Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC FLASH 128GBIT 169WFBGA
|
pacote: 169-VFBGA |
Estoque2.992 |
|
FLASH | FLASH - NAND | 128Gb (16G x 8) | MMC | - | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 169-VFBGA | 169-VFBGA |
||
Micron Technology Inc. |
IC FLASH/LPDRAM 1.5GBIT 130VFBGA
|
pacote: 130-VFBGA |
Estoque36.000 |
|
FLASH, RAM | FLASH - NAND, Mobile LPDRAM | 1Gb (64M x 16)(NAND), 512Mb (32M x 16)(LPDRAM) | Parallel | 200MHz | - | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 130-VFBGA | 130-VFBGA (8x9) |
||
Microchip Technology |
IC FLASH 8MBIT 66MHZ 8SOIC
|
pacote: 8-SOIC (0.209", 5.30mm Width) |
Estoque1.137.312 |
|
FLASH | FLASH | 8Mb (264 Bytes x 4096 pages) | SPI | 66MHz | 4ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 2KBIT 2MHZ 8MINIMAP
|
pacote: 8-UFDFN Exposed Pad |
Estoque6.304 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 2MHz | 10ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-Mini Map (2x3) |
||
Sharp Microelectronics |
IC SRAM 256KBIT 70NS 28DIP
|
pacote: 28-DIP (0.600", 15.24mm) |
Estoque15.288 |
|
SRAM | SRAM | 256Kb (32K x 8) | Parallel | - | 70ns | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-DIP |
||
Microchip Technology |
IC FLASH 2MBIT 120NS 32TSOP
|
pacote: 32-TFSOP (0.724", 18.40mm Width) |
Estoque6.992 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 50µs | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC EEPROM 64KBIT 250NS 32PLCC
|
pacote: 32-LCC (J-Lead) |
Estoque5.936 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 150NS 32TSOP
|
pacote: 32-TFSOP (0.724", 18.40mm Width) |
Estoque128.304 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 150ns | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 64KBIT 55NS 100TQFP
|
pacote: 100-LQFP |
Estoque2.592 |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kb (4K x 16) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Micron Technology Inc. |
IC FLASH 8GBIT 48TSOP
|
pacote: 48-TFSOP (0.724", 18.40mm Width) |
Estoque4.976 |
|
FLASH | FLASH - NAND | 8Gb (512M x 16) | Parallel | - | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
Microchip Technology |
IC EEPROM 256KBIT 10MHZ 8DFN
|
pacote: 8-VDFN Exposed Pad |
Estoque3.872 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 10MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC EEPROM 4KBIT 400KHZ 8MSOP
|
pacote: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Estoque7.840 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Macronix |
IC FLASH 16MBIT 104MHZ 8WSON
|
pacote: 8-WDFN Exposed Pad |
Estoque147.048 |
|
FLASH | FLASH - NOR | 16Mb (2M x 8) | SPI | 104MHz | 30µs, 3ms | - | 1.65 V ~ 2 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Alliance Memory, Inc. |
1G, DDR2, 64M X 16, 1.8V, 96-BAL
|
pacote: 84-TFBGA |
Estoque7.472 |
|
DRAM | SDRAM - DDR2 | 1Gb (64M x 16) | Parallel | 400MHz | 15ns | 400ps | 1.7 V ~ 1.9 V | -40°C ~ 95°C (TC) | Surface Mount | 84-TFBGA | 84-FBGA (8x12.5) |
||
Cypress Semiconductor Corp |
IC FLASH 1G PARALLEL 48TSOP I
|
pacote: 48-TFSOP (0.724", 18.40mm Width) |
Estoque2.512 |
|
FLASH | FLASH - NAND | 1Gb (128M x 8) | Parallel | - | 25ns | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
Cypress Semiconductor Corp |
IC MEMORY NOR
|
pacote: - |
Estoque5.744 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Winbond Electronics |
IC FLASH MEMORY 128MB
|
pacote: - |
Estoque5.056 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH 128M SPI 24TPBGA
|
pacote: 24-TBGA |
Estoque5.376 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI | 133MHz | 8ms, 2.8ms | - | 1.7 V ~ 2 V | -40°C ~ 105°C (TA) | Surface Mount | 24-TBGA | 24-T-PBGA (6x8) |
||
ISSI, Integrated Silicon Solution Inc |
IC FLASH 1TBIT EMMC 153VFBGA
|
pacote: - |
Request a Quote |
|
FLASH | FLASH - NAND (TLC) | 1Tbit | eMMC_5.1 | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 153-VFBGA | 153-VFBGA (11.5x13) |
||
Renesas Electronics Corporation |
EEPROM, 1KX8, SERIAL
|
pacote: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Rohm Semiconductor |
IC EEPROM 16KBIT MIC WIRE 8SSOPB
|
pacote: - |
Estoque7.500 |
|
EEPROM | EEPROM | 16Kbit | Microwire | 3 MHz | 5ms | - | 1.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-LSSOP (0.173", 4.40mm Width) | 8-SSOP-B |
||
Catalyst Semiconductor Inc. |
IC EEPROM 2KBIT I2C 400KHZ 8TDFN
|
pacote: - |
Request a Quote |
|
EEPROM | EEPROM | 2Kbit | I2C | 400 kHz | 5ms | 900 ns | 1.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Renesas Electronics Corporation |
SPI 8K EEPROM (1024 X 8-BIT)
|
pacote: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ProLabs |
Cisco MEM-RSP720-CF512M Compatib
|
pacote: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Everspin Technologies Inc. |
IC RAM 1GBIT PAR 96BGA
|
pacote: - |
Request a Quote |
|
RAM | MRAM (Magnetoresistive RAM) | 1Gbit | Parallel | 667 MHz | 15ns | 18 ns | 1.14V ~ 1.26V | 0°C ~ 85°C (TC) | Surface Mount | 96-TFBGA | 96-BGA (10x13) |
||
Micron Technology Inc. |
LPDDR5 128G X64 WFBGA
|
pacote: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Winbond Electronics |
IC FLASH 128MBIT SPI/QUAD 8SOIC
|
pacote: - |
Request a Quote |
|
FLASH | FLASH - NOR | 128Mbit | SPI - Quad I/O, QPI, DTR | 133 MHz | 3ms | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Micron Technology Inc. |
LPDDR4 12G 384MX32 FBGA DDP
|
pacote: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 12Gbit | Parallel | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V | -25°C ~ 85°C | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |