NXP Produtos

PHM21NQ15T,518

NXP

MOSFET N-CH 150V 22.2A 8HVSON

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 150V
• Current - Continuous Drain (Id) @ 25°C: 22.2A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
• Vgs(th) (Max) @ Id: 4V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 36.2nC @ 10V
• Input Capacitance (Ciss) (Max) @ Vds: 2080pF @ 25V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 62.5W (Tc)
• Rds On (Max) @ Id, Vgs: 55 mOhm @ 15A, 10V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: 8-HVSON (6x5)
• Package / Case: 8-VDFN Exposed Pad

pacote: 8-VDFN Exposed Pad

AFT26H050W26SR3

NXP

FET RF 2CH 65V 2.69GHZ NI780-4

• Transistor Type: LDMOS
• Frequency: 2.69GHz
• Gain: 14.2dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 100mA
• Power - Output: 9W
• Voltage - Rated: 65V
• Package / Case: NI-780S-4L4L-8
• Supplier Device Package: NI-780S-4L4L-8

pacote: NI-780S-4L4L-8

BZX284-C4V3,115

NXP

DIODE ZENER 4.3V 400MW SOD2

• Voltage - Zener (Nom) (Vz): 4.3V
• Tolerance: ±5%
• Power - Max: 400mW
• Impedance (Max) (Zzt): 90 Ohms
• Current - Reverse Leakage @ Vr: 3µA @ 1V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: SOD-110
• Supplier Device Package: SOD110

pacote: SOD-110

MMPF0200NPANESR2

NXP

IC PWR MGMT I.MX6 56QFN

• Applications: Converter, i.MX6
• Voltage - Input: 2.8 V ~ 4.5 V
• Number of Outputs: 11
• Voltage - Output: Multiple
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-QFN (8x8)

pacote: 56-VFQFN Exposed Pad

NE1619DS,118

NXP

IC TEMP MONITOR 16SSOP

• Function: Temp Monitoring System (Sensor)
• Sensor Type: Internal and External
• Sensing Temperature: 0°C ~ 125°C, External Sensor
• Accuracy: ±3°C Local(Max), ±5°C Remote(Max)
• Topology: ADC, Multiplexer, Register Bank
• Output Type: SMBus
• Output Alarm: Yes
• Output Fan: No
• Voltage - Supply: 2.8 V ~ 5.5 V
• Operating Temperature: 0°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SSOP (0.154", 3.90mm Width)
• Supplier Device Package: 16-SSOP

pacote: 16-SSOP (0.154", 3.90mm Width)

MC40XSF500EKR2

NXP

IC SWITCH HIGH SIDE 32SOIC

• Switch Type: General Purpose
• Number of Outputs: 5
• Ratio - Input:Output: -
• Output Configuration: High Side
• Output Type: -
• Interface: SPI
• Voltage - Load: 7 V ~ 18 V
• Voltage - Supply (Vcc/Vdd): -
• Current - Output (Max): -
• Rds On (Typ): 40 mOhm
• Input Type: -
• Features: -
• Fault Protection: Over Voltage
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP

pacote: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad

MPC17531ATEP

NXP

IC MOTOR DRIVER PAR 24QFN

• Motor Type - Stepper: Bipolar
• Motor Type - AC, DC: Brushed DC
• Function: Driver - Fully Integrated, Control and Power Stage
• Output Configuration: Half Bridge (4)
• Interface: Parallel
• Technology: Power MOSFET
• Step Resolution: -
• Applications: Battery Powered
• Current - Output: 700mA
• Voltage - Supply: 2.7 V ~ 3.6 V
• Voltage - Load: 2 V ~ 8.6 V
• Operating Temperature: -20°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-QFN-EP (4x4)

pacote: 24-VFQFN Exposed Pad

CBT6820DGG,118

NXP

IC BUS SWITCH 20BIT 48TSSOP

• Type: Bus Switch
• Circuit: 10 x 1:1
• Independent Circuits: 1
• Current - Output High, Low: -
• Voltage Supply Source: Single Supply
• Voltage - Supply: 4 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 48-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 48-TSSOP

pacote: 48-TFSOP (0.240", 6.10mm Width)

74HCT373N,652

NXP

IC LATCH TRANSP OCT D 3ST 20DIP

• Logic Type: D-Type Transparent Latch
• Circuit: 8:8
• Output Type: Tri-State
• Voltage - Supply: 4.5 V ~ 5.5 V
• Independent Circuits: 1
• Delay Time - Propagation: 14ns
• Current - Output High, Low: 6mA, 6mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 20-DIP (0.300", 7.62mm)
• Supplier Device Package: 20-DIP

pacote: 20-DIP (0.300", 7.62mm)

SAF7167AHW/V1,157

NXP

IC DAC YUV TO RGB 48HTQFP

• Type: RGB Video Amplifier
• Applications: Video
• Mounting Type: Surface Mount
• Package / Case: 48-TQFP Exposed Pad
• Supplier Device Package: 48-HTQFP

pacote: 48-TQFP Exposed Pad

SA5211D/01,112

NXP

IC OPAMP TRANSIMP 180MHZ 14SO

• Amplifier Type: Transimpedance
• Number of Circuits: 1
• Output Type: Differential
• Slew Rate: -
• Gain Bandwidth Product: -
• -3db Bandwidth: 180MHz
• Current - Input Bias: -
• Voltage - Input Offset: -
• Current - Supply: 26mA
• Current - Output / Channel: 4mA
• Voltage - Supply, Single/Dual (±): 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

pacote: 14-SOIC (0.154", 3.90mm Width)

PCA9555BSHP

NXP

IC I/O EXPANDER I2C 16B 24HVQFN

• Number of I/O: 16
• Interface: I2C, SMBus
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 10mA, 25mA
• Clock Frequency: 400kHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-HVQFN (4x4)

pacote: 24-VFQFN Exposed Pad

MC908QC16CDZE

NXP

IC MCU 8BIT 16KB FLASH 28SOIC

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 24
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

pacote: 28-SOIC (0.295", 7.50mm Width)

MKL02Z32VFG4

NXP

IC MCU 32BIT 32KB FLASH 16QFN

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number of I/O: 14
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 6x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 16-WFQFN Exposed Pad
• Supplier Device Package: 16-QFN (3x3)

pacote: 16-WFQFN Exposed Pad

MKL25Z32VLH4

NXP

IC MCU 32BIT 32KB FLASH 64LQFP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, LIN, SPI, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
• Number of I/O: 50
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 14x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

pacote: 64-LQFP

SA56004ETK,118

NXP

SENSOR TEMP I2C/SMBUS 8HVSON

• Sensor Type: Digital, Local/Remote
• Sensing Temperature - Local: -40°C ~ 125°C
• Sensing Temperature - Remote: -40°C ~ 125°C
• Output Type: I2C/SMBus
• Voltage - Supply: 3 V ~ 5.5 V
• Resolution: 10 b
• Features: Output Switch, Programmable Limit
• Accuracy - Highest (Lowest): ±2°C (±3°C)
• Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-VDFN Exposed Pad
• Supplier Device Package: 8-HVSON (3x3)

pacote: 8-VDFN Exposed Pad

HTMS1101FTK/AF,115

NXP

RFID HTAG SOT899-1

• Style: Encapsulated
• Technology: Passive
• Frequency: 100kHz ~ 150kHz
• Memory Type: Read/Write
• Writable Memory: 1.76kb (User)
• Standards: ISO 11784, ISO 11785
• Operating Temperature: -
• Size / Dimension: 1.45mm x 1.00mm x 0.50mm

pacote: -

MC33FS6511NAER2

NXP

SYSTEM BASIS CHIP DCDC 1.5A VCO

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: -1.0 V ~ 40 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP (7x7)

pacote: 48-LQFP Exposed Pad

T1023NXE7KQA

NXP

QORIQ 2XCPU 64-BIT PWR ARCH 1.

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

pacote: -

MCIMX6Y0DVM05AB

NXP

I.MX6ULL ROM PERF ENHAN

• Core Processor: ARM® Cortex®-A7
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 528MHz
• Co-Processors/DSP: Multimedia; NEON™ MPE
• RAM Controllers: LPDDR2, DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: Electrophoretic, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 OTG + PHY (1)
• Voltage - I/O: 1.8V, 2.8V, 3.3V
• Operating Temperature: 0°C ~ 95°C (TJ)
• Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
• Package / Case: 289-LFBGA
• Supplier Device Package: 289-MAPBGA (14x14)

pacote: 289-LFBGA

SPC5646CCK0VMJ1

NXP

NXP 32-BIT MCU DUAL POWER ARCH

• Core Processor: e200z4d, e200z0h
• Core Size: 32-Bit Dual-Core
• Speed: 80MHz/120MHz
• Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 199
• Program Memory Size: 3MB (3M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 33x10b, 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-MAPBGA

pacote: 256-LBGA

MC9S08SE8VWLR

NXP

S08SE 8-BIT MCU S08 CORE 8KB F

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: LINbus, SCI
• Peripherals: LVD, POR, PWM
• Number of I/O: 24
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

pacote: 28-SOIC (0.295", 7.50mm Width)

MC33GD3100BEKR2

NXP

GATE DRIVERS HV ISOLATED GATE DR

• Driven Configuration: Half-Bridge
• Channel Type: Single
• Number of Drivers: 1
• Gate Type: IGBT, N-Channel MOSFET
• Voltage - Supply: 5V
• Logic Voltage - VIL, VIH: -
• Current - Peak Output (Source, Sink): 15A, 15A
• Input Type: -
• High Side Voltage - Max (Bootstrap): -
• Rise / Fall Time (Typ): -
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 32-BSSOP (0.295", 7.50mm Width)
• Supplier Device Package: 32-SOIC

pacote: -

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SAF7753HV-N207WY

NXP

CAR DISP

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacote: -

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LPC2460FET208Y

NXP

IC MCU 16/32BIT ROMLESS 208TFBGA

• Core Processor: ARM7TDMI-S
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 160
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 98K x 8
• Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 208-TFBGA
• Supplier Device Package: 208-TFBGA (15x15)

pacote: -

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SAF775DHV-N208Q-KK

NXP

CAR RADIO TUNER & AUDIO DSP

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacote: -

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MC33FS4508CAER2

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: 1V ~ 5V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-HLQFP (7x7)

pacote: -

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K32L2B11VMP0AR

NXP

K32 L2B, 64MAPBGA

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
• Peripherals: DMA, LCD, PWM, WDT
• Number of I/O: 50
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
• Data Converters: A/D 16x16b; D/A 1x12b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-LFBGA
• Supplier Device Package: 64-MAPBGA (5x5)

pacote: -

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SPC5745CK1AVMH2

NXP

IC MCU 32BIT 2MB FLASH 100LFBGA

• Core Processor: e200z2, e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 80MHz, 160MHz
• Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
• Peripherals: DMA, I2S, LVD, POR, WDT
• Number of I/O: 65
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
• Data Converters: A/D 68x10b, 31x12b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LFBGA
• Supplier Device Package: 100-MAPBGA (11x11)

pacote: -

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SAF7770EL-101S13AY

NXP

SOFTWARE DEFINED RADIO

• Type: Audio, Car Signal Processor
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 364-LFBGA
• Supplier Device Package: 364-LFBGA (15x15)

pacote: -

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