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NXP |
MOSFET P-CH 20V 4.8A 6TSOP
- FET Type: P-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 20V
- Current - Continuous Drain (Id) @ 25°C: 4.8A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
- Vgs(th) (Max) @ Id: 950mV @ 250µA
- Gate Charge (Qg) (Max) @ Vgs: 10nC @ 4.5V
- Input Capacitance (Ciss) (Max) @ Vds: 1020pF @ 20V
- Vgs (Max): ±12V
- FET Feature: -
- Power Dissipation (Max): 2.2W (Tc)
- Rds On (Max) @ Id, Vgs: 60 mOhm @ 2.8A, 4.5V
- Operating Temperature: -55°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Supplier Device Package: 6-TSOP
- Package / Case: SC-74, SOT-457
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pacote: SC-74, SOT-457 |
Estoque2.912 |
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NXP |
MOSFET N-CH 55V 49A TO220AB
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 55V
- Current - Continuous Drain (Id) @ 25°C: 49A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 10V
- Vgs(th) (Max) @ Id: 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 62nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds: 1800pF @ 25V
- Vgs (Max): ±20V
- FET Feature: -
- Power Dissipation (Max): 110W (Tc)
- Rds On (Max) @ Id, Vgs: 22 mOhm @ 25A, 10V
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Through Hole
- Supplier Device Package: TO-220AB
- Package / Case: TO-220-3
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pacote: TO-220-3 |
Estoque7.968 |
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NXP |
TRANS PREBIAS NPN 150MW SC75
- Transistor Type: NPN - Pre-Biased
- Current - Collector (Ic) (Max): 100mA
- Voltage - Collector Emitter Breakdown (Max): 50V
- Resistor - Base (R1) (Ohms): 4.7k
- Resistor - Emitter Base (R2) (Ohms): -
- DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
- Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
- Current - Collector Cutoff (Max): 1µA
- Frequency - Transition: -
- Power - Max: 150mW
- Mounting Type: Surface Mount
- Package / Case: SC-75, SOT-416
- Supplier Device Package: SC-75
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pacote: SC-75, SOT-416 |
Estoque2.880 |
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NXP |
DIODE PIN 100V 100MA SOT323
- Diode Type: PIN - 1 Pair Series Connection
- Voltage - Peak Reverse (Max): 100V
- Current - Max: 100mA
- Capacitance @ Vr, F: 0.35pF @ 20V, 1MHz
- Resistance @ If, F: 1.35 Ohm @ 100mA, 100MHz
- Power Dissipation (Max): 240mW
- Operating Temperature: -65°C ~ 150°C (TJ)
- Package / Case: SC-70, SOT-323
- Supplier Device Package: SOT-323-3
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pacote: SC-70, SOT-323 |
Estoque231.642 |
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NXP |
IC REG BUCK ADJ 15A SYNC 68HVQFN
- Function: Step-Down
- Output Configuration: Positive
- Topology: Buck
- Output Type: Adjustable
- Number of Outputs: 1
- Voltage - Input (Min): 5V
- Voltage - Input (Max): -
- Voltage - Output (Min/Fixed): 0.8V
- Voltage - Output (Max): -
- Current - Output: 15A
- Frequency - Switching: 300kHz
- Synchronous Rectifier: Yes
- Operating Temperature: -40°C ~ 125°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 68-VFQFN Exposed Pad
- Supplier Device Package: 68-HVQFN (10x10)
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pacote: 68-VFQFN Exposed Pad |
Estoque5.856 |
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NXP |
IC XLATR 2BIT BI-DIREC 8-TSSOP
- Translator Type: Voltage Level
- Channel Type: Bidirectional
- Number of Circuits: 1
- Channels per Circuit: 2
- Voltage - VCCA: 1V ~ 5.5V
- Voltage - VCCB: 1V ~ 5.5V
- Input Signal: -
- Output Signal: -
- Output Type: Open Drain
- Data Rate: -
- Operating Temperature: -40°C ~ 85°C (TA)
- Features: Auto-Direction Sensing
- Mounting Type: Surface Mount
- Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Supplier Device Package: 8-TSSOP
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pacote: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Estoque2.016 |
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NXP |
TXRX TRANSLATING DUAL X2SON6
- Translator Type: Voltage Level
- Channel Type: Bidirectional
- Number of Circuits: 1
- Channels per Circuit: 1
- Voltage - VCCA: 1.65V ~ 3.6V
- Voltage - VCCB: 2.3V ~ 5.5V
- Input Signal: -
- Output Signal: -
- Output Type: Open Drain, Tri-State
- Data Rate: 50Mbps
- Operating Temperature: -40°C ~ 125°C (TA)
- Features: Auto-Direction Sensing
- Mounting Type: Surface Mount
- Package / Case: 6-XFDFN
- Supplier Device Package: 6-XSON, SOT1202 (1x1)
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pacote: 6-XFDFN |
Estoque52.674 |
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NXP |
IC D-TYPE POS TRG SNGL 20SSOP
- Function: Master Reset
- Type: D-Type
- Output Type: Non-Inverted
- Number of Elements: 1
- Number of Bits per Element: 8
- Clock Frequency: 350MHz
- Max Propagation Delay @ V, Max CL: 4.6ns @ 5V, 50pF
- Trigger Type: Positive Edge
- Current - Output High, Low: 32mA, 64mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Iq): 250µA
- Input Capacitance: 3.5pF
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 20-SSOP (0.209", 5.30mm Width)
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pacote: 20-SSOP (0.209", 5.30mm Width) |
Estoque16.464 |
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NXP |
IC FIFO REGISTER 4X64 3ST 16SOIC
- Memory Size: 256 (64 x 4)
- Function: Asynchronous, Synchronous
- Data Rate: 30MHz
- Access Time: 61ns
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Supply (Max): 1mA
- Bus Directional: Uni-Directional
- Expansion Type: Depth, Width
- Programmable Flags Support: No
- Retransmit Capability: No
- FWFT Support: No
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 16-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 16-SO
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pacote: 16-SOIC (0.295", 7.50mm Width) |
Estoque3.040 |
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NXP |
IC MUX VID DISPLAYPORT 64TFBGA
- Type: Multiplexer
- Applications: Video Switching
- Mounting Type: Surface Mount
- Package / Case: 64-TFBGA
- Supplier Device Package: 64-TFBGA (6x6)
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pacote: 64-TFBGA |
Estoque2.912 |
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NXP |
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
- Core Processor: ARM? Cortex?-A9
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.0GHz
- Co-Processors/DSP: Multimedia; NEON? SIMD
- RAM Controllers: LPDDR2, LVDDR3, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100 Mbps (1)
- SATA: -
- USB: USB 2.0 + PHY (3)
- Voltage - I/O: 1.2V, 1.8V, 3.0V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Package / Case: 432-TFBGA
- Supplier Device Package: 432-MAPBGA (13x13)
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pacote: 432-TFBGA |
Estoque5.344 |
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NXP |
IC MPU MPC83XX 533MHZ 689TEBGA
- Core Processor: PowerPC e300c4s
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 533MHz
- Co-Processors/DSP: Security; SEC 3.0
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: USB 2.0 + PHY (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 125°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 689-BBGA Exposed Pad
- Supplier Device Package: 689-TEPBGA II (31x31)
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pacote: 689-BBGA Exposed Pad |
Estoque7.376 |
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NXP |
IC MPU MPC85XX 1.067GHZ 783BGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.067GHz
- Co-Processors/DSP: Signal Processing; SPE, Security; SEC
- RAM Controllers: DDR, DDR2, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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pacote: 783-BBGA, FCBGA |
Estoque5.136 |
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NXP |
IC MPU MPC83XX 266MHZ 740TBGA
- Core Processor: PowerPC e300
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 266MHz
- Co-Processors/DSP: Communications; QUICC Engine
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (1)
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 740-LBGA
- Supplier Device Package: 740-TBGA (37.5x37.5)
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pacote: 740-LBGA |
Estoque4.688 |
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NXP |
IC SOC 64BIT 24X 1.67GHZ 1932BGA
- Core Processor: PowerPC e6500
- Number of Cores/Bus Width: 12 Core, 64-Bit
- Speed: 1.8GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR3, DDR3L
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 1 Gbps (16), 10 Gbps (4)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
- Package / Case: 1932-BBGA, FCBGA
- Supplier Device Package: 1932-FCPBGA (45x45)
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pacote: 1932-BBGA, FCBGA |
Estoque5.952 |
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NXP |
IC MCU 8BIT 16KB FLASH 44LQFP
- Core Processor: 8051
- Core Size: 8-Bit
- Speed: 18MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O: 40
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512 x 8
- Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 44-LQFP
- Supplier Device Package: 44-LQFP (10x10)
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pacote: 44-LQFP |
Estoque3.792 |
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NXP |
IC MCU 32BIT ROMLESS 144LQFP
- Core Processor: CPU32
- Core Size: 32-Bit
- Speed: 20MHz
- Connectivity: EBI/EMI, SCI, SPI, UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: 15
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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pacote: 144-LQFP |
Estoque4.208 |
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NXP |
IC MCU 16BIT 128KB FLASH 80QFP
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 40MHz
- Connectivity: CAN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 59
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 8x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 80-QFP
- Supplier Device Package: 80-QFP (14x14)
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pacote: 80-QFP |
Estoque7.424 |
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NXP |
IC MCU 32BIT 16KB FLASH 33HVQFN
- Core Processor: ARM? Cortex?-M0
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
- Peripherals: Brown-out Detect/Reset, POR, WDT
- Number of I/O: 26
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 6K x 8
- Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 32-VQFN Exposed Pad
- Supplier Device Package: 32-HVQFN (7x7)
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pacote: 32-VQFN Exposed Pad |
Estoque3.680 |
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NXP |
IC MCU 32BIT 16KB FLASH 16TSSOP
- Core Processor: ARM? Cortex?-M0+
- Core Size: 32-Bit
- Speed: 30MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O: 14
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
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pacote: 16-TSSOP (0.173", 4.40mm Width) |
Estoque7.632 |
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NXP |
IC OSC SGL TIMER 500KHZ 8-SOIC
- Type: 555 Type, Timer/Oscillator (Single)
- Count: -
- Frequency: 500kHz
- Voltage - Supply: 3 V ~ 16 V
- Current - Supply: 180µA
- Operating Temperature: 0°C ~ 70°C
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
- Mounting Type: Surface Mount
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pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque7.184 |
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NXP |
SENSOR ABS PRESS 16.68 PSI MAX
- Pressure Type: Absolute
- Operating Pressure: 2.18 PSI ~ 16.68 PSI (15 kPa ~ 115 kPa)
- Output Type: Analog Voltage
- Output: 0.2 V ~ 4.7 V
- Accuracy: ±2.5%
- Voltage - Supply: 4.75 V ~ 5.25 V
- Port Size: Male - 0.19" (4.93mm) Tube
- Port Style: Barbed
- Features: Temperature Compensated
- Termination Style: PCB
- Maximum Pressure: 58.02 PSI (400 kPa)
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 6-SIP Module
- Supplier Device Package: -
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pacote: 6-SIP Module |
Estoque5.436 |
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NXP |
IC SENS PROXIMITY ANLG 54-SOIC
- Type: -
- Proximity Detection: -
- Number of Inputs: -
- LED Driver Channels: -
- Interface: -
- Resolution: -
- Voltage - Supply: -
- Current - Supply: -
- Operating Temperature: -
- Package / Case: 54-SOIC (0.295", 7.50mm Width) Exposed Pad
- Supplier Device Package: 54-SOIC
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pacote: 54-SOIC (0.295", 7.50mm Width) Exposed Pad |
Estoque6.966 |
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NXP |
ACCELEROMETER 45G ANALOG 20SOIC
- Type: Analog
- Axis: X, Y
- Acceleration Range: ±45g
- Sensitivity (LSB/g): -
- Sensitivity (mV/g): 50
- Bandwidth: 400Hz
- Output Type: Analog Voltage
- Voltage - Supply: 4.75 V ~ 5.25 V
- Features: -
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 20-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 20-SOIC
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pacote: 20-SOIC (0.295", 7.50mm Width) |
Estoque7.668 |
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NXP |
IC RF REMOTE WIRELESS 14SOIC
- Type: -
- Frequency: -
- Standards: -
- Interface: -
- Voltage - Supply: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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pacote: - |
Estoque4.302 |
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NXP |
IC MIXER 500MHZ UP CONVRT 20SSOP
- RF Type: Cellular, ASK, FSK, UHF, VHF
- Frequency: 500MHz
- Number of Mixers: 3
- Gain: 13dB
- Noise Figure: 5dB
- Secondary Attributes: Up Converter
- Current - Supply: 7.4mA
- Voltage - Supply: 4.5 V ~ 8 V
- Package / Case: 20-LSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 20-SSOP
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pacote: 20-LSSOP (0.173", 4.40mm Width) |
Estoque8.928 |
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NXP |
I.MX6ULL ROM PERF ENHAN
- Core Processor: ARM® Cortex®-A7
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 792MHz
- Co-Processors/DSP: Multimedia; NEON™ MPE
- RAM Controllers: LPDDR2, DDR3, DDR3L
- Graphics Acceleration: No
- Display & Interface Controllers: Electrophoretic, LCD
- Ethernet: 10/100 Mbps (1)
- SATA: -
- USB: USB 2.0 OTG + PHY (2)
- Voltage - I/O: 1.8V, 2.8V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TJ)
- Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
- Package / Case: 272-LFBGA
- Supplier Device Package: 272-MAPBGA (9x9)
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pacote: 272-LFBGA |
Estoque2.960 |
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NXP |
TELEMATICS PROCESSOR W/O MBX GRA
- Core Processor: e300
- Core Size: 32-Bit
- Speed: 400MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, USB OTG
- Peripherals: DMA, WDT
- Number of I/O: 147
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 1.08 V ~ 3.6 V
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 516-BBGA Exposed Pad
- Supplier Device Package: 516-FPBGA (27x27)
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pacote: 516-BBGA Exposed Pad |
Estoque6.416 |
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NXP |
2MB NVM 2 X E200Z4 CORES 150MH
- Core Processor: e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 150MHz
- Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: -
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 256K x 8
- Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
- Data Converters: A/D 64x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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pacote: 144-LQFP |
Estoque4.480 |
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NXP |
KINETIS E SERIES 64K FLASH 4K RA
- Core Processor: ARM® Cortex®-M0+
- Core Size: 32-Bit
- Speed: 40MHz
- Connectivity: I²C, LINbus, SPI, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 28
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 256 x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
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pacote: 32-LQFP |
Estoque4.416 |
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