Imagem |
Nº de peças |
Fabricante |
Descrição |
pacote |
Estoque |
Quantidade |
Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Preci-Dip |
BGA SOLDER TAIL
|
pacote: - |
Estoque6.246 |
|
432 (31 x 31) | 0.050" (1.27mm) | Gold | 10µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
||
Preci-Dip |
BGA SOLDER TAIL
|
pacote: - |
Estoque6.228 |
|
420 (26 x 26) | 0.050" (1.27mm) | Gold | 10µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
||
Preci-Dip |
CONN SOCKET PGA 321POS GOLD
|
pacote: - |
Estoque8.118 |
|
321 (19 x 19) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 64POS GOLD
|
pacote: - |
Estoque8.802 |
|
64 (2 x 32) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 36POS GOLD
|
pacote: - |
Estoque6.354 |
|
36 (2 x 18) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
Aries Electronics |
CONN SOCKET SIP 29POS TIN
|
pacote: - |
Estoque8.136 |
|
29 (1 x 29) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN SOCKET SIP 27POS GOLD
|
pacote: - |
Estoque3.582 |
|
27 (1 x 27) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
||
Preci-Dip |
CONN SOCKET PGA 182POS GOLD
|
pacote: - |
Estoque6.876 |
|
182 (18 x 18) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 18POS GOLD
|
pacote: - |
Estoque4.032 |
|
18 (2 x 9) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 20POS GOLD
|
pacote: - |
Estoque3.402 |
|
20 (2 x 10) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 32POS GOLD
|
pacote: - |
Estoque2.394 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
||
Preci-Dip |
CONN SOCKET PGA 209POS GOLD
|
pacote: - |
Estoque3.436 |
|
209 (17 x 17) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 48POS GOLD
|
pacote: - |
Estoque4.500 |
|
48 (2 x 24) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET 14POS GOLD
|
pacote: - |
Estoque7.110 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
CONN SOCKET SIP 8POS TIN
|
pacote: - |
Estoque7.416 |
|
8 (1 x 8) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Preci-Dip |
CONN IC DIP SOCKET 50POS GOLD
|
pacote: - |
Estoque2.844 |
|
50 (2 x 25) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Preci-Dip |
CONN SOCKET PGA 107POS GOLD
|
pacote: - |
Estoque6.480 |
|
107 (12 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 16POS GOLD
|
pacote: - |
Estoque5.202 |
|
16 (2 x 8) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Preci-Dip |
CONN IC DIP SOCKET 50POS GOLD
|
pacote: - |
Estoque6.624 |
|
50 (2 x 25) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Preci-Dip |
CONN IC DIP SOCKET 36POS GOLD
|
pacote: - |
Estoque5.346 |
|
36 (2 x 18) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Keystone Electronics |
CONN TRANSIST TO-3 3POS TIN
|
pacote: - |
Estoque2.034 |
|
3 (Rectangular) | - | Tin | - | Brass | Chassis Mount | Closed Frame | Solder | - | Tin | - | Brass | Polyester, Glass Filled | - |
||
Preci-Dip |
CONN IC DIP SOCKET 28POS GOLD
|
pacote: - |
Estoque3.490 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Keystone Electronics |
CONN TRANSIST TO-3 3POS TIN
|
pacote: - |
Estoque5.904 |
|
3 (Oval) | - | Tin | - | Brass | Chassis Mount | Closed Frame | Solder | - | Tin | - | Brass | Polyester, Glass Filled | - |
||
Aries Electronics |
CONN SOCKET SIP 5POS GOLD
|
pacote: - |
Estoque7.254 |
|
5 (1 x 5) | - | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle | - | Solder | - | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Preci-Dip |
CONN IC DIP SOCKET 24POS GOLD
|
pacote: - |
Estoque6.246 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Preci-Dip |
CONN IC DIP SOCKET 8POS GOLD
|
pacote: - |
Estoque3.276 |
|
8 (2 x 4) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
STANDARD WIRE WRAP DIP SOCKET
|
pacote: - |
Estoque12.084 |
|
20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
Assmann WSW Components |
CONN IC DIP SOCKET 24POS GOLD
|
pacote: - |
Estoque7.776 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |