NXP Produtos

J3A080YXS/T0BY4AG0

NXP

TRANSISTOR JFET 8PLLCC

• FET Type: -
• Voltage - Breakdown (V(BR)GSS): -
• Drain to Source Voltage (Vdss): -
• Current - Drain (Idss) @ Vds (Vgs=0): -
• Current Drain (Id) - Max: -
• Voltage - Cutoff (VGS off) @ Id: -
• Input Capacitance (Ciss) (Max) @ Vds: -
• Resistance - RDS(On): -
• Power - Max: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacote: -

BB179,115

NXP

DIODE UHF VAR CAP 30V SOD523

• Capacitance @ Vr, F: 2.225pF @ 28V, 1MHz
• Capacitance Ratio: 10.9
• Capacitance Ratio Condition: C1/C28
• Voltage - Peak Reverse (Max): 30V
• Diode Type: Single
• Q @ Vr, F: -
• Operating Temperature: -55°C ~ 125°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SC-79, SOD-523
• Supplier Device Package: SOD-523

pacote: SC-79, SOD-523

LD6938CX6/1215PLJ

NXP

IC REG LINEAR 1.2V/1.5V 6WLCSP

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 2
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 1.2V, 1.5V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.4V @ 300mA, 0.4V @ 300mA
• Current - Output: 300mA, 300mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 75µA
• PSRR: 80dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature, Soft Start
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 6-XFBGA, WLCSP
• Supplier Device Package: 6-WLCSP (1.2x0.80)

pacote: 6-XFBGA, WLCSP

SSL2102T/N1,518

NXP

IC LED DRIVER OFFL DIM 2A 20SO

• Type: AC DC Offline Switcher
• Topology: Flyback, Step-Down (Buck)
• Internal Switch(s): Yes
• Number of Outputs: 1
• Voltage - Supply (Min): 8.5V
• Voltage - Supply (Max): 40V
• Voltage - Output: -
• Current - Output / Channel: 2A (Switch)
• Frequency: 100kHz
• Dimming: Triac
• Applications: -
• Operating Temperature: -40°C ~ 100°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SO

pacote: 20-SOIC (0.295", 7.50mm Width)

74LV74N,112

NXP

IC D-TYPE POS TRG DUAL 14DIP

• Function: Set(Preset) and Reset
• Type: D-Type
• Output Type: Differential
• Number of Elements: 2
• Number of Bits per Element: 1
• Clock Frequency: 110MHz
• Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 12mA, 12mA
• Voltage - Supply: 1 V ~ 5.5 V
• Current - Quiescent (Iq): 20µA
• Input Capacitance: 3.5pF
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Through Hole
• Package / Case: 14-DIP (0.300", 7.62mm)

pacote: 14-DIP (0.300", 7.62mm)

74LVC109D,112

NXP

IC JK TYPE POS TRG DUAL 16SOIC

• Function: Set(Preset) and Reset
• Type: JK Type
• Output Type: Differential
• Number of Elements: 2
• Number of Bits per Element: 1
• Clock Frequency: 330MHz
• Max Propagation Delay @ V, Max CL: 6.8ns @ 3.3V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 1.65 V ~ 3.6 V
• Current - Quiescent (Iq): 10µA
• Input Capacitance: 5pF
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)

pacote: 16-SOIC (0.154", 3.90mm Width)

74ABT2241PW,112

NXP

IC BUFF/DVR TRI-ST DUAL 20TSSOP

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 2
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 12mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

pacote: 20-TSSOP (0.173", 4.40mm Width)

74LVTH322245EC,557

NXP

IC BUS TRSCVR 3-ST 32BIT 96LFBGA

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 4
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 12mA, 12mA
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 96-LFBGA
• Supplier Device Package: 96-LFBGA (13.5x5.5)

pacote: 96-LFBGA

BGD885,112

NXP

IC AMP GAIN PWR 860MHZ SFM9

• Applications: CATV
• Output Type: -
• Number of Circuits: 1
• -3db Bandwidth: -
• Slew Rate: -
• Current - Supply: 450mA
• Current - Output / Channel: -
• Voltage - Supply, Single/Dual (±): -
• Mounting Type: Chassis Mount
• Package / Case: SOT-115D
• Supplier Device Package: SFM9

pacote: SOT-115D

PTN3460BS/F1,518

NXP

IC BRIDGE DISP PORT-LVDS 56HVQFN

• Applications: LVDS
• Interface: -
• Voltage - Supply: 3.3V
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (7x7)
• Mounting Type: Surface Mount

pacote: 56-VFQFN Exposed Pad

PCAL6408AEXX

NXP

IC I/O EXPANDER 8BIT 16XFBGA

• Number of I/O: 8
• Interface: I2C, SMBus
• Interrupt Output: Yes
• Features: POR
• Output Type: Open Drain, Push-Pull
• Current - Output Source/Sink: 10mA, 25mA
• Clock Frequency: 400kHz
• Voltage - Supply: 1.65 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-XFBGA
• Supplier Device Package: 16-XFBGA (1.6x1.6)

pacote: 16-XFBGA

P1012NXN2FFB

NXP

IC MPU Q OR IQ 800MHZ 689TEBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

pacote: 689-BBGA Exposed Pad

MPC8536ECVTAQGA

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 (3)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

pacote: 783-BBGA, FCBGA

MPC852TCZT66A

NXP

IC MPU MPC8XX 66MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 100°C (TA)
• Security Features: -
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

pacote: 256-BBGA

MK51DX256CML7

NXP

IC MCU 32BIT 256KB FLASH 104BGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 61
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 25x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 104-LFBGA
• Supplier Device Package: 104-MAPBGA (10x10)

pacote: 104-LFBGA

P89LPC9401FBD,557

NXP

IC MCU 8BIT 8KB FLASH 64LQFP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 18MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LCD, LED, POR, PWM, WDT
• Number of I/O: 23
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (14x14)

pacote: 64-LQFP

MC9S08QG84CFFER

NXP

IC MCU 8BIT 8KB FLASH 16QFN

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 12
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-VQFN Exposed Pad
• Supplier Device Package: 16-QFN-EP (5x5)

pacote: 16-VQFN Exposed Pad

MCF52110CEP66

NXP

IC MCU 32BIT 128KB FLASH 64QFN

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: 43
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-QFN Exposed Pad (9x9)

pacote: 64-VFQFN Exposed Pad

MC9S12GC128VPBE

NXP

IC MCU 16BIT 128KB FLASH 52LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 52-LQFP
• Supplier Device Package: 52-LQFP (10x10)

pacote: 52-LQFP

MC908KX8MPE

NXP

IC MCU 8BIT 8KB FLASH 16DIP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI
• Peripherals: LVD, POR, PWM
• Number of I/O: 13
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 192 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

pacote: 16-DIP (0.300", 7.62mm)

MC908GR16AVFJE

NXP

IC MCU 8BIT 16KB FLASH 32LQFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: LIN, SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 21
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

pacote: 32-LQFP

SPC5643LFF2MLQ1R

NXP

IC MCU 32BIT 1MB FLASH 144LQFP

• Core Processor: e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 120MHz
• Connectivity: CAN, FlexRay, LIN, SPI, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 32x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

pacote: 144-LQFP

NCF2972XTT/T0E080J

NXP

IC REMOTE KEYLESS ENTRY 38TSSOP

• Type: -
• Frequency: -
• Standards: -
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

pacote: -

OM5569/NT322ERM

NXP

NTAG 12C PLUS EXPL KIT PLUS USB

• Type: Near Field Communication
• Frequency: 13.56MHz
• For Use With/Related Products: NT3H1101
• Supplied Contents: Board

pacote: -

QN9080CHNY

NXP

BTLE SOC

• Type: TxRx + MCU
• RF Family/Standard: Bluetooth
• Protocol: Bluetooth v5.0
• Modulation: -
• Frequency: 2.4GHz
• Data Rate (Max): -
• Power - Output: 2dBm
• Sensitivity: -95dBm
• Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
• Serial Interfaces: I2C, SPI, UART, USART, USB
• GPIO: 35
• Voltage - Supply: 1.62 V ~ 3.6 V
• Current - Receiving: 3.5mA
• Current - Transmitting: 3.5mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-VFQFN Exposed Pad

pacote: 48-VFQFN Exposed Pad

SPC5604PF1VLQ6

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 108
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 40K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 30x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

pacote: 144-LQFP

UJA1168ATK-F-0Z

NXP

IC TRANSCEIVER 1/1 14HVSON

• Type: Transceiver
• Protocol: CANbus
• Number of Drivers/Receivers: 1/1
• Duplex: -
• Receiver Hysteresis: 800 mV
• Data Rate: 5Mbps
• Voltage - Supply: 3V ~ 28V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 14-VDFN Exposed Pad
• Supplier Device Package: 14-HVSON (3x4.5)

pacote: -

TEA1721A3T-N1-S2J

NXP

TEA1721A3T/N1/S2J

• Applications: -
• Voltage - Input: -
• Voltage - Supply: -
• Current - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacote: -

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MFS2613AMDA2ADR2

NXP

SAFETY SYSTEM BASIS CHIP WITH LO

• Applications: -
• Current - Supply: -
• Voltage - Supply: 3.2V ~ 40V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP-EP (7x7)

pacote: -

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FB32K144UIT0VLHT

NXP

IC MCU 32BIT 512KB FLASH 64LQFP

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacote: -

Request a Quote