of Circuits: 1
• Ratio - Input:Output: 3:8
• Differential - Input:Output: No/No
• Frequency - Max: 55MHz
• Divider/Multiplier: Yes/Yes
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 28-LCC (J-Lead)
• Supplier Device Package: 28-PLCC (12.45x12.45)

pacote: 28-LCC (J-Lead)

TEA6101T/N2,118

NXP

IC ANTENNA DIVERSITY CIRC 20SOIC

• Function: Antenna Diversity
• Frequency: -
• RF Type: Broadcast Radio
• Secondary Attributes: -
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SO

pacote: 20-SOIC (0.295", 7.50mm Width)

MC13851-2400EVK

NXP

IC MC13851 EVB 2400MHZ

• Type: Amplifier
• Frequency: 2.4GHz
• For Use With/Related Products: MC13851
• Supplied Contents: Board

pacote: -

MIMX8MQ5DVAJZAA

NXP

I.MX 8M QUADLITE, ARM CORTEX-A53

• Core Processor: ARM® Cortex®-A53
• Number of Cores/Bus Width: 4 Core, 32-Bit
• Speed: 1.3GHz
• Co-Processors/DSP: ARM® Cortex®-M4
• RAM Controllers: DDR3L, DDR4, LPDDR4
• Graphics Acceleration: Yes
• Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
• Ethernet: GbE
• SATA: -
• USB: USB 3.0 (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 95°C (TJ)
• Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
• Package / Case: 621-FBGA, FCBGA
• Supplier Device Package: 621-FCPBGA (17x17)

pacote: 621-FBGA, FCBGA

MKM34Z128ACLL5R

NXP

KINETIS KM34: 50MHZ CORTEX-M0+ M

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: DMA, LCD, WDT
• Number of I/O: 68
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 12x16b, 4x24b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

pacote: 100-LQFP

TDA18220HN/C1Y

NXP

CHINA CABLE MODEM SILICON TUNER

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacote: -

SAF4000EL-101Z534K

NXP

SAF4000EL

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacote: -

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TJA1103AHN-0Z

NXP

IC TRANSCEIVER FULL 1/1 36HVQFN

• Type: Transceiver
• Protocol: IEEE 802.3
• Number of Drivers/Receivers: 1/1
• Duplex: Full
• Receiver Hysteresis: -
• Data Rate: 100Mbps
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 36-VFQFN Exposed Pad
• Supplier Device Package: 36-HVQFN (6x6)

pacote: -

MC33816MAE

NXP

INJECTOR GATE DRIVERS

• Applications: Solenoid Controller
• Current - Supply: 46mA
• Voltage - Supply: 5V ~ 32V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP Exposed Pad
• Supplier Device Package: 64-HLQFP (10x10)

pacote: -

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NAFE11388B40BSMP

NXP

IC 8-IN LOW-POWER 25V AFE

• Number of Bits: 24
• Number of Channels: 8
• Power (Watts): 125 mW
• Voltage - Supply, Analog: 2.97V ~ 3.6V
• Voltage - Supply, Digital: 2.97V ~ 3.6V
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-HVQFN (9x9)

pacote: -

Request a Quote