Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
AKM Semiconductor Inc. |
IC EEPROM 4KBIT 8MSOP
|
pacote: - |
Estoque5.200 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | - | - | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | - | 8-MSOP |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 333MHZ 84BGA
|
pacote: 84-TFBGA |
Estoque3.920 |
|
DRAM | SDRAM - DDR2 | 256Mb (16M x 16) | Parallel | 333MHz | 15ns | 450ps | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 84-TFBGA | 84-TWBGA (8x12.5) |
||
Micron Technology Inc. |
IC SDRAM 16GBIT 400MHZ FBGA
|
pacote: 216-VFBGA |
Estoque2.832 |
|
DRAM | SDRAM - Mobile LPDDR2 | 16Gb (256M x 64) | Parallel | 400MHz | - | - | 1.14 V ~ 1.3 V | -30°C ~ 85°C (TC) | Surface Mount | 216-VFBGA | 216-FBGA (12x12) |
||
Winbond Electronics |
IC FLASH 4MBIT 80MHZ 8WSON
|
pacote: 8-WDFN Exposed Pad |
Estoque198.636 |
|
FLASH | FLASH - NOR | 4Mb (512K x 8) | SPI | 80MHz | 800µs | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Microchip Technology |
IC FLASH 4MBIT 200NS 32TSOP
|
pacote: 32-TFSOP (0.724", 18.40mm Width) |
Estoque3.152 |
|
FLASH | FLASH | 4Mb (512K x 8) | Parallel | - | 20ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC FLASH 2MBIT 70NS 32TSOP
|
pacote: 32-TFSOP (0.724", 18.40mm Width) |
Estoque12.264 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 3MHZ 8DIP
|
pacote: 8-DIP (0.300", 7.62mm) |
Estoque5.328 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 3MHz | 5ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 8KBIT 25NS 64TQFP
|
pacote: 64-LQFP |
Estoque6.816 |
|
SRAM | SRAM - Dual Port, Asynchronous | 8Kb (1K x 8) | Parallel | - | 25ns | 25ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 64-LQFP | 64-TQFP (10x10) |
||
Everspin Technologies Inc. |
IC MRAM 1MBIT 45NS 48FBGA
|
pacote: 48-LFBGA |
Estoque5.472 |
|
RAM | MRAM (Magnetoresistive RAM) | 1Mb (128K x 8) | Parallel | - | 45ns | 45ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-LFBGA | 48-FBGA (8x8) |
||
Cypress Semiconductor Corp |
IC SRAM 8MBIT 55NS 48TSOP
|
pacote: 48-TFSOP (0.724", 18.40mm Width) |
Estoque3.024 |
|
SRAM | SRAM - Asynchronous | 8Mb (512K x 16) | Parallel | - | 55ns | 55ns | 2.2 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 4GBIT 667MHZ 96BGA
|
pacote: 96-TFBGA |
Estoque7.104 |
|
DRAM | SDRAM - DDR3 | 4Gb (256M x 16) | Parallel | 667MHz | 15ns | 20ns | 1.425 V ~ 1.575 V | 0°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-TWBGA (9x13) |
||
Micron Technology Inc. |
IC SDRAM 256MBIT 200MHZ 66TSOP
|
pacote: 66-TSSOP (0.400", 10.16mm Width) |
Estoque25.524 |
|
DRAM | SDRAM - DDR | 256Mb (16M x 16) | Parallel | 200MHz | 15ns | 700ps | 2.5 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP |
||
Cypress Semiconductor Corp |
IC SRAM 1MBIT 15NS 44TSOP
|
pacote: 44-TSOP (0.400", 10.16mm Width) |
Estoque192.000 |
|
SRAM | SRAM - Asynchronous | 1Mb (64K x 16) | Parallel | - | 15ns | 15ns | 2.5 V ~ 2.7 V | -40°C ~ 125°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
IDT, Integrated Device Technology Inc |
IC SRAM 16KBIT 20NS 24DIP
|
pacote: 24-DIP (0.300", 7.62mm) |
Estoque5.808 |
|
SRAM | SRAM - Asynchronous | 16Kb (2K x 8) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 24-DIP (0.300", 7.62mm) | 24-PDIP |
||
Microchip Technology |
IC FLASH 2MBIT 80MHZ 8WSON
|
pacote: 8-WDFN Exposed Pad |
Estoque11.580 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 80MHz | 10µs | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON |
||
Microchip Technology |
IC FLASH 4MBIT 70NS 48WFBGA
|
pacote: 48-WFBGA |
Estoque17.628 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-WFBGA | 48-WFBGA (6x4) |
||
Microchip Technology |
IC EEPROM 8KBIT 400KHZ 8MSOP
|
pacote: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Estoque2.912 |
|
EEPROM | EEPROM | 8Kb (256 x 8 x 4) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
STMicroelectronics |
IC EEPROM 16KBIT 10MHZ 8TSSOP
|
pacote: 8-TSSOP (0.173", 4.40mm Width) |
Estoque260.580 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4MBIT 10NS 44TSOP
|
pacote: 44-TSOP (0.400", 10.16mm Width) |
Estoque4.896 |
|
SRAM | SRAM - Asynchronous | 4Mb (256K x 16) | Parallel | - | 10ns | 10ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Cypress Semiconductor Corp |
IC SRAM 256KBIT 70NS 28DIP
|
pacote: 28-DIP (0.600", 15.24mm) |
Estoque46.368 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 70ns | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-DIP |
||
Micron Technology Inc. |
IC SDRAM 512MBIT 200MHZ 60FBGA
|
pacote: 60-TFBGA |
Estoque4.464 |
|
DRAM | SDRAM - DDR | 512Mb (128M x 4) | Parallel | 200MHz | 15ns | 700ps | 2.5 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 60-TFBGA | 60-FBGA (10x12.5) |
||
STMicroelectronics |
IC EEPROM 512KBIT 1MHZ 8UFDFPN
|
pacote: 8-UFDFN Exposed Pad |
Estoque62.880 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 1MHz | 5ms | 500ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UFDFPN (2x3) |
||
Rohm Semiconductor |
MICROWIRE BUS 4KBIT(256X16BIT) E
|
pacote: 8-VSSOP, 8-MSOP (0.110", 2.80mm Width) |
Estoque25.428 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 3MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VSSOP, 8-MSOP (0.110", 2.80mm Width) | 8-MSOP |
||
Winbond Electronics |
IC FLASH MEMORY 256MB
|
pacote: - |
Estoque7.568 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IC PSRAM 64MBIT SPI/OCTAL 24FBGA
|
pacote: - |
Request a Quote |
|
PSRAM | PSRAM (Pseudo SRAM) | 64Mbit | SPI - Octal I/O | 200 MHz | 35ns | 35 ns | 1.7V ~ 2V | -40°C ~ 105°C (TA) | Surface Mount | 24-VBGA | 24-FBGA (6x8) |
||
Winbond Electronics |
IC FLASH 256MBIT SPI/QUAD 8WSON
|
pacote: - |
Request a Quote |
|
FLASH | FLASH - NAND | 256Mbit | SPI - Quad I/O, QPI, DTR | 80 MHz | - | 6 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
||
ISSI, Integrated Silicon Solution Inc |
Automotive (Tc: -40 to +105C), 4
|
pacote: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 4Gbit | LVSTL | 1.6 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | Surface Mount | 200-WFBGA | 200-VFBGA (10x14.5) |
||
Infineon Technologies |
IC FRAM 2MBIT PARALLEL 44TSOP II
|
pacote: - |
Request a Quote |
|
FRAM | FRAM (Ferroelectric RAM) | 2Mbit | Parallel | - | 90ns | 90 ns | 2V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Macronix |
MEMORY
|
pacote: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 4Gbit | ONFI | - | 20ns, 600µs | 16 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Micron Technology Inc. |
TLC 1T 128GX8 VBGA DDP
|
pacote: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |