Página 121 - Integrado - Sistema em chip (SoC) | Circuitos integrados

Nº de peças	Fabricante	Descrição	pacote	Estoque	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Package / Case	Supplier Device Package
M2S025S-1FGG484I	Microsemi Corporation	IC FPGA SOC 25K LUTS 484FBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	pacote: 484-BGA	Estoque6.832	ARM? Cortex?-M3	256KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	-40°C ~ 100°C (TJ)	484-BGA	484-FPBGA (23x23)
5ASXBB5D4F40C4N	Altera	IC FPGA 528 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 925MHz Primary Attributes: FPGA - 462K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA Supplier Device Package: 1517-FBGA (40x40)	pacote: 1517-BBGA	Estoque4.128	Dual ARM? Cortex?-A9 MPCore? with CoreSight?	-	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	925MHz	FPGA - 462K Logic Elements	0°C ~ 85°C (TJ)	1517-BBGA	1517-FBGA (40x40)
XCZU9CG-L2FFVC900E	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	pacote: 900-BBGA, FCBGA	Estoque6.096	Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?	-	256KB	DMA, WDT	CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	533MHz, 1.3GHz	Zynq?UltraScale+? FPGA, 599K+ Logic Cells	0°C ~ 100°C (TJ)	900-BBGA, FCBGA	900-FCBGA (31x31)
XCZU4EG-1SFVC784I	Xilinx Inc.	IC FPGA 252 I/O 784FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	pacote: 784-BBGA, FCBGA	Estoque3.312	Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?	-	256KB	DMA, WDT	CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz, 1.5GHz	Zynq?UltraScale+? FPGA, 192K+ Logic Cells	-40°C ~ 100°C (TJ)	784-BBGA, FCBGA	784-FCBGA (23x23)
M2S025TS-FG484I	Microsemi Corporation	IC FPGA SOC 25K LUTS Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	pacote: 484-BGA	Estoque5.712	ARM? Cortex?-M3	256KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	-40°C ~ 100°C (TJ)	484-BGA	484-FPBGA (23x23)
M2S010-TQ144	Microsemi Corporation	IC FPGA SOC 10K LUTS Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	pacote: 144-LQFP	Estoque4.704	ARM? Cortex?-M3	256KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 10K Logic Modules	0°C ~ 85°C (TJ)	144-LQFP	144-TQFP (20x20)
5ASTFD5K3F40I5NES	Intel	IC FPGA 528 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 462K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	pacote: 1517-BBGA, FCBGA	Estoque5.136	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	800MHz	FPGA - 462K Logic Elements	-40°C ~ 100°C (TJ)	1517-BBGA, FCBGA	1517-FBGA (40x40)
10AS066N2F40E2SG	Intel	IC SOC FPGA 588 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	pacote: 1517-BBGA, FCBGA	Estoque3.808	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 660K Logic Elements	0°C ~ 100°C (TJ)	1517-BBGA, FCBGA	1517-FCBGA (40x40)
5ASTFD3G3F35I5N	Intel	IC FPGA 350 I/O 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 350K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	pacote: 1152-BBGA, FCBGA	Estoque6.784	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	800MHz	FPGA - 350K Logic Elements	-40°C ~ 100°C (TJ)	1152-BBGA, FCBGA	1152-FBGA (35x35)
5CSXFC6D6F31C6N	Intel	IC FPGA 288 I/O 896FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 925MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	pacote: 896-BGA	Estoque6.120	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	64KB	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	925MHz	FPGA - 110K Logic Elements	0°C ~ 85°C (TJ)	896-BGA	896-FBGA (31x31)
114991695	Seeed Technology Co., Ltd	IC SOC RISC-V DUAL 400MHZ MODULE Architecture: MPU Core Processor: RISC-V Dual Core 64bit Flash Size: 8MB/16MB/128MB RAM Size: 8MB Peripherals: DMA, I²S, PWM, WDT Connectivity: I²C, SPI, UART/USART Speed: 400MHz Primary Attributes: Audio Processor (APU), Neural Network Processor (KPU) Operating Temperature: -30°C ~ 85°C Package / Case: Module Supplier Device Package: Module	pacote: Module	Estoque6.120	RISC-V Dual Core 64bit	8MB/16MB/128MB	8MB	DMA, I²S, PWM, WDT	I²C, SPI, UART/USART	400MHz	Audio Processor (APU), Neural Network Processor (KPU)	-30°C ~ 85°C	Module	Module
UPD60802F1-A11-BND-E2-A	Renesas Electronics Corporation	SOC MEDIA IC Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	pacote: -	Request a Quote	-	-	-	-	-	-	-	-	-	-
5ASXFB3H4F40I5G	Intel	IC SOC CORTEX-A9 800MHZ 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 350K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA, FC (40x40)	pacote: -	Request a Quote	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	800MHz	FPGA - 350K Logic Elements	-40°C ~ 100°C (TJ)	1517-BBGA, FCBGA	1517-FBGA, FC (40x40)
XCVP1502-2LLEVSVA3340	AMD	IC VERSAL PREM ACAP FPGA 3340BGA Architecture: MPU, FPGA Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 450MHz, 1.08GHz Primary Attributes: Versal™ Premium FPGA, 3.7M Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 3340-BFBGA, FCBGA Supplier Device Package: 3340-FCBGA (55x55)	pacote: -	Request a Quote	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	256KB	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	450MHz, 1.08GHz	Versal™ Premium FPGA, 3.7M Logic Cells	0°C ~ 100°C (TJ)	3340-BFBGA, FCBGA	3340-FCBGA (55x55)
XCVM1402-1LSIVSVD1760	AMD	IC VERSALPRIME ACAP FPGA 1760BGA Architecture: MPU, FPGA Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Flash Size: - RAM Size: - Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 400MHz, 1GHz Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BFBGA, FCBGA Supplier Device Package: 1760-FCBGA (40x40)	pacote: -	Request a Quote	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	-	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	400MHz, 1GHz	Versal™ Prime FPGA, 1.2M Logic Cells	-40°C ~ 100°C (TJ)	1760-BFBGA, FCBGA	1760-FCBGA (40x40)
XCZU43DR-2FSVG1517E	AMD	IC ZUP RFSOC A53 FPGA 1517BGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.333GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	pacote: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	-	256KB	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	533MHz, 1.333GHz	Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	0°C ~ 100°C (TJ)	1517-BBGA, FCBGA	1517-FCBGA (40x40)
MPFS025T-1FCSG325T2	Microchip Technology	IC SOC RISC-V 325BGA Architecture: MPU, FPGA Core Processor: RISC-V Flash Size: 128KB RAM Size: 230.4KB Peripherals: DMA, PCI, PWM Connectivity: CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG Speed: - Primary Attributes: FPGA - 23K Logic Modules Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 325-TFBGA Supplier Device Package: 325-BGA (11x11)	pacote: -	Request a Quote	RISC-V	128KB	230.4KB	DMA, PCI, PWM	CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG	-	FPGA - 23K Logic Modules	-40°C ~ 125°C (TJ)	325-TFBGA	325-BGA (11x11)
XCVM1402-2MSINBVB1024	AMD	IC VERSALPRIME ACAP FPGA 1024BGA Architecture: MPU, FPGA Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Flash Size: - RAM Size: - Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.4GHz Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1024-BFBGA Supplier Device Package: 1024-BGA (31x31)	pacote: -	Request a Quote	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	-	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz, 1.4GHz	Versal™ Prime FPGA, 1.2M Logic Cells	-40°C ~ 100°C (TJ)	1024-BFBGA	1024-BGA (31x31)
M2S060T-VFG784	Microchip Technology	M2S060T-VFG784 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 784-FBGA Supplier Device Package: 784-VFBGA (23x23)	pacote: -	Estoque180	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 60K Logic Modules	0°C ~ 85°C (TJ)	784-FBGA	784-VFBGA (23x23)
1SX280HH1F55E2VGS3	Intel	IC FPGA STRATIX 10 2912FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2800K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2912-BBGA, FCBGA Supplier Device Package: 2912-FBGA, FC (55x55)	pacote: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 2800K Logic Elements	0°C ~ 100°C (TJ)	2912-BBGA, FCBGA	2912-FBGA, FC (55x55)
BCM7252S1BOX02	Broadcom Limited	7252SNC ONE BOX PROGRAM Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	pacote: -	Request a Quote	-	-	-	-	-	-	-	-	-	-
5ASXMB3E4F31C5G	Intel	IC SOC CORTEX-A9 800MHZ 896FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 350K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FBGA (31x31)	pacote: -	Request a Quote	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	800MHz	FPGA - 350K Logic Elements	0°C ~ 85°C (TJ)	896-BBGA, FCBGA	896-FBGA (31x31)
1SX280HH3F55I3XG	Intel	IC FPGA STRATIX 10 2912FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2800K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2912-BBGA, FCBGA Supplier Device Package: 2912-FBGA, FC (55x55)	pacote: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 2800K Logic Elements	-40°C ~ 100°C (TJ)	2912-BBGA, FCBGA	2912-FBGA, FC (55x55)
AGFA027R31C2E1V	Intel	IC FPGA AGILEX-F 3184FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.7M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	pacote: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 2.7M Logic Elements	0°C ~ 100°C (TJ)	-	-
1SX280HN1F43E2LGS3	Intel	IC FPGA STRATIX 10 1760FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2800K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	pacote: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 2800K Logic Elements	0°C ~ 100°C (TJ)	1760-BBGA, FCBGA	1760-FBGA (42.5x42.5)
TDA3MDDBABFRQ1	Texas Instruments	LOW POWER SOC W/ FULL-FEATURED P Architecture: DSP, MPU Core Processor: ARM® Cortex®-M4, C66x Flash Size: - RAM Size: 512kB Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB Speed: 212.8MHz, 500MHz Primary Attributes: - Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 367-BFBGA, FCBGA Supplier Device Package: 367-FCBGA (15x15)	pacote: -	Request a Quote	ARM® Cortex®-M4, C66x	-	512kB	DMA, POR, PWM, WDT	CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB	212.8MHz, 500MHz	-	-40°C ~ 125°C (TJ)	367-BFBGA, FCBGA	367-FCBGA (15x15)
TDA3LADBJFABFRQ1	Texas Instruments	LOW POWER SOC W/ VISION ACCELERA Architecture: DSP, MPU Core Processor: ARM® Cortex®-M4, C66x Flash Size: - RAM Size: 512kB Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB Speed: 212.8MHz, 500MHz Primary Attributes: - Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 367-BFBGA, FCBGA Supplier Device Package: 367-FCBGA (15x15)	pacote: -	Request a Quote	ARM® Cortex®-M4, C66x	-	512kB	DMA, POR, PWM, WDT	CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB	212.8MHz, 500MHz	-	-40°C ~ 125°C (TJ)	367-BFBGA, FCBGA	367-FCBGA (15x15)
AGFA022R24C2E1VB	Intel	IC FPGA AGILEX-F 2340BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.2M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	pacote: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 2.2M Logic Elements	0°C ~ 100°C (TJ)	2340-BFBGA Exposed Pad	2340-BGA (45x42)

M2S025S-1FGG484I

Microsemi Corporation

IC FPGA SOC 25K LUTS 484FBGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 25K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)

pacote: 484-BGA

Estoque6.832

ARM? Cortex?-M3

256KB

64KB

DDR, PCIe, SERDES

CAN, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 25K Logic Modules

-40°C ~ 100°C (TJ)

484-BGA

484-FPBGA (23x23)

5ASXBB5D4F40C4N

Altera

IC FPGA 528 I/O 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 925MHz
Primary Attributes: FPGA - 462K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA
Supplier Device Package: 1517-FBGA (40x40)

pacote: 1517-BBGA

Estoque4.128

Dual ARM? Cortex?-A9 MPCore? with CoreSight?

-

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

925MHz

FPGA - 462K Logic Elements

0°C ~ 85°C (TJ)

1517-BBGA

1517-FBGA (40x40)

XCZU9CG-L2FFVC900E

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

pacote: 900-BBGA, FCBGA

Estoque6.096

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?

-

256KB

DMA, WDT

CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

533MHz, 1.3GHz

Zynq?UltraScale+? FPGA, 599K+ Logic Cells

0°C ~ 100°C (TJ)

900-BBGA, FCBGA

900-FCBGA (31x31)

XCZU4EG-1SFVC784I

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

pacote: 784-BBGA, FCBGA

Estoque3.312

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?

-

256KB

DMA, WDT

CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

600MHz, 1.5GHz

Zynq?UltraScale+? FPGA, 192K+ Logic Cells

-40°C ~ 100°C (TJ)

784-BBGA, FCBGA

784-FCBGA (23x23)

M2S025TS-FG484I

Microsemi Corporation

IC FPGA SOC 25K LUTS

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 25K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)

pacote: 484-BGA

Estoque5.712

ARM? Cortex?-M3

256KB

64KB

DDR, PCIe, SERDES

CAN, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 25K Logic Modules

-40°C ~ 100°C (TJ)

484-BGA

484-FPBGA (23x23)

M2S010-TQ144

Microsemi Corporation

IC FPGA SOC 10K LUTS

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 10K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

pacote: 144-LQFP

Estoque4.704

ARM? Cortex?-M3

256KB

64KB

DDR, PCIe, SERDES

CAN, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 10K Logic Modules

0°C ~ 85°C (TJ)

144-LQFP

144-TQFP (20x20)

5ASTFD5K3F40I5NES

Intel

IC FPGA 528 I/O 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: FPGA - 462K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

pacote: 1517-BBGA, FCBGA

Estoque5.136

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

800MHz

FPGA - 462K Logic Elements

-40°C ~ 100°C (TJ)

1517-BBGA, FCBGA

1517-FBGA (40x40)

10AS066N2F40E2SG

Intel

IC SOC FPGA 588 I/O 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 660K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

pacote: 1517-BBGA, FCBGA

Estoque3.808

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 660K Logic Elements

0°C ~ 100°C (TJ)

1517-BBGA, FCBGA

1517-FCBGA (40x40)

5ASTFD3G3F35I5N

Intel

IC FPGA 350 I/O 1152FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: FPGA - 350K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

pacote: 1152-BBGA, FCBGA

Estoque6.784

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

800MHz

FPGA - 350K Logic Elements

-40°C ~ 100°C (TJ)

1152-BBGA, FCBGA

1152-FBGA (35x35)

5CSXFC6D6F31C6N

Intel

IC FPGA 288 I/O 896FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 925MHz
Primary Attributes: FPGA - 110K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)

pacote: 896-BGA

Estoque6.120

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

64KB

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

925MHz

FPGA - 110K Logic Elements

0°C ~ 85°C (TJ)

896-BGA

896-FBGA (31x31)

114991695

Seeed Technology Co., Ltd

IC SOC RISC-V DUAL 400MHZ MODULE

Architecture: MPU
Core Processor: RISC-V Dual Core 64bit
Flash Size: 8MB/16MB/128MB
RAM Size: 8MB
Peripherals: DMA, I²S, PWM, WDT
Connectivity: I²C, SPI, UART/USART
Speed: 400MHz
Primary Attributes: Audio Processor (APU), Neural Network Processor (KPU)
Operating Temperature: -30°C ~ 85°C
Package / Case: Module
Supplier Device Package: Module

pacote: Module

Estoque6.120

RISC-V Dual Core 64bit

8MB/16MB/128MB

8MB

DMA, I²S, PWM, WDT

I²C, SPI, UART/USART

400MHz

Audio Processor (APU), Neural Network Processor (KPU)

-30°C ~ 85°C

Module

UPD60802F1-A11-BND-E2-A

Renesas Electronics Corporation

SOC MEDIA IC

Architecture: -
Core Processor: -
Flash Size: -
RAM Size: -
Peripherals: -
Connectivity: -
Speed: -
Primary Attributes: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

pacote: -

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-

5ASXFB3H4F40I5G

Intel

IC SOC CORTEX-A9 800MHZ 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: FPGA - 350K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA, FC (40x40)

pacote: -

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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

800MHz

FPGA - 350K Logic Elements

-40°C ~ 100°C (TJ)

1517-BBGA, FCBGA

1517-FBGA, FC (40x40)

XCVP1502-2LLEVSVA3340

AMD

IC VERSAL PREM ACAP FPGA 3340BGA

Architecture: MPU, FPGA
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 450MHz, 1.08GHz
Primary Attributes: Versal™ Premium FPGA, 3.7M Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 3340-BFBGA, FCBGA
Supplier Device Package: 3340-FCBGA (55x55)

pacote: -

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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

-

256KB

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

450MHz, 1.08GHz

Versal™ Premium FPGA, 3.7M Logic Cells

0°C ~ 100°C (TJ)

3340-BFBGA, FCBGA

3340-FCBGA (55x55)

XCVM1402-1LSIVSVD1760

AMD

IC VERSALPRIME ACAP FPGA 1760BGA

Architecture: MPU, FPGA
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size: -
RAM Size: -
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 400MHz, 1GHz
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BFBGA, FCBGA
Supplier Device Package: 1760-FCBGA (40x40)

pacote: -

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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

-

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

400MHz, 1GHz

Versal™ Prime FPGA, 1.2M Logic Cells

-40°C ~ 100°C (TJ)

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

XCZU43DR-2FSVG1517E

AMD

IC ZUP RFSOC A53 FPGA 1517BGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.333GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

pacote: -

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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

-

256KB

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

533MHz, 1.333GHz

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

0°C ~ 100°C (TJ)

1517-BBGA, FCBGA

1517-FCBGA (40x40)

MPFS025T-1FCSG325T2

Microchip Technology

IC SOC RISC-V 325BGA

Architecture: MPU, FPGA
Core Processor: RISC-V
Flash Size: 128KB
RAM Size: 230.4KB
Peripherals: DMA, PCI, PWM
Connectivity: CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Speed: -
Primary Attributes: FPGA - 23K Logic Modules
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 325-TFBGA
Supplier Device Package: 325-BGA (11x11)

pacote: -

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RISC-V

128KB

230.4KB

DMA, PCI, PWM

CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG

-

FPGA - 23K Logic Modules

-40°C ~ 125°C (TJ)

325-TFBGA

325-BGA (11x11)

XCVM1402-2MSINBVB1024

AMD

IC VERSALPRIME ACAP FPGA 1024BGA

Architecture: MPU, FPGA
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size: -
RAM Size: -
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.4GHz
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1024-BFBGA
Supplier Device Package: 1024-BGA (31x31)

pacote: -

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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

-

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

600MHz, 1.4GHz

Versal™ Prime FPGA, 1.2M Logic Cells

-40°C ~ 100°C (TJ)

1024-BFBGA

1024-BGA (31x31)

M2S060T-VFG784

Microchip Technology

M2S060T-VFG784

Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 784-FBGA
Supplier Device Package: 784-VFBGA (23x23)

pacote: -

Estoque180

ARM® Cortex®-M3

256KB

64KB

DDR, PCIe, SERDES

CANbus, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 60K Logic Modules

0°C ~ 85°C (TJ)

784-FBGA

784-VFBGA (23x23)

1SX280HH1F55E2VGS3

Intel

IC FPGA STRATIX 10 2912FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2800K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2912-BBGA, FCBGA
Supplier Device Package: 2912-FBGA, FC (55x55)

pacote: -

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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 2800K Logic Elements

0°C ~ 100°C (TJ)

2912-BBGA, FCBGA

2912-FBGA, FC (55x55)

BCM7252S1BOX02

Broadcom Limited

7252SNC ONE BOX PROGRAM

Architecture: -
Core Processor: -
Flash Size: -
RAM Size: -
Peripherals: -
Connectivity: -
Speed: -
Primary Attributes: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

pacote: -

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-

5ASXMB3E4F31C5G

Intel

IC SOC CORTEX-A9 800MHZ 896FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: FPGA - 350K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BBGA, FCBGA
Supplier Device Package: 896-FBGA (31x31)

pacote: -

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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

800MHz

FPGA - 350K Logic Elements

0°C ~ 85°C (TJ)

896-BBGA, FCBGA

896-FBGA (31x31)

1SX280HH3F55I3XG

Intel

IC FPGA STRATIX 10 2912FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2800K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2912-BBGA, FCBGA
Supplier Device Package: 2912-FBGA, FC (55x55)

pacote: -

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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 2800K Logic Elements

-40°C ~ 100°C (TJ)

2912-BBGA, FCBGA

2912-FBGA, FC (55x55)

AGFA027R31C2E1V

Intel

IC FPGA AGILEX-F 3184FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.7M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

pacote: -

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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.4GHz

FPGA - 2.7M Logic Elements

0°C ~ 100°C (TJ)

-

1SX280HN1F43E2LGS3

Intel

IC FPGA STRATIX 10 1760FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2800K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

pacote: -

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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 2800K Logic Elements

0°C ~ 100°C (TJ)

1760-BBGA, FCBGA

1760-FBGA (42.5x42.5)

TDA3MDDBABFRQ1

Texas Instruments

LOW POWER SOC W/ FULL-FEATURED P

Architecture: DSP, MPU
Core Processor: ARM® Cortex®-M4, C66x
Flash Size: -
RAM Size: 512kB
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB
Speed: 212.8MHz, 500MHz
Primary Attributes: -
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 367-BFBGA, FCBGA
Supplier Device Package: 367-FCBGA (15x15)

pacote: -

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ARM® Cortex®-M4, C66x

-

512kB

DMA, POR, PWM, WDT

CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB

212.8MHz, 500MHz

-

-40°C ~ 125°C (TJ)

367-BFBGA, FCBGA

367-FCBGA (15x15)

TDA3LADBJFABFRQ1

Texas Instruments

LOW POWER SOC W/ VISION ACCELERA

Architecture: DSP, MPU
Core Processor: ARM® Cortex®-M4, C66x
Flash Size: -
RAM Size: 512kB
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB
Speed: 212.8MHz, 500MHz
Primary Attributes: -
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 367-BFBGA, FCBGA
Supplier Device Package: 367-FCBGA (15x15)

pacote: -

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ARM® Cortex®-M4, C66x

-

512kB

DMA, POR, PWM, WDT

CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB

212.8MHz, 500MHz

-

-40°C ~ 125°C (TJ)

367-BFBGA, FCBGA

367-FCBGA (15x15)

AGFA022R24C2E1VB

Intel

IC FPGA AGILEX-F 2340BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.2M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2340-BFBGA Exposed Pad
Supplier Device Package: 2340-BGA (45x42)

pacote: -

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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.4GHz

FPGA - 2.2M Logic Elements

0°C ~ 100°C (TJ)

2340-BFBGA Exposed Pad

2340-BGA (45x42)