Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Input Type | Output Type | Interface | Current - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
IC CTRLR KEY-SW I2C 24TQFN
|
pacote: 24-WFQFN Exposed Pad |
Estoque7.744 |
|
Logic | Logic | I2C, 2-Wire Serial | 50µA | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-TQFN-EP (3.5x3.5) |
||
STMicroelectronics |
IC SMART SENSOR II 2CH 16QFN
|
pacote: 16-VFQFN Exposed Pad |
Estoque597.720 |
|
Analog | Digital | - | - | - | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (4x4) |
||
Microchip Technology |
IC SENSOR QTOUCH 4CHAN 20SSOP
|
pacote: 20-SSOP (0.209", 5.30mm Width) |
Estoque44.844 |
|
Logic | Logic | - | 1.5mA | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Exar Corporation |
SENSOR
|
pacote: 24-WFQFN Exposed Pad |
Estoque6.640 |
|
- | - | I2C | 457µA | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-QFN (3.5x3.5) |
||
Melexis Technologies NV |
IC SENSOR INTERFACE LOOP 16SOIC
|
pacote: 16-SOIC (0.295", 7.50mm Width) |
Estoque3.552 |
|
- | - | - | 2.1mA | -40°C ~ 125°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | - |
||
Exar Corporation |
4:1 SENSOR INTERFACE, SLAVE ADDR
|
pacote: - |
Estoque7.072 |
|
- | - | - | - | - | - | - | - |
||
ams |
TDC-GP30YA 1K QFN40 LF T&R
|
pacote: - |
Estoque7.056 |
|
Digital | Digital | SPI, UART | - | - | - | - | - |
||
Texas Instruments |
IC 4 TO 20MA TRANSMITTER 8-SOIC
|
pacote: 8-SOIC (0.154", 3.90mm Width) |
Estoque4.144 |
|
Voltage | Voltage | 2-Wire | 20mA | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Diodes Incorporated |
PIR CONTROLLER SO-16
|
pacote: - |
Estoque6.336 |
|
- | - | - | 120µA | -20°C ~ 70°C | - | - | - |
||
Microchip Technology |
IC HORN DRIVER DUAL 14DIP
|
pacote: 14-DIP (0.300", 7.62mm) |
Estoque5.200 |
|
Logic | Logic | Logic | 500µA | 0°C ~ 50°C | Through Hole | 14-DIP (0.300", 7.62mm) | 14-PDIP |
||
Microchip Technology |
IC SMOKE DETECTOR CMOS 16-SOIC
|
pacote: 16-SOIC (0.154", 3.90mm Width) |
Estoque5.808 |
|
Photoelectric | Voltage | - | 8µA | -25°C ~ 75°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC SMOKE DETECTOR CMOS 16DIP
|
pacote: 16-DIP (0.300", 7.62mm) |
Estoque7.280 |
|
Ionization | Voltage | - | 9µA | -10°C ~ 60°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |
||
Diodes Incorporated |
PIR CONTROLLER SO-16
|
pacote: - |
Estoque4.816 |
|
- | - | - | 120µA | -20°C ~ 70°C | - | - | - |
||
Analog Devices Inc. |
MIL LVDT SIG COND 20-CDIP
|
pacote: 20-CDIP (0.300", 7.62mm) |
Estoque13.608 |
|
- | - | LVDT | 18mA | -55°C ~ 125°C | Through Hole | 20-CDIP (0.300", 7.62mm) | 20-CDIP |
||
Microchip Technology |
IC DRIVER HORN PIEZO W/BO 8DIP
|
pacote: 8-DIP (0.300", 7.62mm) |
Estoque6.368 |
|
Voltage | Voltage | CMOS | 300µA | -10°C ~ 60°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
ON Semiconductor |
IC PIR DETECTOR CTLR 14SOIC
|
pacote: 14-SOIC (0.154", 3.90mm Width) |
Estoque2.112 |
|
Digital | Digital | CMOS | 50µA | -40°C ~ 85°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Texas Instruments |
IC V TO I CONVRTR/XMTR 16-CDIP
|
pacote: 16-CDIP (0.300", 7.62mm) |
Estoque6.896 |
|
Voltage | Current | - | 20mA | -40°C ~ 85°C | Through Hole | 16-CDIP (0.300", 7.62mm) | 16-CDIP Side Brazed |
||
Texas Instruments |
IC SGNL CONDITIONER LVDT 48HTQFP
|
pacote: 48-TQFP Exposed Pad |
Estoque7.904 |
|
- | - | SPI | 12.5mA | -40°C ~ 125°C | Surface Mount | 48-TQFP Exposed Pad | 48-HTQFP (7x7) |
||
Maxim Integrated |
IC CTLR SFP W/DGTL LDD RX 28TQFN
|
pacote: 28-WFQFN Exposed Pad |
Estoque29.040 |
|
Analog, Digital | Digital | I2C, LDD, Serial | 2.5mA | -40°C ~ 95°C | Surface Mount | 28-WFQFN Exposed Pad | 28-TQFN (5x5) |
||
Motorola |
ANALOG CIRCUIT, 1 FUNC, CMOS, PD
|
pacote: - |
Request a Quote |
|
Photoelectric | - | - | 3 mA | -10°C ~ 60°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Renesas Electronics Corporation |
AUTOMOTIVE SENSOR SIGNAL CONDITI
|
pacote: - |
Estoque7.500 |
|
- | 1-Wire®, I2C | - | - | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Renesas Electronics Corporation |
DIE ON FRAME
|
pacote: - |
Request a Quote |
|
- | 1-Wire®, I2C | - | - | -40°C ~ 150°C | Surface Mount | Die | Wafer |
||
LSI/CSI |
PIR SENSOR INTERFACE
|
pacote: - |
Request a Quote |
|
Differential | - | - | 350 µA | -40°C ~ 70°C (TA) | Through Hole | 16-DIP (0.300", 7.62mm) | 16-DIP |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - WAFER BOX
|
pacote: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
pacote: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - WAFFLE PACK
|
pacote: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Analog Devices Inc. |
10-BIT 40MSPS 3/5V TIMING DRIVER
|
pacote: - |
Request a Quote |
|
Logic | 3-Wire Serial | - | - | -20°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
pacote: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |