Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
Active-Semi International Inc. |
IC PMU MULTIFUNCTION
|
pacote: - |
Estoque4.112 |
|
- | - | - | - | - | - |
||
Active-Semi International Inc. |
IC PMU MULTIFUNCTION
|
pacote: - |
Estoque3.904 |
|
- | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC WIRELESS PWR RECEIVER
|
pacote: - |
Estoque7.040 |
|
- | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC WIRELESS PWR RECEIVER
|
pacote: - |
Estoque5.600 |
|
- | - | - | Surface Mount | - | 36-WLCSP (3.1x2.9) |
||
Texas Instruments |
IC CONV MICROPROCESSOR TO220-11
|
pacote: TO-220-11 (Formed Leads) |
Estoque212.796 |
|
100mA | 6 V ~ 26 V | -40°C ~ 125°C | Through Hole | TO-220-11 (Formed Leads) | TO-220-11 |
||
Maxim Integrated |
IC ELECTRONIC TRIP UNIT 100-LQFP
|
pacote: - |
Estoque7.280 |
|
- | - | - | Surface Mount | - | 100-LQFP |
||
Texas Instruments |
IC PWM PWR DRVR HI-EFF 32-HLQFP
|
pacote: 32-LQFP Exposed Pad |
Estoque3.456 |
|
- | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 32-LQFP Exposed Pad | 32-HLQFP (7x7) |
||
Diodes Incorporated |
HEATER CONTROLLER SO-16
|
pacote: - |
Estoque6.336 |
|
- | - | - | - | - | - |
||
Diodes Incorporated |
HEATER CONTROLLER SO-8
|
pacote: - |
Estoque7.168 |
|
- | - | - | - | - | - |
||
Infineon Technologies |
IC DIMMER 0-10V SOT23
|
pacote: - |
Estoque25.608 |
|
- | 11 V ~ 25 V | -40°C ~ 105°C | - | - | - |
||
Texas Instruments |
IC LCD SUP W/LINEAR REG 24HTSSOP
|
pacote: 24-TSSOP (0.173", 4.40mm Width) Exposed Pad |
Estoque60.432 |
|
700µA | 2.7 V ~ 5.8 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) Exposed Pad | 24-HTSSOP |
||
Texas Instruments |
IC CTLR PM HOTSWAP 24WQFN
|
pacote: 24-WFQFN Exposed Pad |
Estoque4.528 |
|
5.8mA | 2.9 V ~ 17 V | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-WQFN (4x5) |
||
NXP |
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
pacote: 48-LQFP Exposed Pad |
Estoque3.936 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
Linear Technology |
IC POWER MANAGEMENT
|
pacote: 8-VFSOP (0.049", 1.25mm Width) |
Estoque6.992 |
|
220µA | 2.5 V ~ 80 V | 0°C ~ 70°C | Surface Mount | 8-VFSOP (0.049", 1.25mm Width) | SC-70-8 |
||
Diodes Incorporated |
HEATER CONTROLLER DIP-8
|
pacote: - |
Estoque3.680 |
|
- | 3.5 V ~ 5.5 V | -20°C ~ 85°C (TA) | - | - | - |
||
Cypress Semiconductor Corp |
IC REG BUCK ENERGY HARVEST 40QFN
|
pacote: 40-VFQFN Exposed Pad |
Estoque6.960 |
|
1.9µA | 2.6 V ~ 18 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (6x6) |
||
Renesas Electronics America |
IC CCD DRIVER 2-PHS HS 8-SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque7.344 |
|
2.5mA | 4.5 V ~ 16 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
NXP |
FS8500 C0
|
pacote: - |
Request a Quote |
|
15mA | 60V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
Texas Instruments |
UC1834-SP HIGH EFFICIENCY LINEAR
|
pacote: - |
Request a Quote |
|
- | - | - | - | - | - |
||
NXP |
SYSTEM BASIS CHIP, DCDC 2.2A VCO
|
pacote: - |
Request a Quote |
|
- | 1V ~ 5V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |
||
Texas Instruments |
PROTOTYPE
|
pacote: - |
Request a Quote |
|
- | - | - | - | - | - |
||
Fairchild Semiconductor |
ANALOG CIRCUIT, 1 FUNC, PDSO20
|
pacote: - |
Request a Quote |
|
50mA (Max) | 11.4V ~ 12.6V | 0°C ~ 70°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
NXP |
IC PMIC VR5510 ASIL-D
|
pacote: - |
Request a Quote |
|
15mA | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
AUTO SBC
|
pacote: - |
Request a Quote |
|
30µA | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
Nisshinbo Micro Devices Inc. |
POWER MANAGEMENT SYSTEM DEVICE F
|
pacote: - |
Request a Quote |
|
- | - | - | - | - | - |
||
Analog Devices Inc./Maxim Integrated |
AUTOMOTIVE HI-SPEED USB 2.0 PROT
|
pacote: - |
Request a Quote |
|
45mA | 3V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 12-WFQFN Exposed Pad | 12-TQFN-SW (3x3) |
||
Analog Devices Inc./Maxim Integrated |
LOAD-DUMP/REVERSE-VOLTAGE PROTEC
|
pacote: - |
Request a Quote |
|
224µA | 3V ~ 30V | -40°C ~ 125°C (TA) | Surface Mount | 12-WFQFN Exposed Pad | 12-TQFN (3x3) |
||
Analog Devices Inc./Maxim Integrated |
25V SPAN, 800MA DEVICE POWER SUP
|
pacote: - |
Request a Quote |
|
20mA | 12V ~ 18V | 0°C ~ 70°C | Surface Mount | 100-TQFP Exposed Pad | 100-TQFP-EPR (14x14) |