Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
IC SOC FPGA 240 I/O 672FBGA
|
pacote: 672-BBGA, FCBGA |
Estoque7.616 |
|
Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 320K Logic Elements | -40°C ~ 100°C (TJ) | 672-BBGA, FCBGA | 672-FBGA (27x27) |
||
Xilinx Inc. |
IC FPGA 204 I/O 900FCBGA
|
pacote: 900-BBGA, FCBGA |
Estoque5.552 |
|
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? | - | 256KB | DMA, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq?UltraScale+? FPGA, 192K+ Logic Cells | -40°C ~ 100°C (TJ) | 900-BBGA, FCBGA | 900-FCBGA (31x31) |
||
Microsemi Corporation |
IC FPGA SOC 90K LUTS 484FBGA
|
pacote: 484-BGA |
Estoque6.896 |
|
ARM? Cortex?-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CAN, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -55°C ~ 125°C (TJ) | 484-BGA | 484-FPBGA (23x23) |
||
Microsemi Corporation |
IC FPGA SOC
|
pacote: 676-BGA |
Estoque7.280 |
|
ARM? Cortex?-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CAN, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 60K Logic Modules | 0°C ~ 85°C (TJ) | 676-BGA | 676-FBGA (27x27) |
||
Microsemi Corporation |
IC FPGA SOC 10K LUTS
|
pacote: 256-LBGA |
Estoque6.000 |
|
ARM? Cortex?-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CAN, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 10K Logic Modules | -40°C ~ 100°C (TJ) | 256-LBGA | 256-FPBGA (17x17) |
||
Intel |
IC SOC FPGA 360 I/O 780FBGA
|
pacote: 780-BBGA, FCBGA |
Estoque3.744 |
|
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 320K Logic Elements | 0°C ~ 100°C (TJ) | 780-BBGA, FCBGA | 780-FBGA (29x29) |
||
Broadcom Limited |
CABLE MODEM
|
pacote: - |
Estoque6.672 |
|
- | - | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
CABLE MODEM
|
pacote: - |
Estoque4.304 |
|
- | - | - | - | - | - | - | - | - | - |
||
ON Semiconductor |
IC DSP EZAIRO 5920 SMD
|
pacote: - |
Estoque4.272 |
|
- | - | - | - | - | - | - | - | - | - |
||
Intel |
IC FPGA 528 I/O 1517FBGA
|
pacote: 1517-BBGA, FCBGA |
Estoque4.640 |
|
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.05GHz | FPGA - 462K Logic Elements | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FBGA (40x40) |
||
Intel |
IC FPGA 66 I/O 484UBGA
|
pacote: 484-FBGA |
Estoque5.568 |
|
Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 110K Logic Elements | 0°C ~ 85°C (TJ) | 484-FBGA | 484-UBGA (19x19) |
||
Xilinx Inc. |
XAZU2EG-1SFVC784I
|
pacote: 784-BFBGA, FCBGA |
Estoque7.488 |
|
- | - | - | - | - | - | - | - | 784-BFBGA, FCBGA | 784-FCBGA (23x23) |
||
AMD |
XCVC1702-2HSIVSVA2197
|
pacote: - |
Request a Quote |
|
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz, 1.65GHz | Versal™ AI Core FPGA, 1M Logic Cells | -40°C ~ 110°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) |
||
Intel |
IC FPGA AGILEX-F 3184FBGA
|
pacote: - |
Request a Quote |
|
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.2M Logic Elements | -40°C ~ 100°C (TJ) | - | - |
||
Microchip Technology |
IC SOC RISC-V 325BGA
|
pacote: - |
Request a Quote |
|
RISC-V | 128KB | 230.4KB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 23K Logic Modules | -40°C ~ 100°C | 325-TFBGA | 325-BGA (11x11) |
||
AMD |
IC ZUP RFSOC A53 FPGA LP 1156BGA
|
pacote: - |
Request a Quote |
|
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | -40°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) |
||
Intel |
IC FPGA AGILEX-F 1546FBGA
|
pacote: - |
Request a Quote |
|
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 764K Logic Elements | -40°C ~ 100°C (TJ) | - | - |
||
AMD |
IC VERSAL AICORE FPGA 2197BGA
|
pacote: - |
Request a Quote |
|
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.3GHz | Versal™ AI Core FPGA, 1.9M Logic Cells | -40°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) |
||
AMD |
IC VERSAL AI-EDGE FPGA 1596BGA
|
pacote: - |
Request a Quote |
|
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | - | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 450MHz, 1.08GHz | Versal™ AI Core FPGA, 1M Logic Cells | 0°C ~ 100°C (TJ) | 1596-BFBGA | 1596-BGA (37.5x37.5) |
||
Intel |
IC FPGA AGILEX-F 2340BGA
|
pacote: - |
Request a Quote |
|
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 764K Logic Elements | 0°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) |
||
Texas Instruments |
PROTOTYPE
|
pacote: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
SOC DOCSIS 3.0 CBL GATEWAY
|
pacote: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - |
||
Intel |
IC FPGA AGILEX-F 2340FBGA
|
pacote: - |
Request a Quote |
|
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 764K Logic Elements | 0°C ~ 100°C (TJ) | - | - |
||
Intel |
IC FPGA AGILEX-F 2340BGA
|
pacote: - |
Request a Quote |
|
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | 0°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) |
||
Microchip Technology |
IC SOC RISC-V 325LFBGA
|
pacote: - |
Estoque9 |
|
RISC-V | 128KB | 857.6kB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 93K Logic Modules | -40°C ~ 100°C | 325-LFBGA | 325-LFBGA (11x14.5) |
||
Intel |
IC FPGA AGILEX-F 2340FBGA
|
pacote: - |
Request a Quote |
|
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.4M Logic Elements | 0°C ~ 100°C (TJ) | - | - |
||
AMD |
IC VERSALPRIME ACAP FPGA 1369BGA
|
pacote: - |
Request a Quote |
|
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | - | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz, 1.65GHz | Versal™ Prime FPGA, 1.2M Logic Cells | -40°C ~ 100°C (TJ) | 1369-BFBGA | 1369-BGA (35x35) |
||
Texas Instruments |
PROTOTYPE
|
pacote: - |
Request a Quote |
|
C66x, Quad ARM® Cortex®-A15 MPCore™ with CoreSight™ | - | - | DDR, DMA, PCIe, POR, WDT | Ethernet, I2C, SPI, UART/USART, USB | 1.2GHz, 1.4GHz | - | -40°C ~ 100°C (TC) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) |