Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
IC FLASH NOR
|
pacote: - |
Estoque7.920 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH 32GBIT 153WFBGA
|
pacote: 153-WFBGA |
Estoque3.968 |
|
FLASH | FLASH - NAND | 32Gb (4G x 8) | MMC | - | - | - | 2.7 V ~ 3.6 V | -25°C ~ 85°C (TA) | Surface Mount | 153-WFBGA | 153-WFBGA (11.5x13) |
||
Micron Technology Inc. |
IC FLASH/LPDRAM 1.5GBIT 130VFBGA
|
pacote: 130-VFBGA |
Estoque7.088 |
|
FLASH, RAM | FLASH - NAND, Mobile LPDRAM | 1Gb (128M x 8)(NAND), 512Mb (16M x 32)(LPDRAM) | Parallel | 166MHz | - | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 130-VFBGA | 130-VFBGA (8x9) |
||
Winbond Electronics |
IC SDRAM 2GBIT 400MHZ 60WBGA
|
pacote: 60-TFBGA |
Estoque33.960 |
|
DRAM | SDRAM - DDR2 | 2Gb (256M x 8) | Parallel | 200MHz | 15ns | 400ps | 1.7 V ~ 1.9 V | 0°C ~ 85°C (TC) | Surface Mount | 60-TFBGA | 60-WBGA (11x11.5) |
||
Microchip Technology |
IC FLASH 4MBIT 55NS 48TFBGA
|
pacote: 48-TFBGA |
Estoque6.320 |
|
FLASH | FLASH | 4Mb (512K x 8) | Parallel | - | 20µs | 55ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4MBIT 10NS 44TSOP
|
pacote: 44-TSOP (0.400", 10.16mm Width) |
Estoque4.320 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 10ns | 10ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Microchip Technology |
IC FLASH 4MBIT 50MHZ 8VDFN
|
pacote: 8-VDFN Exposed Pad |
Estoque5.472 |
|
FLASH | FLASH | 4Mb (264 Bytes x 2048 pages) | SPI | 50MHz | 4ms | - | 2.5 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-VDFN Exposed Pad | 8-VDFN (6x5) |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 4.5MBIT 200MHZ 119BGA
|
pacote: 119-BGA |
Estoque2.704 |
|
SRAM | SRAM - Synchronous | 4.5Mb (128K x 36) | Parallel | 200MHz | - | 3.1ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 119-BGA | 119-PBGA (14x22) |
||
Micron Technology Inc. |
IC SDRAM 256MBIT 133MHZ 54TSOP
|
pacote: 54-TSOP (0.400", 10.16mm Width) |
Estoque7.456 |
|
DRAM | SDRAM | 256Mb (32M x 8) | Parallel | 133MHz | 15ns | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Microchip Technology |
IC EEPROM 16KBIT 3MHZ 8SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque7.264 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 3MHz | 5ms | - | 1.8 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Cypress Semiconductor Corp |
IC SRAM 16MBIT 55NS 48BGA
|
pacote: 48-VFBGA |
Estoque4.880 |
|
SRAM | SRAM - Asynchronous | 16Mb (2M x 8, 1M x 16) | Parallel | - | 55ns | 55ns | 1.65 V ~ 2.2 V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFBGA | 48-VFBGA (6x8) |
||
ISSI, Integrated Silicon Solution Inc |
32MB QPI/QSPI WSON
|
pacote: 8-WDFN Exposed Pad |
Estoque6.128 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI - Quad I/O, QPI, DTR | 133MHz | 800µs | - | 1.65 V ~ 1.95 V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Microchip Technology |
IC EEPROM 64KBIT 10MHZ 8DIP
|
pacote: 8-DIP (0.300", 7.62mm) |
Estoque4.992 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
ON Semiconductor |
IC EEPROM 128KBIT 10MHZ 8TDFN
|
pacote: 8-WFDFN Exposed Pad |
Estoque4.256 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 10MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Cypress Semiconductor Corp |
IC SRAM 18MBIT 167MHZ 100TQFP
|
pacote: 100-LQFP |
Estoque8.964 |
|
SRAM | SRAM - Synchronous | 18Mb (1M x 18) | Parallel | 167MHz | - | 3.4ns | 2.375 V ~ 2.625 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
STMicroelectronics |
IC EEPROM 2KBIT 400KHZ 8UFDFPN
|
pacote: 8-UFDFN Exposed Pad |
Estoque6.384 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UFDFPN (2x3) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4MBIT 12NS 44TSOP
|
pacote: 44-TSOP (0.400", 10.16mm Width) |
Estoque3.472 |
|
SRAM | SRAM - Asynchronous | 4Mb (256K x 16) | Parallel | - | 12ns | 12ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Alliance Memory, Inc. |
IC SDRAM 512MBIT 133MHZ 54TSOP
|
pacote: 54-TSOP (0.400", 10.16mm Width) |
Estoque6.240 |
|
DRAM | SDRAM | 512Mb (64M x 8) | Parallel | 133MHz | 15ns | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 256M PARALLEL 84TWBGA
|
pacote: 84-TFBGA |
Estoque6.288 |
|
DRAM | SDRAM - DDR2 | 256Mb (16M x 16) | Parallel | 333MHz | 15ns | 450ps | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TC) | Surface Mount | 84-TFBGA | 84-TWBGA (8x12.5) |
||
Swissbit |
IND EMBEDDED MMC EM-10 16 GB MLC
|
pacote: 153-VFBGA |
Estoque2.896 |
|
FLASH | FLASH - NAND (MLC) | 16GB | eMMC | 52MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 105°C | Surface Mount | 153-VFBGA | 153-BGA (11.5x13) |
||
Infineon Technologies |
IC FLASH 1GBIT HYPERBUS 24FBGA
|
pacote: - |
Estoque3.900 |
|
FLASH | FLASH - NOR (SLC) | 1Gbit | HyperBus | 166 MHz | 1.7ms | 6.5 ns | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 24-VBGA | 24-FBGA (8x8) |
||
Intel |
IC FLASH 2MBIT CUI 40TSOP
|
pacote: - |
Request a Quote |
|
FLASH | FLASH - Boot Block | 2Mbit | CUI | - | 80ns | 80 ns | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | 40-TFSOP (0.724", 18.40mm Width) | 40-TSOP |
||
Winbond Electronics |
IC FLASH 128MBIT SPI 24TFBGA
|
pacote: - |
Request a Quote |
|
FLASH | FLASH - NOR | 128Mbit | SPI - Quad I/O, QPI | 104 MHz | 60µs, 5ms | - | 1.65V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
||
ISSI, Integrated Silicon Solution Inc |
64Mb, HyperRAM, 8Mbx8, 1.8V, 200
|
pacote: - |
Request a Quote |
|
PSRAM | PSRAM (Pseudo SRAM) | 64Mbit | HyperBus | 200 MHz | 35ns | 35 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
||
Winbond Electronics |
IC DRAM 2GBIT HSUL 12 134VFBGA
|
pacote: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR2-S4B | 2Gbit | HSUL_12 | 533 MHz | 15ns | - | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -40°C ~ 85°C (TC) | Surface Mount | 134-VFBGA | 134-VFBGA (10x11.5) |
||
Winbond Electronics |
IC FLASH 16MBIT SPI/QUAD 8USON
|
pacote: - |
Request a Quote |
|
FLASH | FLASH - NOR | 16Mbit | SPI - Quad I/O | 133 MHz | 3ms | - | 1.65V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-USON (4x3) |
||
Insignis Technology Corporation |
LPDDR4 2GB X16 3200MHZ CL22 10X1
|
pacote: - |
Estoque6.000 |
|
DRAM | SDRAM - Mobile LPDDR4 | 2Gbit | LVSTL | 1.6 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 85°C (TC) | Surface Mount | 200-WFBGA | 200-FBGA (10x14.5) |
||
Silicon Motion, Inc. |
IC FLASH 128GBIT EMMC 100BGA
|
pacote: - |
Request a Quote |
|
FLASH | FLASH - NAND (TLC) | 128Gbit | eMMC | - | - | - | - | -25°C ~ 85°C | Surface Mount | 100-LBGA | 100-BGA (14x18) |