Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 1:5 134MHZ 8SOP
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque6.544 |
|
1 | 1:5 | No/No | CMOS | CMOS | 134MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 2:4 1GHZ 16MLF
|
pacote: 16-VFQFN Exposed Pad, 16-MLF? |
Estoque174.420 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 1GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:4 16SOIC
|
pacote: 16-SOIC (0.154", 3.90mm Width) |
Estoque23.244 |
|
1 | 2:4 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque24.792 |
|
1 | 1:2 | Yes/Yes | ECL, LVECL, LVPECL. PECL | ECL, LVECL, LVPECL. PECL | 3GHz | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:4 2GHZ 16MLF
|
pacote: 16-VFQFN Exposed Pad, 16-MLF? |
Estoque4.672 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 2GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK MULTIPLXR 2:10 2GHZ 44MLF
|
pacote: 44-VFQFN Exposed Pad, 44-MLF? |
Estoque5.648 |
|
1 | 2:10 | Yes/Yes | CML, LVDS, PECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad, 44-MLF? | 44-MLF? (7x7) |
||
Microchip Technology |
IC CLK MULTIPLX 2:1 4.5GHZ 16MLF
|
pacote: 16-VFQFN Exposed Pad, 16-MLF? |
Estoque8.412 |
|
1 | 2:1 | Yes/Yes | CML, LVDS, LVPECL | CML | 4.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:1 3GHZ 8MLF
|
pacote: 8-VFDFN Exposed Pad, 8-MLF? |
Estoque3.392 |
|
1 | 1:1 | Yes/Yes | CML, LVDS, LVPECL | CML | 3GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF? | 8-MLF? (2x2) |
||
Microchip Technology |
IC CLK BUFFER 2:5 2GHZ 20TSSOP
|
pacote: 20-TSSOP (0.173", 4.40mm Width) |
Estoque7.872 |
|
1 | 2:5 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 2GHz | 2.37 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8MLF
|
pacote: 8-VFDFN Exposed Pad, 8-MLF? |
Estoque5.040 |
|
1 | 1:2 | Yes/Yes | ECL, PECL | ECL, PECL | 3GHz | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF? | 8-MLF? (2x2) |
||
Microchip Technology |
IC CLK BUFFER 1:9 134MHZ 16SOIC
|
pacote: 16-SOIC (0.154", 3.90mm Width) |
Estoque3.008 |
|
1 | 1:9 | No/No | Clock | Clock | 134MHz | 1.62 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOP |
||
Microchip Technology |
IC CLK BUFFER 2:5 20SOIC
|
pacote: 20-SOIC (0.295", 7.50mm Width) |
Estoque215.184 |
|
1 | 2:5 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:5 20SOIC
|
pacote: 20-SOIC (0.295", 7.50mm Width) |
Estoque6.156 |
|
1 | 2:5 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8MSOP
|
pacote: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Estoque22.200 |
|
1 | 1:2 | Yes/Yes | ECL, LVECL, LVPECL. PECL | ECL, LVECL, LVPECL. PECL | 3GHz | 2.375 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
IC CLK BUFFER 1:9 134MHZ 16SOP
|
pacote: 16-SOIC (0.154", 3.90mm Width) |
Estoque5.504 |
|
1 | 1:9 | No/No | Clock | Clock | 134MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 8SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque24.000 |
|
1 | 1:2 | Yes/Yes | Clock | Clock | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:9 134MHZ 16TSSOP
|
pacote: 16-TSSOP (0.173", 4.40mm Width) |
Estoque23.280 |
|
1 | 1:9 | No/No | Clock | Clock | 134MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 3.2GHZ 16MLF
|
pacote: 16-VQFN Exposed Pad, 16-MLF? |
Estoque52.884 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | CML | 3.2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:4 267MHZ 20TSSOP
|
pacote: 20-TSSOP (0.173", 4.40mm Width) |
Estoque7.848 |
|
1 | 2:4 | Yes/Yes | HCSL, LVDS | HCSL, LVDS | 267MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:9 134MHZ 16SOIC
|
pacote: 16-SOIC (0.154", 3.90mm Width) |
Estoque8.712 |
|
1 | 1:9 | No/No | Clock | Clock | 134MHz | 1.62 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOP |
||
Microchip Technology |
IC CLK BUFFER 2:8 800MHZ 28PLCC
|
pacote: 28-LCC (J-Lead) |
Estoque7.476 |
|
1 | 2:8 | Yes/Yes | LVECL, LVPECL | LVECL, LVPECL | 800MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:3 150MHZ 6SOT23
|
pacote: SOT-23-6 |
Estoque7.664 |
|
1 | 1:3 | No/No | LVCMOS, Sine Wave | LVCMOS | 150MHz | 1.62 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | SOT-23-6 | SOT-23-6 |
||
Microchip Technology |
IC CLK BUFFER 2:22 2GHZ 64TQFP
|
pacote: 64-TQFP Exposed Pad |
Estoque26.964 |
|
1 | 2:22 | Yes/Yes | LVDS, LVPECL | LVPECL | 2GHz | 2.37 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 1:16 500MHZ 48TQFP
|
pacote: 48-TQFP |
Estoque4.992 |
|
1 | 1:16 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 500MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 48-TQFP | 48-TQFP (7x7) |
||
Microchip Technology |
IC CLK MULTIPLXR 2:10 2GHZ 44MLF
|
pacote: 44-VFQFN Exposed Pad, 44-MLF? |
Estoque6.192 |
|
1 | 2:10 | Yes/Yes | CML, LVDS, PECL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad, 44-MLF? | 44-MLF? (7x7) |
||
Microchip Technology |
IC CLK MULTIPLXR 2:10 2GHZ 44MLF
|
pacote: 44-VFQFN Exposed Pad, 44-MLF? |
Estoque6.912 |
|
1 | 2:10 | Yes/Yes | CML, LVDS, PECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad, 44-MLF? | 44-MLF? (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8MSOP
|
pacote: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Estoque38.400 |
|
1 | 1:2 | Yes/Yes | LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8MSOP
|
pacote: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Estoque27.336 |
|
1 | 1:2 | Yes/Yes | LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 4GHZ 16MLF
|
pacote: 16-VFQFN Exposed Pad, 16-MLF? |
Estoque16.836 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, PECL | LVPECL | 4GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:20 2GHZ 64TQFP
|
pacote: 64-TQFP Exposed Pad |
Estoque6.384 |
|
1 | 2:20 | Yes/Yes | CML, LVDS, PECL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |