Página 100 - Integrado - Microprocessadores | Circuitos integrados | Heisener Electronics
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Integrado - Microprocessadores

Registros 8.238
Página  100/275
Imagem
Nº de peças
Fabricante
Descrição
pacote
Estoque
Quantidade
Number of Cores/Bus Width
Speed
Co-Processors/DSP
RAM Controllers
Graphics Acceleration
Display & Interface Controllers
Ethernet
SATA
USB
Voltage - I/O
Operating Temperature
Security Features
Package / Case
Supplier Device Package
P1014NSE5FFA
NXP

IC MPU Q OR IQ 800MHZ 425TEBGA1

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: Security; SEC 4.4
  • RAM Controllers: DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (1)
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
  • Package / Case: 425-FBGA
  • Supplier Device Package: 425-TEPBGA1
pacote: 425-FBGA
Estoque4.736
1 Core, 32-Bit
800MHz
Security; SEC 4.4
DDR3, DDR3L
No
-
10/100/1000 Mbps (2)
SATA 3Gbps (2)
USB 2.0 + PHY (1)
-
0°C ~ 105°C (TA)
Boot Security, Cryptography, Random Number Generator, Secure Fusebox
425-FBGA
425-TEPBGA1
MPC8308CZQAFD
NXP

IC MPU MPC83XX 333MHZ 473MAPBGA

  • Core Processor: PowerPC e300c3
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 333MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 473-LFBGA
  • Supplier Device Package: 473-MAPBGA (19x19)
pacote: 473-LFBGA
Estoque4.784
1 Core, 32-Bit
333MHz
-
DDR2
No
-
10/100/1000 Mbps (3)
-
USB 2.0 (1)
1.8V, 2.5V, 3.3V
-40°C ~ 105°C (TA)
-
473-LFBGA
473-MAPBGA (19x19)
MPC8572PXAVND
NXP

IC MPU MPC85XX 1.5GHZ 1023FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.5GHz
  • Co-Processors/DSP: Signal Processing; SPE
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 1023-BFBGA, FCBGA
  • Supplier Device Package: 1023-FCPBGA (33x33)
pacote: 1023-BFBGA, FCBGA
Estoque6.624
2 Core, 32-Bit
1.5GHz
Signal Processing; SPE
DDR2, DDR3
No
-
10/100/1000 Mbps (4)
-
-
1.5V, 1.8V, 2.5V, 3.3V
0°C ~ 105°C (TA)
-
1023-BFBGA, FCBGA
1023-FCPBGA (33x33)
KMPC8358CVRAGDGA
NXP

IC MPU MPC83XX 400MHZ 668BGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 400MHz
  • Co-Processors/DSP: Communications; QUICC Engine
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: -
  • USB: USB 1.x (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 668-BBGA Exposed Pad
  • Supplier Device Package: 668-PBGA-PGE (29x29)
pacote: 668-BBGA Exposed Pad
Estoque6.208
1 Core, 32-Bit
400MHz
Communications; QUICC Engine
DDR, DDR2
No
-
10/100/1000 Mbps (1)
-
USB 1.x (1)
1.8V, 2.5V, 3.3V
-40°C ~ 105°C (TA)
-
668-BBGA Exposed Pad
668-PBGA-PGE (29x29)
KMPC8347ECZUAJDB
NXP

IC MPU MPC83XX 533MHZ 672TBGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 533MHz
  • Co-Processors/DSP: Security; SEC
  • RAM Controllers: DDR
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 672-LBGA
  • Supplier Device Package: 672-TBGA (35x35)
pacote: 672-LBGA
Estoque5.904
1 Core, 32-Bit
533MHz
Security; SEC
DDR
No
-
10/100/1000 Mbps (2)
-
USB 2.0 + PHY (2)
2.5V, 3.3V
-40°C ~ 105°C (TA)
Cryptography, Random Number Generator
672-LBGA
672-TBGA (35x35)
KMPC8321EVRADDC
NXP

IC MPU MPC83XX 266MHZ 516BGA

  • Core Processor: PowerPC e300c2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 266MHz
  • Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (3)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Cryptography
  • Package / Case: 516-BBGA
  • Supplier Device Package: 516-FPBGA (27x27)
pacote: 516-BBGA
Estoque5.824
1 Core, 32-Bit
266MHz
Communications; QUICC Engine, Security; SEC 2.2
DDR, DDR2
No
-
10/100 Mbps (3)
-
USB 2.0 (1)
1.8V, 2.5V, 3.3V
0°C ~ 105°C (TA)
Cryptography
516-BBGA
516-FPBGA (27x27)
EP7312-IBZ
Cirrus Logic Inc.

IC MPU EP7 74MHZ 256BGA

  • Core Processor: ARM7TDMI
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 74MHz
  • Co-Processors/DSP: -
  • RAM Controllers: SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: Keypad, LCD, Touchscreen
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 2.5V, 2.7V, 3.0V, 3.3V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Security Features: Hardware ID
  • Package / Case: 256-LFBGA
  • Supplier Device Package: 256-PBGA (17x17)
pacote: 256-LFBGA
Estoque3.280
1 Core, 32-Bit
74MHz
-
SDRAM
No
Keypad, LCD, Touchscreen
-
-
-
2.5V, 2.7V, 3.0V, 3.3V
-40°C ~ 85°C (TA)
Hardware ID
256-LFBGA
256-PBGA (17x17)
EP7312-CBZ
Cirrus Logic Inc.

IC MPU EP7 74MHZ 256BGA

  • Core Processor: ARM7TDMI
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 74MHz
  • Co-Processors/DSP: -
  • RAM Controllers: SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: Keypad, LCD, Touchscreen
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 2.5V, 2.7V, 3.0V, 3.3V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: Hardware ID
  • Package / Case: 256-LFBGA
  • Supplier Device Package: 256-PBGA (17x17)
pacote: 256-LFBGA
Estoque3.040
1 Core, 32-Bit
74MHz
-
SDRAM
No
Keypad, LCD, Touchscreen
-
-
-
2.5V, 2.7V, 3.0V, 3.3V
0°C ~ 70°C (TA)
Hardware ID
256-LFBGA
256-PBGA (17x17)
MPC603RRX266TC
NXP

IC MPU MPC6XX 266MHZ 255FCCBGA

  • Core Processor: PowerPC 603e
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 266MHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 255-BCBGA Exposed Pad
  • Supplier Device Package: 255-FCCBGA (21x21)
pacote: 255-BCBGA Exposed Pad
Estoque2.512
1 Core, 32-Bit
266MHz
-
-
No
-
-
-
-
3.3V
-40°C ~ 105°C (TA)
-
255-BCBGA Exposed Pad
255-FCCBGA (21x21)
KMPC870CZT133
NXP

IC MPU MPC8XX 133MHZ 256BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 133MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (2)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: -40°C ~ 100°C (TA)
  • Security Features: -
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (23x23)
pacote: 256-BBGA
Estoque5.856
1 Core, 32-Bit
133MHz
Communications; CPM
DRAM
No
-
10/100 Mbps (2)
-
USB 2.0 (1)
3.3V
-40°C ~ 100°C (TA)
-
256-BBGA
256-PBGA (23x23)
hot XPC850VR50BU
NXP

IC MPU MPC8XX 50MHZ 256BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 50MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (1)
  • SATA: -
  • USB: USB 1.x (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 95°C (TA)
  • Security Features: -
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (23x23)
pacote: 256-BBGA
Estoque8.784
1 Core, 32-Bit
50MHz
Communications; CPM
DRAM
No
-
10 Mbps (1)
-
USB 1.x (1)
3.3V
0°C ~ 95°C (TA)
-
256-BBGA
256-PBGA (23x23)
Z8018008VEC
Zilog

IC MPU Z180 8MHZ 68PLCC

  • Core Processor: Z80180
  • Number of Cores/Bus Width: 1 Core, 8-Bit
  • Speed: 8MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 5.0V
  • Operating Temperature: -40°C ~ 100°C (TA)
  • Security Features: -
  • Package / Case: 68-LCC (J-Lead)
  • Supplier Device Package: 68-PLCC
pacote: 68-LCC (J-Lead)
Estoque7.568
1 Core, 8-Bit
8MHz
-
DRAM
No
-
-
-
-
5.0V
-40°C ~ 100°C (TA)
-
68-LCC (J-Lead)
68-PLCC
96MPXE-2.6-20M20T
Advantech Corp

XEON 2.6G 20M 2011P 8CORE E5-264

  • Core Processor: Xeon E5-2640 v3
  • Number of Cores/Bus Width: 8 Core, 64-Bit
  • Speed: 2.6GHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
pacote: -
Estoque5.552
8 Core, 64-Bit
2.6GHz
-
-
-
-
-
-
-
-
-
-
-
-
OMAP3525ECUSA
Texas Instruments

IC MPU OMAP-35XX 600MHZ 423FCBGA

  • Core Processor: ARM? Cortex?-A8
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 600MHz
  • Co-Processors/DSP: Signal Processing; C64x+, Multimedia; NEON? SIMD
  • RAM Controllers: LPDDR
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: LCD
  • Ethernet: -
  • SATA: -
  • USB: USB 1.x (3), USB 2.0 (1)
  • Voltage - I/O: 1.8V, 3.0V
  • Operating Temperature: -40°C ~ 105°C (TJ)
  • Security Features: -
  • Package / Case: 423-LFBGA, FCBGA
  • Supplier Device Package: 423-FCBGA (16x16)
pacote: 423-LFBGA, FCBGA
Estoque4.896
1 Core, 32-Bit
600MHz
Signal Processing; C64x+, Multimedia; NEON? SIMD
LPDDR
Yes
LCD
-
-
USB 1.x (3), USB 2.0 (1)
1.8V, 3.0V
-40°C ~ 105°C (TJ)
-
423-LFBGA, FCBGA
423-FCBGA (16x16)
hot MPC8343ZQADDB
NXP

IC MPU MPC83XX 266MHZ 620BGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 266MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 620-BBGA Exposed Pad
  • Supplier Device Package: 620-PBGA (29x29)
pacote: 620-BBGA Exposed Pad
Estoque5.472
1 Core, 32-Bit
266MHz
-
DDR, DDR2
No
-
10/100/1000 Mbps (3)
-
USB 2.0 + PHY (2)
1.8V, 2.5V, 3.3V
0°C ~ 105°C (TA)
-
620-BBGA Exposed Pad
620-PBGA (29x29)
P1010NXN5HFB
NXP

IC MPU Q OR IQ 1.0GHZ 425TEBGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (1)
  • Voltage - I/O: -
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 425-FBGA
  • Supplier Device Package: 425-TEPBGA I (19x19)
pacote: 425-FBGA
Estoque7.920
1 Core, 32-Bit
1.0GHz
-
DDR3, DDR3L
No
-
10/100/1000 Mbps (3)
SATA 3Gbps (2)
USB 2.0 + PHY (1)
-
-40°C ~ 105°C (TA)
-
425-FBGA
425-TEPBGA I (19x19)
hot MC9328MX1DVM20
NXP

IC MPU I.MX1 200MHZ 256MAPBGA

  • Core Processor: ARM920T
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 200MHz
  • Co-Processors/DSP: -
  • RAM Controllers: SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: LCD, Touch Panel
  • Ethernet: -
  • SATA: -
  • USB: USB 1.x (1)
  • Voltage - I/O: 1.8V, 3.0V
  • Operating Temperature: -30°C ~ 70°C (TA)
  • Security Features: -
  • Package / Case: 256-MAPBGA
  • Supplier Device Package: -
pacote: 256-MAPBGA
Estoque6.304
1 Core, 32-Bit
200MHz
-
SDRAM
No
LCD, Touch Panel
-
-
USB 1.x (1)
1.8V, 3.0V
-30°C ~ 70°C (TA)
-
256-MAPBGA
-
hot P1011NXE2HFB
NXP

IC MPU Q OR IQ 800MHZ 689TEBGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: Security; SEC 3.3
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 689-BBGA Exposed Pad
  • Supplier Device Package: 689-TEPBGA II (31x31)
pacote: 689-BBGA Exposed Pad
Estoque6.064
1 Core, 32-Bit
800MHz
Security; SEC 3.3
DDR2, DDR3
No
-
10/100/1000 Mbps (3)
-
USB 2.0 + PHY (2)
-
-40°C ~ 105°C (TA)
Cryptography, Random Number Generator
689-BBGA Exposed Pad
689-TEPBGA II (31x31)
OMAPL137DZKBT3
Texas Instruments

IC MPU OMAP-L1X 375MHZ 256BGA

  • Core Processor: ARM926EJ-S
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 375MHz
  • Co-Processors/DSP: Signal Processing; C674x, System Control; CP15
  • RAM Controllers: SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: LCD
  • Ethernet: 10/100 Mbps (1)
  • SATA: -
  • USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1)
  • Voltage - I/O: 1.8V, 3.3V
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Security Features: -
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-BGA (17x17)
pacote: 256-BGA
Estoque18.876
1 Core, 32-Bit
375MHz
Signal Processing; C674x, System Control; CP15
SDRAM
No
LCD
10/100 Mbps (1)
-
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
1.8V, 3.3V
-40°C ~ 125°C (TJ)
-
256-BGA
256-BGA (17x17)
hot MPC5200VR400B
NXP

IC MPU MPC52XX 400MHZ 272BGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 400MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (1)
  • SATA: -
  • USB: USB 1.1 (2)
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: -
  • Package / Case: 272-BBGA
  • Supplier Device Package: 272-PBGA (27x27)
pacote: 272-BBGA
Estoque6.448
1 Core, 32-Bit
400MHz
-
DDR, SDRAM
No
-
10/100 Mbps (1)
-
USB 1.1 (2)
2.5V, 3.3V
0°C ~ 70°C (TA)
-
272-BBGA
272-PBGA (27x27)
T1014NXE7KQA
NXP

QORIQ 1XCPU 64-BIT PWR ARCH 1.

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
pacote: -
Estoque5.520
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R8A77440HA02BG#UA
Renesas Electronics America

SOC RZ/G1N DUAL CORE A15 SGX544M

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
pacote: -
Estoque3.840
-
-
-
-
-
-
-
-
-
-
-
-
-
-
LS1012AXN7KKB
NXP

LS1012A XT 1GHZ RV2

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
pacote: -
Estoque7.056
-
-
-
-
-
-
-
-
-
-
-
-
-
-
MIMX8QX1AVLFZAC
NXP

I.MX 8QUADXPLUS 21X21

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
pacote: -
Request a Quote
-
-
-
-
-
-
-
-
-
-
-
-
-
-
RH80535GC0211M
Intel

IC MPU INTEL PENT 1.5GHZ 478PPGA

  • Core Processor: Intel® Pentium® M
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.5GHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 956mV, 1.484V
  • Operating Temperature: 100°C (TJ)
  • Security Features: -
  • Package / Case: 478-PGA
  • Supplier Device Package: 478-PPGA (35x35)
pacote: -
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1 Core, 32-Bit
1.5GHz
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956mV, 1.484V
100°C (TJ)
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478-PGA
478-PPGA (35x35)
STM32MP151FAC1
STMicroelectronics

IC MPU STM32MP1 800MHZ 361TFBGA

  • Core Processor: ARM® Cortex®-A7
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 209MHz, 800MHz
  • Co-Processors/DSP: ARM® Cortex®-M4
  • RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: HDMI-CEC, LCD
  • Ethernet: 10/100Mbps, GbE
  • SATA: -
  • USB: USB 2.0 (2), USB 2.0 OTG+ PHY (3)
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: -20°C ~ 105°C (TJ)
  • Security Features: ARM TZ
  • Package / Case: 361-TFBGA
  • Supplier Device Package: 361-TFBGA (12x12)
pacote: -
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1 Core, 32-Bit
209MHz, 800MHz
ARM® Cortex®-M4
DDR3, DDR3L, LPDDR2, LPDDR3
Yes
HDMI-CEC, LCD
10/100Mbps, GbE
-
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
2.5V, 3.3V
-20°C ~ 105°C (TJ)
ARM TZ
361-TFBGA
361-TFBGA (12x12)
MQ80960MC-25-B-SPECIAL
Rochester Electronics, LLC

MQ80960MC-25/B-SPECIAL

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
pacote: -
Request a Quote
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R9A07G044C22GBG-AC0
Renesas Electronics Corporation

IC MPU 1.2GHZ 361BGA

  • Core Processor: ARM® Cortex®-A55
  • Number of Cores/Bus Width: 3 Core, 64-Bit
  • Speed: 1.2GHz
  • Co-Processors/DSP: ARM® Cortex®-M4, ARM® Mali-G31
  • RAM Controllers: DDR3L, DDR4
  • Graphics Acceleration: No
  • Display & Interface Controllers: MIPI/CSI, MIPI/DSI
  • Ethernet: 10/100/1000Mbps (2)
  • SATA: -
  • USB: USB 2.0 (2)
  • Voltage - I/O: 1.8V, 3.3V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG
  • Package / Case: 361-BGA
  • Supplier Device Package: 361-BGA (13x13)
pacote: -
Estoque585
3 Core, 64-Bit
1.2GHz
ARM® Cortex®-M4, ARM® Mali-G31
DDR3L, DDR4
No
MIPI/CSI, MIPI/DSI
10/100/1000Mbps (2)
-
USB 2.0 (2)
1.8V, 3.3V
-40°C ~ 85°C (TA)
AES, RSA, SHA-1, SHA-224, SHA-256, TRNG
361-BGA
361-BGA (13x13)
MIMX8MN6DVTJZAA
NXP

IC MPU I.MX8MN 1.5GHZ 486LFBGA

  • Core Processor: ARM® Cortex®-A53
  • Number of Cores/Bus Width: 4 Core, 64-Bit
  • Speed: 1.5GHz
  • Co-Processors/DSP: ARM® Cortex®-M7
  • RAM Controllers: DDR3L, DDR4, LPDDR4
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
  • Ethernet: GbE
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 95°C (TJ)
  • Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
  • Package / Case: 486-LFBGA, FCBGA
  • Supplier Device Package: 486-LFBGA (14x14)
pacote: -
Estoque2.988
4 Core, 64-Bit
1.5GHz
ARM® Cortex®-M7
DDR3L, DDR4, LPDDR4
Yes
LCD, MIPI-CSI, MIPI-DSI
GbE
-
USB 2.0 + PHY (2)
-
0°C ~ 95°C (TJ)
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
486-LFBGA, FCBGA
486-LFBGA (14x14)
MG80960MC-25
Rochester Electronics, LLC

RISC MICROPROCESSOR, 32 BIT, 25M

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
pacote: -
Request a Quote
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