Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
IC MPU SITARA 800MHZ 324NFBGA
|
pacote: 324-LFBGA |
Estoque4.896 |
|
1 Core, 32-Bit | 800MHz | Multimedia; NEON? SIMD | LPDDR, DDR2, DDR3, DDR3L | Yes | LCD, Touchscreen | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 1.8V, 3.3V | -40°C ~ 90°C (TJ) | Cryptography, Random Number Generator | 324-LFBGA | 324-NFBGA(15x15) |
||
NXP |
IC MPU Q OR IQ 1.5GHZ 1295FCBGA
|
pacote: 1295-BBGA, FCBGA |
Estoque7.392 |
|
4 Core, 32-Bit | 1.5GHz | Security; SEC 4.2 | DDR3, DDR3L | No | - | 10/100/1000 Mbps (5), 10 Gbps (1) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | 1.5V, 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | 1295-BBGA, FCBGA | 1295-FCPBGA (37.5x37.5) |
||
NXP |
IC MPU Q OR IQ 800MHZ 689TEBGA
|
pacote: 689-BBGA Exposed Pad |
Estoque6.240 |
|
1 Core, 32-Bit | 800MHz | Communications; QUICC Engine | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | -40°C ~ 105°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
IDT, Integrated Device Technology Inc |
IC MPU MIPS-I 200MHZ 208QFP
|
pacote: 208-BFQFP Exposed Pad |
Estoque5.024 |
|
1 Core, 64-Bit | 200MHz | System Control; CP0 | - | No | - | - | - | - | 3.3V | 0°C ~ 85°C (TC) | - | 208-BFQFP Exposed Pad | 208-PQFP (28x28) |
||
NXP |
IC MPU MPC83XX 400MHZ 620BGA
|
pacote: 620-BBGA Exposed Pad |
Estoque3.856 |
|
1 Core, 32-Bit | 400MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
NXP |
IC MPU MPC83XX 333MHZ 516BGA
|
pacote: 516-BBGA |
Estoque2.256 |
|
1 Core, 32-Bit | 333MHz | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
||
Cirrus Logic Inc. |
IC MPU EP7 74MHZ 256BGA
|
pacote: 256-LFBGA |
Estoque6.192 |
|
1 Core, 32-Bit | 74MHz | - | SDRAM | No | Keypad, LCD, Touchscreen | - | - | - | 2.5V, 2.7V, 3.0V, 3.3V | -40°C ~ 85°C (TA) | Hardware ID | 256-LFBGA | 256-PBGA (17x17) |
||
NXP |
IC MPU MPC83XX 266MHZ 620BGA
|
pacote: 620-BBGA Exposed Pad |
Estoque5.376 |
|
1 Core, 32-Bit | 266MHz | Security; SEC | DDR, DDR2 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
NXP |
IC MPU MPC82XX 266MHZ 408TBGA
|
pacote: 480-LBGA |
Estoque4.512 |
|
1 Core, 32-Bit | 266MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (3) | - | - | 3.3V | -40°C ~ 105°C (TA) | - | 480-LBGA | 408-TBGA (37.5x37.5) |
||
NXP |
IC MPU MPC74XX 1.25GHZ 360FCCLGA
|
pacote: 360-CLGA, FCCLGA |
Estoque5.536 |
|
1 Core, 32-Bit | 1.25GHz | Multimedia; SIMD | - | No | - | - | - | - | 1.5V, 1.8V, 2.5V | 0°C ~ 105°C (TA) | - | 360-CLGA, FCCLGA | 360-FCCLGA (25x25) |
||
NXP |
IC MPU M680X0 50MHZ 206PGA
|
pacote: 206-BEPGA |
Estoque18.288 |
|
1 Core, 32-Bit | 50MHz | - | - | No | - | - | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 206-BEPGA | 206-PGA (47.25x47.25) |
||
NXP |
IC MPU MPC8XX 80MHZ 357BGA
|
pacote: 357-BBGA |
Estoque3.184 |
|
1 Core, 32-Bit | 80MHz | Communications; CPM | DRAM | No | - | 10 Mbps (4) | - | - | 3.3V | 0°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC8XX 80MHZ 357BGA
|
pacote: 357-BBGA |
Estoque5.216 |
|
1 Core, 32-Bit | 80MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1), 10/100 Mbps (1) | - | - | 3.3V | 0°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC82XX 300MHZ 408TBGA
|
pacote: 480-LBGA |
Estoque3.472 |
|
1 Core, 32-Bit | 300MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (3) | - | - | 3.3V | 0°C ~ 105°C (TA) | - | 480-LBGA | 408-TBGA (37.5x37.5) |
||
Advantech Corp |
CORE 2.3G 8M TDP 45W
|
pacote: - |
Estoque5.856 |
|
4 Core, 64-Bit | 2.3GHz | - | - | Yes | - | - | - | - | - | - | - | - | - |
||
Advantech Corp |
CORE 3.1G 8M TDP 65W
|
pacote: - |
Estoque3.392 |
|
4 Core, 64-Bit | 3.1GHz | - | - | Yes | - | - | - | - | - | - | - | - | - |
||
NXP |
IC MPU MPC82XX 266MHZ 408TBGA
|
pacote: 480-LBGA |
Estoque6.512 |
|
1 Core, 32-Bit | 266MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (3) | - | - | 3.3V | -40°C ~ 105°C (TA) | - | 480-LBGA | 408-TBGA (37.5x37.5) |
||
NXP |
IC MPU MPC85XX 1.0GHZ 783FCBGA
|
pacote: 783-BBGA, FCBGA |
Estoque5.376 |
|
1 Core, 32-Bit | 1.0GHz | Signal Processing; SPE | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (2) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC83XX 667MHZ 672TBGA
|
pacote: 672-LBGA |
Estoque3.600 |
|
1 Core, 32-Bit | 667MHz | Security; SEC | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 672-LBGA | 672-TBGA (35x35) |
||
NXP |
IC MPU M683XX 25MHZ 357BGA
|
pacote: 357-BBGA |
Estoque6.704 |
|
1 Core, 32-Bit | 25MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | - | 5.0V | -40°C ~ 85°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC SOC 2CORE 1400MHZ SW 780FCBGA
|
pacote: 780-FBGA, FCBGA |
Estoque7.856 |
|
2 Core, 64-Bit | 1.4GHz | - | DDR3L/4 | No | - | 1 Gbps (12) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | 0°C ~ 105°C (TA) | - | 780-FBGA, FCBGA | 780-FCPBGA (23x23) |
||
NXP |
IC MPU MPC83XX 266MHZ 620BGA
|
pacote: 620-BBGA Exposed Pad |
Estoque5.856 |
|
1 Core, 32-Bit | 266MHz | Security; SEC | DDR | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
NXP |
IC MPU MPC82XX 300MHZ 516BGA
|
pacote: 516-BBGA |
Estoque10.944 |
|
1 Core, 32-Bit | 300MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | 0°C ~ 105°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
||
Zilog |
IC MPU ZIP 16MHZ 100QFP
|
pacote: 100-QFP |
Estoque5.520 |
|
1 Core, 8-Bit | 16MHz | - | DRAM | No | - | - | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 100-QFP | 100-QFP |
||
Cirrus Logic Inc. |
IC MPU EP9 200MHZ 352BGA
|
pacote: 352-BBGA |
Estoque11.028 |
|
1 Core, 32-Bit | 200MHz | Math Engine; MaverickCrunch? | SDRAM | Yes | Keypad, LCD, Touchscreen | 1/10/100 Mbps (1) | - | USB 2.0 (3) | 1.8V, 3.3V | 0°C ~ 70°C (TA) | Hardware ID | 352-BBGA | 352-PBGA (27x27) |
||
NXP |
QORIQ 1XCPU 64-BIT PWR ARCH 1.
|
pacote: - |
Estoque3.312 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
LS1 32BIT ARM SOC 600MHZ DDR3L
|
pacote: 525-FBGA, FCBGA |
Estoque5.840 |
|
2 Core, 32-Bit | 600MHz | Multimedia; NEON™ SIMD | DDR3L, DDR4 | No | - | GbE (2) | SATA 3Gbps (1) | USB 2.0 (1) | - | 0°C ~ 105°C | - | 525-FBGA, FCBGA | 525-FCPBGA (19x19) |
||
NXP |
QORIQ LAYERSCAPE 4XA72 64BIT ARM
|
pacote: - |
Estoque7.344 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
STMicroelectronics |
MPU WITH ARM CORTEX-A7 650 MHZ,
|
pacote: - |
Estoque4.176 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
STMicroelectronics |
MPU ARM DUAL CORTEX-A7 650 MHZ A
|
pacote: 354-LFBGA |
Estoque5.440 |
|
2 Core, 32-Bit | 209MHz, 650MHz | ARM® Cortex®-M4 | LPDDR2, LPDDR3, DDR3, DDR3L | Yes | HDMI, LCD | 10/100Mbps (1) | - | USB 2.0 (2), USB 2.0 OTG+ PHY (3) | 2.5V, 3.3V | -40°C ~ 125°C (TA) | ARM TZ | 354-LFBGA | 354-LFBGA (16x16) |