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NXP Produtos

Registros 26.590
Página  398/950
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pacote
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Quantidade
PMBFJ174,215
NXP

JFET P-CH 30V 0.3W SOT23

  • FET Type: P-Channel
  • Voltage - Breakdown (V(BR)GSS): 30V
  • Drain to Source Voltage (Vdss): 30V
  • Current - Drain (Idss) @ Vds (Vgs=0): 20mA @ 15V
  • Current Drain (Id) - Max: -
  • Voltage - Cutoff (VGS off) @ Id: 5V @ 10nA
  • Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
  • Resistance - RDS(On): 85 Ohm
  • Power - Max: 300mW
  • Operating Temperature: 150°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: SOT-23 (TO-236AB)
pacote: TO-236-3, SC-59, SOT-23-3
Estoque4.368
PMBF4393,215
NXP

JFET N-CH 40V 250MW SOT23

  • FET Type: N-Channel
  • Voltage - Breakdown (V(BR)GSS): 40V
  • Drain to Source Voltage (Vdss): 40V
  • Current - Drain (Idss) @ Vds (Vgs=0): 5mA @ 20V
  • Current Drain (Id) - Max: -
  • Voltage - Cutoff (VGS off) @ Id: 500mV @ 1nA
  • Input Capacitance (Ciss) (Max) @ Vds: 14pF @ 20V
  • Resistance - RDS(On): 100 Ohm
  • Power - Max: 250mW
  • Operating Temperature: 150°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: SOT-23 (TO-236AB)
pacote: TO-236-3, SC-59, SOT-23-3
Estoque98.394
PHB176NQ04T,118
NXP

MOSFET N-CH 40V 75A D2PAK

  • FET Type: N-Channel
  • Technology: MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss): 40V
  • Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
  • Drive Voltage (Max Rds On, Min Rds On): 10V
  • Vgs(th) (Max) @ Id: 4V @ 1mA
  • Gate Charge (Qg) (Max) @ Vgs: 68.9nC @ 10V
  • Input Capacitance (Ciss) (Max) @ Vds: 3620pF @ 25V
  • Vgs (Max): ±20V
  • FET Feature: -
  • Power Dissipation (Max): 250W (Tc)
  • Rds On (Max) @ Id, Vgs: 4.3 mOhm @ 25A, 10V
  • Operating Temperature: -55°C ~ 175°C (TJ)
  • Mounting Type: Surface Mount
  • Supplier Device Package: D2PAK
  • Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
pacote: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
Estoque3.200
BSS83,215
NXP

MOSFET N-CH 10V 50MA SOT-143B

  • Transistor Type: N-Channel
  • Frequency: -
  • Gain: -
  • Voltage - Test: -
  • Current Rating: 50mA
  • Noise Figure: -
  • Current - Test: -
  • Power - Output: -
  • Voltage - Rated: 10V
  • Package / Case: TO-253-4, TO-253AA
  • Supplier Device Package: SOT-143B
pacote: TO-253-4, TO-253AA
Estoque6.496
PDTB123YK,115
NXP

TRANS PREBIAS PNP 250MW SMT3

  • Transistor Type: PNP - Pre-Biased
  • Current - Collector (Ic) (Max): 500mA
  • Voltage - Collector Emitter Breakdown (Max): 50V
  • Resistor - Base (R1) (Ohms): 2.2k
  • Resistor - Emitter Base (R2) (Ohms): 10k
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 50mA, 5V
  • Vce Saturation (Max) @ Ib, Ic: 300mV @ 2.5mA, 50mA
  • Current - Collector Cutoff (Max): 500nA
  • Frequency - Transition: -
  • Power - Max: 250mW
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: SMT3; MPAK
pacote: TO-236-3, SC-59, SOT-23-3
Estoque5.376
BZX84-C6V8/LF1R
NXP

DIODE ZENER TO-236AB SOT23

  • Voltage - Zener (Nom) (Vz): 6.8V
  • Tolerance: ±5%
  • Power - Max: 250mW
  • Impedance (Max) (Zzt): 15 Ohms
  • Current - Reverse Leakage @ Vr: 2µA @ 4V
  • Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
  • Operating Temperature: -65°C ~ 150°C
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: TO-236AB (SOT23)
pacote: TO-236-3, SC-59, SOT-23-3
Estoque5.776
UJA1076ATW/3V3,112
NXP

IC SBC CAN/LIN 3.3V HS 32HTSSOP

  • Applications: Automotive
  • Interface: SPI Serial
  • Voltage - Supply: 4.5 V ~ 28 V
  • Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
  • Supplier Device Package: 32-HTSSOP
  • Mounting Type: Surface Mount
pacote: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Estoque7.968
PCA9515ADP,118
NXP

IC REDRIVER I2C 1CH 8TSSOP

  • Type: Buffer, ReDriver
  • Applications: I2C
  • Input: 2-Wire Bus
  • Output: 2-Wire Bus
  • Data Rate (Max): 400kHz
  • Number of Channels: 1
  • Delay Time: -
  • Signal Conditioning: -
  • Capacitance - Input: 6pF
  • Voltage - Supply: 2.3 V ~ 3.6 V
  • Current - Supply: 800µA
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: -
  • Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Supplier Device Package: 8-TSSOP
pacote: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Estoque110.106
PCA9554N,112
NXP

IC I/O EXPANDER I2C 8B 16DIP

  • Number of I/O: 8
  • Interface: I2C, SMBus
  • Interrupt Output: Yes
  • Features: POR
  • Output Type: Push-Pull
  • Current - Output Source/Sink: 10mA, 25mA
  • Clock Frequency: 400kHz
  • Voltage - Supply: 2.3 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Through Hole
  • Package / Case: 16-DIP (0.300", 7.62mm)
  • Supplier Device Package: 16-DIP
pacote: 16-DIP (0.300", 7.62mm)
Estoque5.360
PCA9555DB,118
NXP

IC I/O EXPANDER I2C 16B 24SSOP

  • Number of I/O: 16
  • Interface: I2C, SMBus
  • Interrupt Output: Yes
  • Features: POR
  • Output Type: Push-Pull
  • Current - Output Source/Sink: 10mA, 25mA
  • Clock Frequency: 400kHz
  • Voltage - Supply: 2.3 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 24-SSOP (0.209", 5.30mm Width)
  • Supplier Device Package: 24-SSOP
pacote: 24-SSOP (0.209", 5.30mm Width)
Estoque4.784
hot P1013NSN2EFB
NXP

IC MPU Q OR IQ 1.055GHZ 689TBGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.055GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: LCD
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 689-BBGA Exposed Pad
  • Supplier Device Package: 689-TEPBGA II (31x31)
pacote: 689-BBGA Exposed Pad
Estoque4.720
hot MPC885VR66
NXP

IC MPU MPC8XX 66MHZ 357BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 66MHz
  • Co-Processors/DSP: Communications; CPM, Security; SEC
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (3), 10/100 Mbps (2)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 95°C (TA)
  • Security Features: Cryptography
  • Package / Case: 357-BBGA
  • Supplier Device Package: 357-PBGA (25x25)
pacote: 357-BBGA
Estoque3.488
hot P1020NSE2DFB
NXP

IC MPU Q OR IQ 800MHZ 689TEBGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: Security; SEC 3.3
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 125°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 689-BBGA Exposed Pad
  • Supplier Device Package: 689-TEPBGA II (31x31)
pacote: 689-BBGA Exposed Pad
Estoque6.960
P89LPC915HDH,129
NXP

IC MCU 8BIT 2KB FLASH 14TSSOP

  • Core Processor: 8051
  • Core Size: 8-Bit
  • Speed: 18MHz
  • Connectivity: I2C, UART/USART
  • Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
  • Number of I/O: 12
  • Program Memory Size: 2KB (2K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 256 x 8
  • Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
  • Data Converters: A/D 4x8b; D/A 1x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 14-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 14-TSSOP
pacote: 14-TSSOP (0.173", 4.40mm Width)
Estoque5.808
hot SPC5517EBMLQ66
NXP

IC MCU 32BIT 1.5MB FLASH 144LQFP

  • Core Processor: e200z0, e200z1
  • Core Size: 32-Bit Dual-Core
  • Speed: 66MHz
  • Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 111
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 80K x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
  • Data Converters: A/D 40x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
pacote: 144-LQFP
Estoque6.880
LPC1837FET256,551
NXP

IC MCU 32BIT 1MB FLASH 256LBGA

  • Core Processor: ARM? Cortex?-M3
  • Core Size: 32-Bit
  • Speed: 150MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
  • Number of I/O: 80
  • Program Memory Size: 1MB (1M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 136K x 8
  • Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
  • Data Converters: A/D 16x10b; D/A 1x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-LBGA (17x17)
pacote: 256-LBGA
Estoque7.200
hot MSC8101M1375F
NXP

DSP 16BIT 275MHZ CPM 332FCBGA

  • Type: SC140 Core
  • Interface: Communications Processor Module (CPM)
  • Clock Rate: 275MHz
  • Non-Volatile Memory: External
  • On-Chip RAM: 512kB
  • Voltage - I/O: 3.30V
  • Voltage - Core: 1.60V
  • Operating Temperature: -40°C ~ 105°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 332-BFBGA, FCPBGA
  • Supplier Device Package: 332-FCBGA (17x17)
pacote: 332-BFBGA, FCPBGA
Estoque5.920
MCZ33903DP3EK
NXP

SYSTEM BASIS CHIP 2X 3.3 V/400M

  • Applications: System Basis Chip
  • Interface: CAN, LIN
  • Voltage - Supply: 5.5 V ~ 28 V
  • Package / Case: -
  • Supplier Device Package: -
  • Mounting Type: -
pacote: -
Estoque6.320
MC33772BTC0AE
NXP

BCC6

  • Function: Battery Cell Controller
  • Battery Chemistry: Lithium-Ion
  • Number of Cells: 3 ~ 6
  • Fault Protection: Over/Under Voltage
  • Interface: SPI
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
pacote: 48-LQFP Exposed Pad
Estoque6.132
SPC5744PK1AMLQ8R
NXP

2.5MB NVM 2 X E200Z4 CORES 180

  • Core Processor: e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 180MHz
  • Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 79
  • Program Memory Size: 2.5MB (2.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 384K x 8
  • Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
  • Data Converters: A/D 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
pacote: 144-LQFP
Estoque7.632
SPC5605BK0CLL4
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z0h
  • Core Size: 32-Bit
  • Speed: 64MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 77
  • Program Memory Size: 768KB (768K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 7x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
pacote: 100-LQFP
Estoque6.384
MC35FS6508CAE
NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
pacote: -
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MCIMX280DVM4CR
NXP

IC MPU I.MX28 454MHZ 289MAPBGA

  • Core Processor: ARM926EJ-S
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 454MHz
  • Co-Processors/DSP: Data; DCP
  • RAM Controllers: DDR2, LVDDR, LVDDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: Keypad, Touchscreen
  • Ethernet: 10/100Mbps (1)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 1.8V, 3.3V
  • Operating Temperature: -20°C ~ 70°C (TA)
  • Security Features: Boot Security, Cryptography, Hardware ID
  • Package / Case: 289-LFBGA
  • Supplier Device Package: 289-MAPBGA (14x14)
pacote: -
Request a Quote
BT234-600D-127
NXP

TRIAC 600V 4A TO220AB

  • Triac Type: Standard
  • Voltage - Off State: 600 V
  • Current - On State (It (RMS)) (Max): 4 A
  • Voltage - Gate Trigger (Vgt) (Max): 1 V
  • Current - Non Rep. Surge 50, 60Hz (Itsm): 35A @ 50Hz
  • Current - Gate Trigger (Igt) (Max): 10 mA
  • Current - Hold (Ih) (Max): 6 mA
  • Configuration: Single
  • Operating Temperature: 125°C (TJ)
  • Mounting Type: Through Hole
  • Package / Case: TO-220-3
  • Supplier Device Package: TO-220AB
pacote: -
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FS32K146HRT0MMHT
NXP

IC MCU 32BIT 1MB FLASH 100MAPBGA

  • Core Processor: ARM® Cortex®-M4F
  • Core Size: 32-Bit Single-Core
  • Speed: 80MHz
  • Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 89
  • Program Memory Size: 1MB (1M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
  • Data Converters: A/D 24x12b SAR; D/A1x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-LFBGA
  • Supplier Device Package: 100-MAPBGA (11x11)
pacote: -
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BC847C-AU-215
NXP

SMALL SIGNAL BIPOLAR TRANSISTOR

  • Transistor Type: NPN
  • Current - Collector (Ic) (Max): 100 mA
  • Voltage - Collector Emitter Breakdown (Max): 45 V
  • Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
  • Current - Collector Cutoff (Max): 15nA (ICBO)
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
  • Power - Max: 250 mW
  • Frequency - Transition: 100MHz
  • Operating Temperature: 150°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: SOT23-3 (TO-236)
pacote: -
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FS32K146HRT0VLLT
NXP

IC MCU 32BIT 1MB FLASH 100LQFP

  • Core Processor: ARM® Cortex®-M4F
  • Core Size: 32-Bit Single-Core
  • Speed: 80MHz
  • Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 89
  • Program Memory Size: 1MB (1M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
  • Data Converters: A/D 24x12b SAR; D/A1x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
pacote: -
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SAF775DHV-N208Q-FK
NXP

CAR RADIO TUNER & AUDIO DSP

  • Type: -
  • Interface: -
  • Clock Rate: -
  • Non-Volatile Memory: -
  • On-Chip RAM: -
  • Voltage - I/O: -
  • Voltage - Core: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
pacote: -
Request a Quote