Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ISSI, Integrated Silicon Solution Inc |
IC SRAM 4MBIT 45NS 44TSOP
|
pacote: 44-TSOP (0.400", 10.16mm Width) |
Estoque2.848 |
|
SRAM | SRAM - Asynchronous | 4Mb (256K x 16) | Parallel | - | 55ns | 55ns | 2.3 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Micron Technology Inc. |
IC FLASH 256GBIT 169TFBGA
|
pacote: - |
Estoque7.440 |
|
FLASH | FLASH - NAND | 256Gb (32G x 8) | MMC | - | - | - | 2.7 V ~ 3.6 V | -25°C ~ 85°C (TA) | Surface Mount | - | - |
||
Micron Technology Inc. |
IC RLDRAM 288MBIT 400MHZ 144UBGA
|
pacote: 144-TFBGA |
Estoque39.216 |
|
DRAM | DRAM | 288Mb (16M x 18) | Parallel | 400MHz | - | 20ns | 1.7 V ~ 1.9 V | 0°C ~ 95°C (TC) | Surface Mount | 144-TFBGA | 144-µBGA (18.5x11) |
||
Cypress Semiconductor Corp |
IC SRAM 36MBIT 200MHZ 165FBGA
|
pacote: 165-LBGA |
Estoque16.752 |
|
SRAM | SRAM - Synchronous, QDR II | 36Mb (2M x 18) | Parallel | 200MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (15x17) |
||
STMicroelectronics |
IC OTP 4MBIT 90NS 44PLCC
|
pacote: 44-LCC (J-Lead) |
Estoque4.496 |
|
EPROM | EPROM - OTP | 4Mb (256K x 16) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.51x16.51) |
||
Microchip Technology |
IC FLASH 16MBIT 66MHZ 28TSOP
|
pacote: 28-TSSOP (0.465", 11.80mm Width) |
Estoque5.824 |
|
FLASH | FLASH | 16Mb (528 Bytes x 4096 pages) | SPI | 66MHz | 6ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Micron Technology Inc. |
IC FLASH 128GBIT 100LBGA
|
pacote: - |
Estoque7.904 |
|
FLASH | FLASH - NAND | 128Gb (16G x 8) | MMC | - | - | - | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 100MHZ 100TQFP
|
pacote: 100-LQFP |
Estoque5.712 |
|
SRAM | SRAM - Synchronous ZBT | 4.5Mb (256K x 18) | Parallel | 100MHz | - | 5ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Micron Technology Inc. |
IC SDRAM 256MBIT 200MHZ 66TSOP
|
pacote: 66-TSSOP (0.400", 10.16mm Width) |
Estoque50.844 |
|
DRAM | SDRAM - DDR | 256Mb (32M x 8) | Parallel | 200MHz | 15ns | 700ps | 2.5 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP |
||
Cypress Semiconductor Corp |
IC FLASH NOR 8SOIC
|
pacote: - |
Estoque5.472 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI - Quad I/O | 108MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
Microchip Technology |
IC EEPROM 2KBIT 400KHZ 8SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque7.536 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Fremont Micro Devices USA |
IC EEPROM 1KBIT 2MHZ 8SOP
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque17.916 |
|
EEPROM | EEPROM | 1Kb (128 x 8, 64 x 16) | SPI | 2MHz | 10ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Cypress Semiconductor Corp |
IC FLASH 256M SPI 80MHZ 8WSON
|
pacote: 8-WDFN Exposed Pad |
Estoque4.368 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI - Quad I/O | 80MHz | - | - | 1.7 V ~ 2 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x8) |
||
Cypress Semiconductor Corp |
IC FLASH 128M SPI 133MHZ 16SOIC
|
pacote: 16-SOIC (0.295", 7.50mm Width) |
Estoque6.224 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI - Quad I/O | 133MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 32M PARALLEL 166MHZ
|
pacote: 54-TFBGA |
Estoque2.752 |
|
DRAM | SDRAM - Mobile | 32Mb (2M x 16) | Parallel | 166MHz | - | 5.5ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TFBGA | 54-TFBGA (8x8) |
||
Cypress Semiconductor Corp |
IC FLASH 64M SPI 108MHZ 8SOIC
|
pacote: 8-SOIC (0.209", 5.30mm Width) |
Estoque4.448 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8) | SPI - Quad I/O, QPI | 108MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 128M PARALLEL 166MHZ
|
pacote: 54-TFBGA |
Estoque2.112 |
|
DRAM | SDRAM | 128Mb (8M x 16) | Parallel | 166MHz | - | 5.4ns | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 54-TFBGA | 54-TFBGA (8x8) |
||
Winbond Electronics |
IC SDRAM 2G DDR3 96WFBGA
|
pacote: 96-VFBGA |
Estoque6.688 |
|
DRAM | SDRAM - DDR3L | 2Gb (128M x 16) | Parallel | 667MHz | 15ns | 20ns | 1.283V ~ 1.45V | -40°C ~ 95°C (TC) | Surface Mount | 96-VFBGA | 96-VFBGA (7.5x13) |
||
Infineon Technologies |
IC FLASH 512MBIT HYPERBUS 24FBGA
|
pacote: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 512Mbit | HyperBus | 166 MHz | - | 96 ns | 1.7V ~ 1.95V | -40°C ~ 125°C (TA) | Surface Mount | 24-VBGA | 24-FBGA (6x8) |
||
Micron Technology Inc. |
LPDDR4 96G X64 TFBGA
|
pacote: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 96Gbit | - | 2.133 GHz | - | - | - | -40°C ~ 105°C | Surface Mount | 556-TFBGA | 556-WFBGA (12.4x12.4) |
||
Winbond Electronics |
IC FLASH 64MBIT SPI/QUAD 8XSON
|
pacote: - |
Request a Quote |
|
FLASH | FLASH - NOR | 64Mbit | SPI - Quad I/O, QPI, DTR | 133 MHz | 3ms | 6 ns | 1.7V ~ 1.95V | -40°C ~ 105°C (TA) | Surface Mount | 8-XDFN Exposed Pad | 8-XSON (4x4) |
||
Infineon Technologies |
IC FLASH 64MBIT PARALLEL 48VFBGA
|
pacote: - |
Estoque1.815 |
|
FLASH | FLASH - NOR | 64Mbit | Parallel | - | 55ns | 55 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFBGA | 48-VFBGA (8.15x6.15) |
||
ISSI, Integrated Silicon Solution Inc |
IC FLASH 512GBIT EMMC 153VFBGA
|
pacote: - |
Request a Quote |
|
FLASH | FLASH - NAND (TLC) | 512Gbit | eMMC_5.1 | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 153-VFBGA | 153-VFBGA (11.5x13) |
||
ISSI, Integrated Silicon Solution Inc |
2G, 1.35V, DDR3L, 128Mx16, 1600M
|
pacote: - |
Request a Quote |
|
DRAM | SDRAM - DDR3L | 2Gbit | Parallel | 800 MHz | 15ns | 20 ns | 1.283V ~ 1.45V | 0°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-TWBGA (9x13) |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 4MBIT SPI/QUAD I/O 8SOP
|
pacote: - |
Estoque43.365 |
|
FLASH | FLASH - NOR | 4Mbit | SPI - Quad I/O | 104 MHz | 50µs, 2.4ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Cypress Semiconductor Corp |
IC SRAM 2MBIT PARALLEL 172FBGA
|
pacote: - |
Request a Quote |
|
SRAM | SRAM - Dual Port, Synchronous | 2Mbit | Parallel | 133 MHz | - | - | 3.135V ~ 3.465V | 0°C ~ 70°C (TA) | Surface Mount | 172-LBGA | 172-FBGA (15x15) |
||
Microchip Technology |
IC EEPROM 256BIT MICROWIRE 8DIP
|
pacote: - |
Request a Quote |
|
EEPROM | EEPROM | 256bit | Microwire | 1 MHz | 2ms | - | 4.5V ~ 5.5V | -40°C ~ 125°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Winbond Electronics |
IC FLASH 16MBIT SPI/QUAD 8SOIC
|
pacote: - |
Request a Quote |
|
FLASH | FLASH - NOR | 16Mbit | SPI - Quad I/O | 133 MHz | 3ms | 6 ns | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |