Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC FLASH 32GBIT WAFER
|
pacote: Die |
Estoque4.880 |
|
FLASH | FLASH - NAND | 32Gb (4G x 8) | Parallel | - | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 4MBIT 35NS 40TSOP
|
pacote: 44-TSOP (0.400", 10.16mm Width), 40 Leads |
Estoque7.728 |
|
DRAM | DRAM - EDO | 4Mb (256K x 16) | Parallel | - | - | 18ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width), 40 Leads | 40-TSOP |
||
Winbond Electronics |
IC FLASH 16MBIT 104MHZ 8WSON
|
pacote: 8-WDFN Exposed Pad |
Estoque16.476 |
|
FLASH | FLASH - NOR | 16Mb (2M x 8) | SPI | 104MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 18MBIT 250MHZ 165CABGA
|
pacote: 165-TBGA |
Estoque7.280 |
|
SRAM | SRAM - Synchronous, DDR II | 18Mb (1M x 18) | Parallel | 250MHz | - | 6.3ns | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 16MBIT 143MHZ 60TFBGA
|
pacote: 60-TFBGA |
Estoque2.736 |
|
DRAM | SDRAM | 16Mb (1M x 16) | Parallel | 143MHz | - | 5.5ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 60-TFBGA | 60-TFBGA (6.4x10.1) |
||
Micron Technology Inc. |
IC SDRAM 128MBIT 125MHZ 54VFBGA
|
pacote: 54-VFBGA |
Estoque5.216 |
|
DRAM | SDRAM - Mobile LPSDR | 128Mb (8M x 16) | Parallel | 125MHz | 15ns | 7ns | 2.3 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 54-VFBGA | 54-VFBGA (8x8) |
||
Micron Technology Inc. |
IC SDRAM 256MBIT 167MHZ 66TSOP
|
pacote: 66-TSSOP (0.400", 10.16mm Width) |
Estoque6.448 |
|
DRAM | SDRAM - DDR | 256Mb (32M x 8) | Parallel | 167MHz | 15ns | 700ps | 2.3 V ~ 2.7 V | -40°C ~ 85°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP |
||
Microchip Technology |
IC EEPROM 32KBIT 400KHZ 8SOIC
|
pacote: 8-SOIC (0.209", 5.30mm Width) |
Estoque4.832 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 400kHz | 10ms | 900ns | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 1KBIT 400KHZ 8DIP
|
pacote: 8-DIP (0.300", 7.62mm) |
Estoque237.000 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 400kHz | 5ms | 900ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 133MHZ 208CABGA
|
pacote: 208-LFBGA |
Estoque7.568 |
|
SRAM | SRAM - Dual Port, Synchronous | 9Mb (256K x 36) | Parallel | 133MHz | - | 4.2ns | 2.4 V ~ 2.6 V | -40°C ~ 85°C (TA) | Surface Mount | 208-LFBGA | 208-CABGA (15x15) |
||
Micron Technology Inc. |
IC FLASH 512GBIT 167MHZ 152TBGA
|
pacote: - |
Estoque6.544 |
|
FLASH | FLASH - NAND | 512Gb (64G x 8) | Parallel | 166MHz | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 18KBIT 25NS 52PLCC
|
pacote: 52-LCC (J-Lead) |
Estoque5.600 |
|
SRAM | SRAM - Dual Port, Asynchronous | 18Kb (2K x 9) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
Micron Technology Inc. |
IC SDRAM 128MBIT 166MHZ 90VFBGA
|
pacote: 90-VFBGA |
Estoque3.872 |
|
DRAM | SDRAM | 128Mb (4M x 32) | Parallel | 167MHz | 12ns | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 90-VFBGA | 90-VFBGA (8x13) |
||
Adesto Technologies |
IC FLASH 16MBIT 85MHZ 8SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque5.984 |
|
FLASH | FLASH | 16Mb (528 Bytes x 4096 pages) | SPI | 85MHz | 8µs, 6ms | - | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 400KHZ 8DIP
|
pacote: 8-DIP (0.300", 7.62mm) |
Estoque5.760 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 4KBIT 2MHZ 8TSSOP
|
pacote: 8-TSSOP (0.173", 4.40mm Width) |
Estoque7.568 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 2MHz | 6ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Cypress Semiconductor Corp |
IC SRAM 72MBIT 500MHZ 165FBGA
|
pacote: 165-LBGA |
Estoque4.464 |
|
SRAM | SRAM - Synchronous, QDR II+ | 72Mb (2M x 36) | Parallel | 500MHz | - | - | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
Microchip Technology |
IC EEPROM 512KBIT 1MHZ 8TSSOP
|
pacote: 8-TSSOP (0.173", 4.40mm Width) |
Estoque21.456 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 1MHz | 5ms | 550ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 32KBIT 400KHZ 8SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque1.258.344 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Cypress Semiconductor Corp |
IC FLASH 128M PARALLEL 44FBGA
|
pacote: 44-VFBGA |
Estoque5.264 |
|
FLASH | FLASH - NOR | 128Mb (8M x 16) | Parallel | 108MHz | 60ns | 80ns | 1.7 V ~ 1.95 V | -25°C ~ 85°C (TA) | Surface Mount | 44-VFBGA | 44-FBGA (7.5x5) |
||
Cypress Semiconductor Corp |
IC 256M PAGE-MODE FLASH MEMORY
|
pacote: 56-VFBGA |
Estoque7.104 |
|
FLASH, RAM | FLASH, PSRAM | 128Mbit Flash, 32Mbit RAM | Parallel | 108MHz | - | - | 1.7V ~ 3.6V | -25°C ~ 85°C (TA) | Surface Mount | 56-VFBGA | 56-VFRBGA (7.7x6.2) |
||
Winbond Electronics |
IC DRAM 64MBIT HYPERBUS 24TFBGA
|
pacote: - |
Request a Quote |
|
DRAM | HyperRAM | 64Mbit | HyperBus | 200 MHz | 35ns | 35 ns | 1.7V ~ 2V | -40°C ~ 85°C (TC) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
||
Kingston Technology |
IC FLASH 256GBIT EMMC 153FBGA
|
pacote: - |
Request a Quote |
|
FLASH | FLASH - NAND (TLC) | 256Gbit | eMMC | - | - | - | 1.8V, 3.3V | -40°C ~ 85°C | Surface Mount | 153-FBGA | 153-FBGA (11.5x13) |
||
Winbond Electronics |
IC FLASH 128MBIT SPI 24TFBGA
|
pacote: - |
Request a Quote |
|
FLASH | FLASH - NOR | 128Mbit | SPI - Quad I/O, QPI, DTR | 133 MHz | 3ms | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
||
Sanyo |
SERIAL SPI EEPROM
|
pacote: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
IC EPROM 128KBIT PARALLEL
|
pacote: - |
Request a Quote |
|
EPROM | EPROM - UV | 128Kbit | Parallel | - | - | 65 ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TA) | - | - | - |
||
Micron Technology Inc. |
IC FLASH 2TBIT PARALLEL 132VBGA
|
pacote: - |
Request a Quote |
|
FLASH | FLASH - NAND (TLC) | 2Tbit | Parallel | - | - | - | 1.7V ~ 1.95V | 0°C ~ 70°C (TA) | Surface Mount | 132-VBGA | 132-VBGA (12x18) |
||
Renesas Electronics Operations Services Limited |
16 MBIT, WIDE VCC (1.65V TO 3.6V
|
pacote: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 16Mbit | SPI - Quad I/O | 133 MHz | 32µs, 6.5ms | 8 ns | 1.65V ~ 3.75V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Infineon Technologies |
IC FLASH 64MBIT PARALLEL 48TSOP
|
pacote: - |
Request a Quote |
|
FLASH | FLASH - NOR | 64Mbit | Parallel | - | 60ns | 90 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Intelligent Memory Ltd. |
LPDDR4X 8GB 512MX16 2133MHZ FBGA
|
pacote: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 8Gbit | Parallel | 2.133 GHz | 18ns | - | 1.17V ~ 1.06V, 1.95V ~ 1.7V | -25°C ~ 85°C (TC) | Surface Mount | 200-VFBGA | 200-FBGA (10x15) |