Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ISSI, Integrated Silicon Solution Inc |
IC PSRAM 64MBIT 70NS 48BGA
|
pacote: 48-TFBGA |
Estoque5.376 |
|
PSRAM | PSRAM (Pseudo SRAM) | 64Mb (4M x 16) | Parallel | - | 70ns | 70ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Micron Technology Inc. |
IC FLASH 512GBIT 83MHZ 100LBGA
|
pacote: - |
Estoque2.464 |
|
FLASH | FLASH - NAND | 512Gb (64G x 8) | Parallel | 83MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
Micron Technology Inc. |
IC SDRAM 4GBIT 333MHZ 240FBGA
|
pacote: 240-WFBGA |
Estoque6.304 |
|
DRAM | SDRAM - Mobile LPDDR2 | 4Gb (64M x 64) | Parallel | 333MHz | - | - | 1.14 V ~ 1.3 V | -25°C ~ 85°C (TC) | Surface Mount | 240-WFBGA | 240-FBGA (14x14) |
||
Microchip Technology |
IC EEPROM 256KBIT 1MHZ 8SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque6.000 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 18MBIT 250MHZ 165BGA
|
pacote: 165-FBGA |
Estoque2.768 |
|
SRAM | SRAM - Synchronous | 18Mb (512K x 36) | Parallel | 250MHz | - | 2.6ns | 2.375 V ~ 2.625 V | 0°C ~ 70°C (TA) | Surface Mount | 165-FBGA | 165-PBGA (13x15) |
||
Micron Technology Inc. |
IC SDRAM 128MBIT 133MHZ 54TSOP
|
pacote: 54-TSOP (0.400", 10.16mm Width) |
Estoque29.508 |
|
DRAM | SDRAM | 128Mb (8M x 16) | Parallel | 133MHz | 15ns | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Microchip Technology |
IC FLASH 2MBIT 70NS 48TSOP
|
pacote: 48-TFSOP (0.724", 18.40mm Width) |
Estoque8.712 |
|
FLASH | FLASH | 2Mb (256K x 8, 128K x 16) | Parallel | - | 50µs | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC FLASH 2MBIT 90NS 32TSOP
|
pacote: 32-TFSOP (0.724", 18.40mm Width) |
Estoque3.584 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 50µs | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC EEPROM 64KBIT 70NS 28DIP
|
pacote: 28-DIP (0.600", 15.24mm) |
Estoque3.712 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28CPGA
|
pacote: 28-BCPGA |
Estoque2.912 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 512KBIT 20NS 84PLCC
|
pacote: 84-LCC (J-Lead) |
Estoque7.568 |
|
SRAM | SRAM - Dual Port, Asynchronous | 512Kb (64K x 8) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 84-LCC (J-Lead) | 84-PLCC (29.21x29.21) |
||
Everspin Technologies Inc. |
IC MRAM 4MBIT 35NS 44TSOP
|
pacote: 44-TSOP (0.400", 10.16mm Width) |
Estoque4.272 |
|
RAM | MRAM (Magnetoresistive RAM) | 4Mb (256K x 16) | Parallel | - | 35ns | 35ns | 3 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP2 |
||
Micron Technology Inc. |
IC SDRAM 1GBIT 1067MHZ 96BGA
|
pacote: 96-TFBGA |
Estoque4.528 |
|
DRAM | SDRAM - DDR3 | 1Gb (64M x 16) | Parallel | 1067MHz | - | - | 1.425 V ~ 1.575 V | 0°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (8x14) |
||
Cypress Semiconductor Corp |
NOR
|
pacote: - |
Estoque6.272 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8, 4M x 16) | Parallel | - | 60ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
Cypress Semiconductor Corp |
NAND
|
pacote: - |
Estoque6.032 |
|
FLASH | FLASH - NAND | 1Gb (128M x 8) | Parallel | - | - | 25ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
Cypress Semiconductor Corp |
IC DRAM 64MBIT 1.8V 166MHZ 24BGA
|
pacote: 24-TBGA |
Estoque6.288 |
|
DRAM | DRAM | 64Mb (8M x 8) | Parallel | 166MHz | - | 40ns | 1.7 V ~ 1.95 V | -40°C ~ 105°C (TA) | Surface Mount | 24-TBGA | 24-BGA (6x8) |
||
Rohm Semiconductor |
IC EEPROM 1KBIT 400KHZ 8SSOPB
|
pacote: 8-LSSOP (0.173", 4.40mm Width) |
Estoque55.992 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 400kHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-LSSOP (0.173", 4.40mm Width) | 8-SSOPB |
||
Winbond Electronics |
IC SDRAM 1GBIT 400MHZ 84BGA
|
pacote: 84-TFBGA |
Estoque53.016 |
|
DRAM | SDRAM - DDR2 | 1Gb (64M x 16) | Parallel | 200MHz | 15ns | 400ps | 1.7 V ~ 1.9 V | 0°C ~ 85°C (TC) | Surface Mount | 84-TFBGA | 84-WBGA (8x12.5) |
||
Microchip Technology |
IC EEPROM 1K SPI 3MHZ WAFER
|
pacote: Die |
Estoque5.472 |
|
EEPROM | EEPROM | 1Kb (128 x 8 , 64 x 16) | SPI | 3MHz | 6ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Alliance Memory, Inc. |
IC DRAM 512M PARALLEL 78FBGA
|
pacote: 78-VFBGA |
Estoque6.800 |
|
DRAM | SDRAM - DDR3 | 512Mb (64M x 8) | Parallel | 800MHz | - | 20ns | 1.425 V ~ 1.575 V | -40°C ~ 95°C (TA) | Surface Mount | 78-VFBGA | 78-FBGA (8x10.5) |
||
Micron Technology Inc. |
MEMORY DRAM
|
pacote: 96-TFBGA |
Estoque5.040 |
|
DRAM | SDRAM - DDR3L | 4Gb (256M x 16) | Parallel | 933MHz | - | 20ns | 1.283 V ~ 1.45 V | -40°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (8x14) |
||
Micron Technology Inc. |
IC FLASH 128M SPI 108MHZ 16SOP2
|
pacote: 16-SOIC (0.295", 7.50mm Width) |
Estoque7.568 |
|
FLASH | FLASH - NOR | 128Mb (32M x 4) | SPI | 108MHz | 8ms, 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOP2 |
||
Micron Technology Inc. |
IC FLASH 512G MMC
|
pacote: - |
Estoque3.264 |
|
FLASH | FLASH - NAND | 512Gb (64G x 8) | MMC | - | - | - | - | -40°C ~ 105°C (TA) | - | - | - |
||
Insignis Technology Corporation |
LPDDR4 4GB X16 2400MHZ CL16 10X1
|
pacote: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 4Gbit | LVSTL | 1.2 GHz | - | - | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 85°C (TC) | Surface Mount | 200-WFBGA | 200-FBGA (10x14.5) |
||
Winbond Electronics |
IC FLASH 16MBIT SPI/QUAD 8WSON
|
pacote: - |
Request a Quote |
|
FLASH | FLASH - NOR | 16Mbit | SPI - Quad I/O | 133 MHz | 3ms | - | 1.65V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
onsemi |
IC FLASH 16MBIT SPI 70MHZ 8VSOIC
|
pacote: - |
Request a Quote |
|
FLASH | FLASH | 16Mbit | SPI | 70 MHz | 700µs | 8 ns | 1.65V ~ 1.95V | -40°C ~ 90°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-VSOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 3-WIRE 8TSSOP
|
pacote: - |
Request a Quote |
|
EEPROM | EEPROM | 16Kbit | 3-Wire Serial | 2 MHz | 10ms | - | 1.8V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Winbond Electronics |
IC FLASH 2GBIT ONFI 63VFBGA
|
pacote: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 2Gbit | ONFI | - | 25ns | 20 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 63-VFBGA | 63-VFBGA (9x11) |