Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx Inc. |
IC PROM SERIAL 128K 8-DIP
|
pacote: 8-DIP (0.300", 7.62mm) |
Estoque3.632 |
|
128kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FPGA 256K CONFIG MEM 8DIP
|
pacote: 8-DIP (0.300", 7.62mm) |
Estoque5.712 |
|
256Kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FLASH CONFIG 16M 20PLCC
|
pacote: 20-LCC (J-Lead) |
Estoque5.376 |
|
16Mb | 2.97 V ~ 3.63 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC CONFIG SEEPROM 4M 3.3V 44TQFP
|
pacote: 44-TQFP |
Estoque6.016 |
|
4Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 44-TQFP | 44-TQFP (10x10) |
||
Microchip Technology |
IC SRL CONFG EEPROM 256K 20-PLCC
|
pacote: 20-LCC (J-Lead) |
Estoque4.144 |
|
256Kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFG EEPROM 128K 20-PLCC
|
pacote: 20-LCC (J-Lead) |
Estoque3.392 |
|
128kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFG EEPROM 2M LV 20PLCC
|
pacote: 20-LCC (J-Lead) |
Estoque12.564 |
|
2Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 44-VQFP
|
pacote: 44-TQFP |
Estoque5.776 |
|
512kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM SER 500K 8-SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque6.016 |
|
500kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER 300K 8-SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque69.324 |
|
300kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER 200000 I-TEMP 8-DIP
|
pacote: 8-DIP (0.300", 7.62mm) |
Estoque6.672 |
|
2Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER 5K 8-SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque86.388 |
|
150kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER C-TEMP 128K 20-PLCC
|
pacote: 20-LCC (J-Lead) |
Estoque4.496 |
|
128kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER I-TEMP 1K 20-SOIC
|
pacote: 20-SOIC (0.295", 7.50mm Width) |
Estoque6.256 |
|
1Mb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SER C-TEMP 1K 8-DIP
|
pacote: 8-DIP (0.300", 7.62mm) |
Estoque7.548 |
|
1Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM FPGA 64KB 8-SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque5.008 |
|
64kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SER CNFIG PROM 128K 3.3V 8DIP
|
pacote: 8-DIP (0.300", 7.62mm) |
Estoque96.888 |
|
128kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SER CNFIG PROM 1M 3.3V 20PLCC
|
pacote: 20-LCC (J-Lead) |
Estoque94.500 |
|
1Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC SER CFG PROM 65K 8-SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque6.336 |
|
65kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 128K 8-DIP
|
pacote: 8-DIP (0.300", 7.62mm) |
Estoque15.108 |
|
128kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 36K 8-SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque4.944 |
|
36kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Altera |
IC CONFIG DEVICE 8MBIT 100QFP
|
pacote: 100-BQFP |
Estoque9.396 |
|
8MB | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (14x20) |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 1M 20-SOIC
|
pacote: 20-SOIC (0.295", 7.50mm Width) |
Estoque118.452 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC SRL CONFG EEPROM 512K LV 8LAP
|
pacote: 8-TDFN |
Estoque6.300 |
|
512kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-TDFN | 8-LAP (6x6) |
||
Altera |
IC CONFIG DEVICE 16MBIT 100QFP
|
pacote: 100-BQFP |
Estoque7.644 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (14x20) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 8-LAP
|
pacote: 8-TDFN |
Estoque31.116 |
|
2Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Intel |
IC CONFIG DEVICE 8MBIT 100QFP
|
pacote: 100-BQFP |
Estoque4.576 |
|
8MB | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC CONFIG DEVICE 4MBIT 100QFP
|
pacote: 100-BQFP |
Estoque4.592 |
|
4MB | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC CONFIG DEVICE 128MBIT 16SOIC
|
pacote: 16-SOIC (0.295", 7.50mm Width) |
Estoque14.940 |
|
128Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
AMD |
CONFIG MEMORY, 1M BITS, SERIAL
|
pacote: - |
Request a Quote |
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