Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MPU MPC83XX 667MHZ 689TEBGA
|
pacote: 689-BBGA Exposed Pad |
Estoque6.208 |
|
1 Core, 32-Bit | 667MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU MPC83XX 667MHZ 689TEBGA
|
pacote: 689-BBGA Exposed Pad |
Estoque3.296 |
|
1 Core, 32-Bit | 667MHz | Security; SEC 3.0 | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (4) | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 125°C (TA) | Cryptography, Random Number Generator | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
IDT, Integrated Device Technology Inc |
IC MPU MIPS-I 133MHZ 208QFP
|
pacote: 208-BFQFP Exposed Pad |
Estoque7.456 |
|
1 Core, 64-Bit | 133MHz | System Control; CP0 | DRAM | No | - | - | - | - | 5.0V | 0°C ~ 85°C (TC) | - | 208-BFQFP Exposed Pad | 208-PQFP (28x28) |
||
NXP |
IC MPU MPC83XX 533MHZ 740TBGA
|
pacote: 740-LBGA |
Estoque2.816 |
|
1 Core, 32-Bit | 533MHz | Communications; QUICC Engine, Security; SEC | DDR, DDR2 | No | - | 10/100/1000 Mbps (1) | - | USB 1.x (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 740-LBGA | 740-TBGA (37.5x37.5) |
||
NXP |
IC MPU MPC83XX 400MHZ 668BGA
|
pacote: 668-BBGA Exposed Pad |
Estoque4.576 |
|
1 Core, 32-Bit | 400MHz | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100/1000 Mbps (1) | - | USB 1.x (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 668-BBGA Exposed Pad | 668-PBGA-PGE (29x29) |
||
NXP |
IC MPU MPC74XX 1.267GHZ 360LGA
|
pacote: 360-CLGA, FCCLGA |
Estoque7.600 |
|
1 Core, 32-Bit | 1.267GHz | Multimedia; SIMD | - | No | - | - | - | - | 1.5V, 1.8V, 2.5V | 0°C ~ 105°C (TA) | - | 360-CLGA, FCCLGA | 360-FCCLGA (25x25) |
||
NXP |
IC MPU MPC83XX 266MHZ 740TBGA
|
pacote: 740-LBGA |
Estoque4.688 |
|
1 Core, 32-Bit | 266MHz | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100/1000 Mbps (1) | - | USB 1.x (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 740-LBGA | 740-TBGA (37.5x37.5) |
||
NXP |
IC MPU MPC85XX 667MHZ 783FCBGA
|
pacote: 784-BBGA, FCBGA |
Estoque5.904 |
|
1 Core, 32-Bit | 667MHz | - | DDR, SDRAM | No | - | 10/100 Mbps (1), 10/100/1000 Mbps (2) | - | - | 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 784-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC85XX 833MHZ 783FCBGA
|
pacote: 784-BBGA, FCBGA |
Estoque3.760 |
|
1 Core, 32-Bit | 833MHz | Communications; CPM | DDR, SDRAM | No | - | 10/100/1000 Mbps (2) | - | - | 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 784-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC82XX 200MHZ 357BGA
|
pacote: 357-BBGA |
Estoque7.296 |
|
1 Core, 32-Bit | 200MHz | - | SDRAM | No | - | - | - | - | 3.3V | 0°C ~ 105°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU M683XX 33MHZ 357BGA
|
pacote: 357-BGA |
Estoque7.904 |
|
1 Core, 32-Bit | 33MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 357-BGA | 357-PBGA (25x25) |
||
Microchip Technology |
IC MPU 68000 20MHZ 114PGA
|
pacote: 114-BCPGA |
Estoque6.096 |
|
1 Core, 32-Bit | 20MHz | - | - | No | - | - | - | - | 5.0V | -40°C ~ 85°C (TC) | - | 114-BCPGA | 114-CPGA (34.54x34.54) |
||
Microchip Technology |
IC MPU POWERPC 300MHZ 360BGA
|
pacote: 360-BBGA Exposed Pad |
Estoque3.456 |
|
1 Core, 32-Bit | 300MHz | - | - | No | - | - | - | - | 2.5V, 3.3V | -40°C ~ 110°C (TJ) | - | 360-BBGA Exposed Pad | 360-PBGA (25x25) |
||
NXP |
IC MPU M683XX 20MHZ 100LQFP
|
pacote: 100-LQFP |
Estoque3.968 |
|
1 Core, 8/16-Bit | 20MHz | Communications; RISC CPM | DRAM | No | - | - | - | - | 3.3V | 0°C ~ 70°C (TA) | - | 100-LQFP | 100-LQFP (14x14) |
||
NXP |
BASEBAND PROC PILOT REV 1.0
|
pacote: 1020-BBGA, FCBGA |
Estoque4.848 |
|
4 Core, 64-Bit | 1.8GHz | Signal Processing; SC3900FP FVP - 6 Core | DDR3, DDR3L | No | - | 1/2.5 Gbps (4), 1/2.5/10 Gbps (2) | - | USB 2.0 (1) | 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V | -40°C ~ 105°C (TA) | AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC | 1020-BBGA, FCBGA | 1020-FCPBGA (33x33) |
||
NXP |
IC MPU MPC82XX 400MHZ 516BGA
|
pacote: 516-BBGA |
Estoque6.848 |
|
1 Core, 32-Bit | 400MHz | Communications; RISC CPM, Security; SEC | DRAM, SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
IC MPU MPC82XX 266MHZ 516BGA
|
pacote: 516-BBGA |
Estoque3.568 |
|
1 Core, 32-Bit | 266MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | 0°C ~ 105°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
IC MPU MPC83XX 266MHZ 473MAPBGA
|
pacote: 473-LFBGA |
Estoque5.104 |
|
1 Core, 32-Bit | 266MHz | - | DDR2 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 473-LFBGA | 473-MAPBGA (19x19) |
||
Texas Instruments |
IC MPU OMAP-L1X 456MHZ 361NFBGA
|
pacote: 361-LFBGA |
Estoque6.336 |
|
1 Core, 32-Bit | 456MHz | Signal Processing; C674x, System Control; CP15 | SDRAM | No | LCD | 10/100 Mbps (1) | SATA 3Gbps (1) | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | 1.8V, 3.3V | 0°C ~ 90°C (TJ) | Boot Security, Cryptography | 361-LFBGA | 361-NFBGA (13x13) |
||
Texas Instruments |
MOD ARM CORTEX-A9 491NFBGA
|
pacote: 491-LFBGA |
Estoque7.504 |
|
1 Core, 32-Bit | 800MHz | Multimedia; NEON? SIMD | LPDDR2, DDR3, DDR3L | Yes | TSC, WXGA | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 1.8V, 3.3V | -40°C ~ 105°C (TJ) | Crypto Accelerator | 491-LFBGA | 491-NFBGA (17x17) |
||
Intel |
IC MPU I186 13MHZ 100SQFP
|
pacote: 100-BFQFP |
Estoque5.040 |
|
1 Core, 16-Bit | 13MHz | - | DRAM | No | - | - | - | - | 3.0V | 0°C ~ 70°C (TA) | - | 100-BFQFP | 100-SQFP |
||
NXP |
LS2048A - STD TEMP, W/ENCRYPT, 2
|
pacote: - |
Estoque6.800 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
QORIQ 2XCPU 64-BIT PWR ARCH 1.
|
pacote: - |
Estoque4.736 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
IC MPU I.MX6DP ENHAN 624FCBGA
|
pacote: 624-FBGA, FCBGA |
Estoque6.080 |
|
2 Core, 32-Bit | 852MHZ | Multimedia; NEON™ SIMD | LPDDR2, DDR3L, DDR3 | Yes | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | 624-FBGA, FCBGA | 624-FCBGA (21x21) |
||
NXP |
IC MPU I.MX6DP ENHAN 624FCBGA
|
pacote: 624-LFBGA, FCBGA |
Estoque6.564 |
|
2 Core, 32-Bit | 1.0GHz | Multimedia; NEON™ SIMD | LPDDR2, DDR3L, DDR3 | Yes | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | -20°C ~ 105°C (TJ) | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | 624-LFBGA, FCBGA | 624-FCBGA (21x21) |
||
Nuvoton Technology Corporation |
IC MPU NUC970 300MHZ 128LQFP
|
pacote: - |
Request a Quote |
|
1 Core, 32-Bit | 300MHz | - | DDR2, LVDDR, SDRAM | Yes | LCD | 10/100Mbps (1) | - | USB 2.0 (3) | 3.3V | -40°C ~ 85°C (TA) | AES, ECC, SHA, TRNG | 128-LQFP | 128-LQFP (14x14) |
||
Renesas Electronics Corporation |
IC MPU RZ/N2L 300/400MHZ 121FBGA
|
pacote: - |
Estoque720 |
|
1 Core, 32-Bit | 300MHz, 400MHz | Multimedia; NEON™ SIMD | - | No | - | 10/100/1000Mbps (1) | - | USB 2.0 (1) | 1.8V, 3.3V | -40°C ~ 125°C (TJ) | - | 121-LFBGA | 121-FBGA (10x10) |
||
Renesas Electronics Corporation |
IC MPU RZ/V 996MHZ 841FBGA
|
pacote: - |
Estoque288 |
|
2 Core, 64-Bit | 996MHz | Multimedia; NEON™ SIMD | LPDDR4 | No | DP, HDMI, LCD | GbE (1) | - | USB 3.1 (1) | 1.8V, 3.3V | -40°C ~ 125°C (TJ) | AES, ARC4, RSA, SHA-224, SHA-256, TRNG | 841-FBGA | 841-FBGA (15x15) |